个人简介

學歷：美國加州大學洛杉磯分校材料工程博士 經歷 國立清華大學工程與系統科學系副教授 （2014/08 - ） 國立清華大學工程與系統科學系助理教授 （2010/09 - 2014/08） Quality and reliability engineer, Portland technology development center, Intel Corporation, Oregon, USA （2007/12 - 2010/08） Electronic Packaging Failure Analysis Internship, Intel Corporation, Chandler, Arizona, USA（2007/06 - 2007/09） 主要教授課程 材料科學導論、電子薄膜科技、材料機械性質

研究领域

電子材料，薄膜製程與分析，固態擴散與界面反應

● Microelectronic materials and processing 微電子材料與製程 ● Thin film deposition and characterization 薄膜製程與分析 ● Mass transport (diffusion) and interfacial reaction 固態擴散與界面反應 ● Electromigration, Thermomigration, and Stress migration 電遷移、熱遷移、應力遷移效應 ● Pb-free solders and Cu interconnect 無鉛銲錫與銅內接線路 本實驗室的研究將會專注於微電子覆晶封裝與三維立體封裝(3D IC)技術中的擴散驅動的材料科學研究，目前研究題目包含無鉛銲料材料受到電流(電遷移),溫度梯度(熱遷移)及應力梯度(應力遷移)下的擴散行為、材料微結構變化、及界面化學反應之探討，進而研究其破壞模式與動力學分析。此外，本實驗室研究也包含奈米銅薄膜的鍍著，性質與微結構變化研究及對半導體產業的可靠度影響。實驗室成員將從研究中了解且學習到電子封裝之基本概念及在半導體產業之應用,微電子材料與製程方法,及材料分析技術等，歡迎有興趣的同學加入我們的行列 !!

近期论文

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1. Fan-Yi Ouyang*, K. N. Tu, Yi-Shao Lai, and Andriy M. Gusak, “Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration.” Appl. Phys. Lett., 89, 221906 (2006). 2. Fan-Yi Ouyang*, Kai Chen, K. N. Tu, and Yi-Shao Lai, "Effect of current crowding on whisker growth at the anode in flip chip solder joints," Appl Phys. Lett., 91, 231919 (2007). 3. Fan-Yi Ouyang*, K. N. Tu, Chin-Li Kao, and Yi-Shao Lai, “Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints,” Appl. Phys. Lett., 90, 211914 (2007). 4. Jia-Hong Huang*, Fan-Yi Ouyang, G. P. Yu, “Effect of film thickness and Ti interlayer on the structure and properties of nanocrystalline TiN thin film on AISI D2 steel.”,Surface and Coatings Technology, 201, 7043 (2007). 5. Matt Pharr, Kejie Zhao, Zhigang Suo*, Fan-Yi Ouyang and Pilin Liu. Concurrent electromigration and creep in lead-free solder. Journal of Applied Physics 110, 083716 (2011). 6. Fan-Yi Ouyang*, and C.-L. Kao, “In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints”, J. Appl. Phys., 110, 123525 (2011) 7. Fan-Yi Ouyang*, Hao Hsu, Yu-ping Su and Tao-Chih Chang, “Electromigration induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging”, J. Appl. Phys., 110, 123525 (2012) 8. Fan-Yi Ouyang*, K.N. Tu and Yi-Shao Lai, “Effect of electromigration induced joule heating and strain on microstructural recrystallization in eutectic SnPb flip chip solder joints”, Materials Chemistry and physics, 136, 210 (2012) 9. Hsin-Fang Lee, Ji-Jung Kai, Pang-Chun Liu, Wei-Chen Chang, Fan-Yi Ouyang, and Hsiu-Ting Chan, “A comparative study of charge transport in quasi-solid state dye-sensitized solar cells using polymer or nanocomposite gel electrolytes”, Journal of Electroanalytical Chemistry 687 45–50 (2012) 10. Hsin-Fang Lee, Jhih-Lin Wu,Po-ya Hsu, Yung-Liang Tung, Fan-Yi Ouyang,and Ji-Jung Kai, “Enhanced photovoltaic performance and long-term stability of dye-sensitized solar cells by incorporating SiO2nanoparticles in a binary ionic liquid electrolyte ”, Thin solid films, In Press (2012) 11. Chih Chen*, Hsiang-Yao Hsiao, Yuan-Wei Chang, Fanyi Ouyang*, and K. N. Tu “Thermomigration in Solder Joint”, Materials Science & Engineering R, In Press (2012)