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J. W. Lee!, C. C. Hong*, H. W. Chen*, L. W. Ho*, J. G. Duh, and Y. C. Chan The influence of boron contents on the microstructure and mechanical properties of Cr–B–N thin films, Vacuum 87, 2013年
Y. C. Chan*, H. W. Chen*, P. S. Chao*, J. G. Duh!, and J. W. Lee Microstructure control in TiAlN/SiNx multilayers with appropriate thickness ratios for improvement of hardness and anti-corrosion characteristics, Vacuum 87 , 2013年
C. F. Tseng*, and J. G.Duh! The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction, Journal of Materials Science 48 , 2013年
C. Y. Ho*, and J. G. Duh! Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder, Materials Letters 92, 2013年
Y. C. Jin*, and J. G. Duh! Nanostructured LiNi0.5Mn1.5O4 cathode material synthesized by polymer-assisted co-precipitation method with improved rate capability, Materials Letters 93, 2013年
C. Y. Yu*, W. C. Lu, J. G. Duh, and S. O. Chen Study of the Zn occupancy leading to the stability improvement for Cu6Sn5 using a first-principles approach, Materials Letters 93, 2013年
C. Y. Ho*, J. G. Duh!, C. W. Lin, C. J. Lin, Y. H. Wu*, H. C. Hong, and T. H. Wang Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit, Journal of Materials Science 48, 2013年
T. K. Lee!, B. Zhou*, T. R. Bieker, C. F. Tseng*, and J. G. Duh The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance, Journal of Electronics Materials 42 , 2013年
C. Y. Chuang*, Y. C. Liao*, J. W. Lee!, C. L. Li*, J. P. Chu, and J. G. Duh Electrochemical characterization of Zr-based thin film metallic glass in hydrochloric aqueous solution, Thin Solid Film, 2013年
S. D. Li!, M. Liu*, W. Shao*, J. Xu, S. Chen, Z. Zhou*, T. Nan*, N. X. Sun, and J. G. Duh Large E-field tunability of microwave ferromagnetic properties in Fe50Co50-Hf/lead zinc niobate–lead titanate multiferroic laminates, Journal of Applied Physics, 2013年
S. D. Li!, H. Du*, Q. Xue*, S. Xie*, M. Liu*, W. Shao*, J. Xu, T. Nan*, N. X. Sun, and J. G. Duh Stress competition and vortex magnetic anisotropy in FeCoAlO high-frequency soft magnetic films with gradient Al-O contents, Journal of Applied Physics, 2013年
C. F. Tseng*, C. J. Lee*, and J. G. Duh! Roles of Cu in Pb-free Solders Jointed with Electroless Ni(P) Plating, Materials Science and Engineering A , 2013年
Y. H. Wu*, C. Y. Yu*, C. Y. Ho* and J. G. Duh! Retardation of (Cu, Ni)6Sn5 spalling in Sn-Ag-Cu/Ni solder joints via controlling the grain structure of Ni metallization layer, Materials Letters, 2013年
C. F. Tseng* and J. G. Duh! Correlation between Microstructure Evolution and Mechanical Strength in the Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint, Materials Science and Engineering A , 2013年
S. D. Li!, M. Liu*, J. Lou*, X. Xing*, J. P. Wu*, Y. Hu*, X. L. Cai*, F. Xu*, N. X. Sun, and J. G. Duh Microwave Frequency Performance and High Magnetic Anisotropy of Nanocrystalline Fe70Co30-B Films Prepared by Composition Gradient Sputtering, journal of nanoscience and nanotechnology, 2013年
S. D. Li!, M. Liu*, J. Lou*, X. Xing*, J. Qiu*, J. H. Lin*, Z. Y. Cai*, F. Hu*, N. X. Sun, and J. G. Duh Tunable Microwave Frequency Performance of Nanocomposite Co2MnSi/PZN-PT Magnetoelectric Coupling Structure, journal of nanoscience and nanotechnology, 2013年
P. S. Chen*, H. W. Chen*, J. G. Duh!, J. W. Lee, J.S.C. Jang Characterization of mechanical properties and adhesion of Ta–Zr–Cu–Al–Ag thin film metallic glasses, Surface & Coatings Technology, 2013年
