尹春燕 - 东南大学 - 微电子学院

个人简介

工作经历： 2019.10-至今，东南大学，副教授； 2013.09-2019.08，英国格林威治大学，讲师（Lecturer）； 2007.01-2013.08，英国格林威治大学，研究员（Research Fellow）； 2001.10-2002.08，香港城市大学，研究助理（Research Assistant）。教育经历： 2002.09-2006.10，英国格林威治大学，博士； 1999.09-2001.07，哈尔滨工业大学，硕士； 1995.09-1999.07，哈尔滨工业大学，本科。【研究成果】发表SCI和EI文章30余篇，其中第一作者17篇，受邀在第18届国际电子封装会议（ICEPT）做分会场特邀报告，第2届国际电子系统集成会议（ESTC）分会场主席。

研究领域

高可靠性应用领域电子封装材料、方法及可靠性；基于失效物理的可靠性分析及建模；电子系统故障预测和健康管理。

近期论文

查看导师新发文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

C.Y. Yin, S. Stoyanov, C. Bailey and P. Stewart, “Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications”, IEEE Transactions on Components, Packaging and Manufacturing, 2019, 9(11): 2210-2218 F. Dinmohammadi, D. Flynn, C. Bailey, M. Pecht, C.Y. Yin, P. Rajaguru and V. Robu, “Predicting Damage and Life Expectancy of Subsea Power Cables in offshore Renewable Energy Applications”, IEEE Access, Vol.7, 2019，pp. 54658-54669 K. C. Nwanoro, H. Lu, C.Y. Yin and C. Bailey, “An Analysis of the Reliability and Design Optimization of Aluminum Ribbon Bonds in Power Electronics Modulus using Computer Simulation Method”, Microelectronics Reliability, Vol.87, Issue 2, 2018, pp. 1-14. C.Y. Yin, C. Best, C. Bailey and S. Stoyanov, “Statistical Analysis of the Impact of Refinishing Process on Leaded Components”, Microelectronics Reliability, 2015, 55: 424-431 M. Musallam, C.Y. Yin, C. Bailey and C.M. Johnson, “Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics”, IEEE Transactions on Power Electronics, 2015, 30(5): 2601-2613 M. Musallam, C.Y. Yin, C. Bailey, C.M. Johnson, “Application of Coupled Electro-thermal and Physics-of-failure-based Analysis to the Design of Accelerated Life Tests for Power Modules”, Microelectronics Reliability, 2014, 54: 172-181 C.Y. Yin, H. Lu, M. Musallam, C. Bailey and C.M. Johnson, “Prognostic Reliability Analysis of Power Electronics Modules” International Journal of Performability Engineering, 2010, 6: 513-524 H. Lu, C. Bailey, C.Y. Yin, “Design for Reliability of Power Electronics Modules”，Microelectronics Reliability, 2009, 49: 1250-1255 C.Y. Yin, H. Lu, C. Bailey and Y.C. Chan, “Macro-Micro Modelling Analysis for an ACF Flip Chip”, Soldering & Surface Mount Technology, 2006, 18(2): 27-32 C.Y. Yin, H. Lu, C. Bailey and Y.C. Chan, “The Effect of Reflow Process on the Contact Resistance and Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications”, Microelectronics Reliability, 2003, 43: 625-633