S. F. Chen*, Y. C. Kuo*, C. J. Wang*, S. H. Huang*, J. W. Lee!, Y. C. Chan*, H. W. Chen*, J. G. Duh, T. E. Hsieh The effect of Cr/Zr chemical composition ratios on the mechanical properties of CrN/ZrN multilayered coatings deposited by cathodic arc deposition system, Surface & Coatings Technology, 2013年
C. Y. Tong*, J. W. Lee!, C. C. Kuo*, S. H. Huang*, Y. C. Chan*,H.W. Chen*, J.G. Duh Effects of carbon content on the microstructure and mechanical property of cathodic arc evaporation deposited CrCN thin films, Surface & Coatings Technology, 2013年
Y. C. Chan*, H. W. Chen*, Y. Z. Tsai*, J. G. Duh!, J. W. Lee Texture microstructure and anti-wear characteristics in isostructural CrAlSiN/W2N multilayer coatings, Thin Solid Films , 2013年
L. W. Ho*, J. W. Lee!, H. W. Chen*, Y. C. Chan*, J. G. Duh Structure and mechanical property evaluation of Cr–Ti–B–N coatings, Thin Solid Films , 2013年
Y.C. Chan*, H.W. Chen*, R.H. Wei, J.W. Lee, J.G. Duh ! Effects of Al and V additions on mechanical response in thick TiSiCN nanocomposites deposited using a plasma enhanced magnetron sputtering, Jpn. J. Appl. Phys, 2013年
H. M. Lin*, and J. G. Duh! Development of electroplated Ni–xZn films for under bump metallization application, Surface and Coatings Technology , 2013年
Shang-I Chung* and Jenq-Gong! Exploration of Surface Hydrophilic Properties on AISI 304 stainless steel and silicon wafer against aging after atmospheric pressure plasma treatment, Japanese Journal of Applied Physics, 2014年
Jia-Hong Chu*, Joseph Lee*, Chun-Chi Chang*, Yu-Chen Chan*, Ming-Li Liou*, Jyh-Wei Lee, Jason Shian-Ching Jang, Jenq-Gong Duh! Antimicrobial characteristics in Cu-containing Zr-based thin film metallic glass, Surface and Coatings Technology, 2014年
H. W. Chen*, K. C. Hsu*, Y. C. Chan*, J. G. Duh! J. W. Lee, Jason S. C. Jang, G. J. Chen, "Antimicrobial properties of Zr–Cu–Al–Ag thin film metallic glass, Thin Solid FilmsC4, 2014年
J. H. Chu*, H. W. Chen*, Y. C. Chan*, J. G. Duh!, J. W. Lee, Jason S. C. Jang Modification of structure and property in Zr-based thin film metallic glass via processing temperature control, Thin Solid Films, 2014年
Y. C. Chan* , H. W. Chen*, J. G. Duh!, J. W. Lee Texture, microstructure and tribological behavior in TiAlN/SiNx multilayers, Int. J. Appl. Ceram. Technol., 2014年
C. Y. Yu*, W. Y. Chen*, and J. G. Duh! Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testing, Journal of Alloys and Compounds, 586, (2014) 633-638, 2014年
C. Y. Yu*, Joseph Lee*, W. L. Chen*, and J. G. Duh! Enhancement of the impact toughness in Sn-Ag-Cu/Cu solder joints via modifying the microstructure of solder alloy, Materials Letters 119 (2014) 20–23, 2014年
W. Y. Chen*, C. Y. Yang*, and J. G. Duh! Improving the shear strength of Sn-Ag-Cu-Ni/Cu-Zn solder joints via modifying the microstructure and phase stability of Cu-Sn intermetallic compounds, Intermetallics, 54 (2014) 181–186, 2014年
C.Y. Ho*, M.T. Tsai*, J. G. Duh!, and J.W. Lee, Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies, Journal of Alloys and Compounds, 600, (2014) 199-203., 2014年
C. Y. Ho* and J.G. Duh! Optimal Ni(P) Thickness Design in Ultrathin-ENEPIG Metallization for Soldering: Concerning Electrical Impedance and Mechanical Bonding Strength, Materials Science and Engineering A 611 (2014) 162-169, 2014年
C. F. Tseng*, C. Y. Ho*, J. Lee*, and J. G. Duh! Crystallographic characterization and growth behavior of (Cu,Ni,Pd)6Sn5 intermetallic compound in Ni(P)/Pd/Au/SnAgCu/Cu assembled solder joint, Journal of Alloys and Compounds, 2014年
C. Y. Ho* and J. G. Duh! Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of the Cu-Sn intermetallic compounds in soldering reaction, Materials Chemistry and Physics 148 (2014) 21-27, 2014年
Wen-Lin Chen*, Chi-Yang Yu*, Cheng-Ying Ho* and Jenq-Gong Duh! Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints, Materials Science and Engineering A 613(8) (2014) 193–200, 2014年
Wei-Yu Chen*, Wei Tu* , Hsiang-Ching Chang* , Tzu-Ting Choua* and Jenq-Gong Duh! Growth orientation of Cu-Sn IMC in Cu/Sn-3.5Ag/Cu-xZn microbumps and Zn-doped solder joints, Materials letters 134 (2014) 184-186, 2014年
Yi-Chun Jin*, Jenq-Gong Duh! Feasible Nonaqueous Route to Synthesize High-Voltage Spinel Cathode Material for Lithium Ion Battery, RSC Adv., 2015,5, 6919-6924, 2015年
Wei-Yu Chen*, Tzu-Ting Chou*, Wei Tu* , Hsiang-Ching Chang,* Christine Jill Lee* and Jenq-Gong Duh! Retarding the Cu–Sn and Ag–Sn intermetallic compounds by applying Cu–xZn alloy on micro-bump in novel 3D-IC technologies, Journal of Materials Science: Materials in Electronics, 2015年
Chun-Kai Lan*, Shang-I Chuang*, Qi Bao*, Yen-Ting Liao* and Jenq-Gong Duh! One-Step Argon/Nitrogen Binary Plasma Jet Irradiation of Li4Ti5O12 for Stable High-Rate Lithium Ion Battery Anodes 2015年
Yao-Hui Huang*, Qi Bao*, Bing-Hong Chen*, and Jenq-Gong Duh! Nano-to-Microdesign of Marimo-Like Carbon Nanotubes Supported Frameworks via In-spaced Polymerization for High Performance Silicon Lithium Ion Battery Anodes 2015年
Qi Bao*, Yao-Hui Huang*, Chun-Kai Lan*, Bing-Hong Chen* and Jenq-Gong Duh! Scalable Upcycling Silicon from Waste Slicing Sludge for High-performance Lithium-ion Battery Anodes 2015年
Yao-Hui Huang*, Chih-Tse Chang*, Qi Bao*, Jenq-Gong Duh! and Yu-Lun Chueh Heading towards Novel Superior Silicon-based Lithium-ion Batteries: Ultrasmall Nanoclusters Top-down Dispersed over Synthetic Graphite Flakes as Binary Hybrid Anode 2015年
Bing-Hong Chen*, Shang-I Chuang*, Wei-Ren Liu!, and Jenq-Gong Duh! A Revival of Waste: Atmospheric Pressure Nitrogen Plasma Jet Enhanced Jumbo Silicon/Silicon Carbide Composite in Lithium Ion Batteries 2015年
Chun-Kai Lan*, Chun-Chi Chang*, Cheng-Yu Wu*, Bing-Hong Chen* and Jenq-Gong Duh! Improvement of the Ar/N2 binary plasma-treated carbon passivation layer deposited on Li4Ti5O12 electrodes for stable high-rate lithium ion battery 2015年
Hao Yang*, Chun-Kai Lan*, and Jenq-Gong Duh! The Power of Nb-substituted TiO2 in Li-ion Batteries: Morphology Transformation Induced by High Concentration Substitution 2015年
Wei-Yu Chou*, Yi-Chun Jin*, Jenq-Gong Duh!, Cheng-Zhang Lu, Shih-Chieh Liao A facile approach to derive binder protective film on high voltagespinel cathode materials against high temperature degradation 2015年
Hsiu-Min Lin*, Cheng-Ying Ho*, Wen-Lin Chen*, Yi-Hsin Wu*, De-Hui Wang*, Jun-Ren Lin*, Yu-Hui Wu*, Huei-Cheng Hong*, Zhi-Wei Lin*, Jenq-Gong Duh! Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test 2015年
Christine Jill Lee*, Wei-Yu Chen*, Tzu-Ting Chou*, Tae-Kyu Lee*, Yew-Chung Wu, Tao-Chih Chang and Jenq-Gong Duh! The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test 2015年
Chun-Chi Chang*, Hsien-Wei Chen*, Jyh-Wei Lee, Jenq-Gong Duh! Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment 2015年
Joseph Lee*, Kuo-Hua Huang*, Kai-Chieh Hsu*, Huan-Chien Tung*, Jyh-Wei Lee and Jenq-Gong Duh! Applying Composition Control to Improve the Mechanical and Thermal Properties of Zr-Cu-Ni-Al Thin Film Metallic Glass by Magnetron DC Sputtering 2015年
Joseph Lee*, Huan-Chien Tung*, and Jenq-gong Duh! Enhancement of Mechanical and Thermal Properties in Zr-Cu-NI-Al-N Thin Film Metallic Glass by Compositional Control of Nitrogen 2015年
Chun-Chi Chang*, Hsien-Wei Chen*, Jyh-Wei Lee and Jenq-Gong Duh! Influence of Si contents on tribological characteristics of CrAlSiN nanocomposite coatings 2015年
Kuo-Hua Huang*! and Jenq-Gong Duh Thermal Effect on Lifetime Evaluation of Adhesiveless Copper-Polyimide 2015年
Kuo-Hua Huang* and Jenq-Gong Duh! Fatigue Characterization for Flexible Circuit with Polyimide on Adhesiveless Copper 2015年
Jason Shian-Ching Jang!, Pei-Hua Tsai*, An-Zin Shiao*, Tsung-Hsiung Li*, Chih-Yu Chen*, Jinn Peter Chu!, Jenq-Gong Duh, Ming-Jen Chen, Shih-Hsin Chang, Wen-Chien Huang Enhanced Cutting Durability of Surgical Blade by Coating with Fe-based Metallic Glass Thin Film 2015年
Y. C. Chang*, S. N. Hsiao*!, S. H. Liu*, S. H. Su*, K. F. Chiu, W. C. Hsieh, S. K. Chen, Y. G. Lin!, H. Y. Lee, C. K. Sung and Jenq-Gong Duh! Effect of L12 Ordering in Antiferromagnetic Ir-Mn Epitaxial Layer on Exchange Bias of FePd Films 2015年
Chun-Chi Chang* and Jenq-Gong Duh! Duplex Coating Technique to Improve the Adhesion and Tribological Properties of CrAlSiN Nanocomposite Coating 2016年
Bing Hong Chen*, Shang I Chaung* and Jenq Gong Duh! Double-Plasma Enhanced Carbon Shield for Spatial/Interfacial Controlled Electrodes in Lithium Ion Batteries via Micro-Sized Silicon from Wafer Waste 2016年
Ching Yu Yang*, Yu Hsiang Lo*, Chang Liu*, Hsin-Ming Cheng, Jenq-Gong Duh and Po-Yu Chen! Rapid Deposition of Superhydrophilic Stalagmite-like Protrusions for Underwater Selective Superwettability 2016年
Qi Bao*!, Kwan San Hui*! and Jeng-Gong Duh Promoting catalytic ozonation of phenol over graphene through nitrogenation and Co3O4 compositing 2016年
Cheng-Yu Wu*, Chun-Chi Chang* and Jenq Gong Duh! Silicon nitride coated silicon thin film on three dimensions current collector for lithium ion battery anode 2016年
Yao-Hui Huang*, Qi Bao*, Jenq-Gong Duh! and Chih-Tse Chang* Top-down Dispersion Meets Bottom-up Synthesis: Merging Ultranano Silicon and Graphene Nanosheets for Superior Hybrid Anodes in Lithium-ion Batteries 2016年
Hao Yang* and Jenq-Gong Duh! Aqueous sol-gel synthesized anatase TiO2 nanoplates with high-rate capabilities for Lithium-ion and Sodium-ion battery 2016年
Chun-Kai Lan*, Qi Bao*, Yao-Hui Huang* and Jenq-Gong Duh! Embedding Nano-Li4Ti5O12 in Hierarchical Porous Carbon Matrixes Derived from Water Soluble Polymers for Ultra-fast Lithium Ion Batteries Anodic Materials 2016年
Yin Wang*, Jyh-Wei Lee and Jenq-Gong Duh! Mechanical strengthening in self-lubricating CrAlN/VN multilayer coatings for improved high-temperature tribological characteristics 2016年
Ching-Yu Yang*, Shang-I Chuang*, Yu-Hsiang Lo*, Hsin-Ming Cheng, Jenq-Gong Duh and Po-Yu Chen! Stalagmite-like Self-cleaning Surfaces Prepared by Silanization of Plasma-assisted Metal-oxide Nanostructures 2016年
Yi-Chun Jin* and Jenq-Gong Duh! Fluorination Induced the Surface Segregation of High Voltage Spinel on Lithium-Rich Layered Cathodes for Enhanced Rate Capability in Lithium Ion Batteries 2016年
Yan Wang*, Hao Yang*, Cheng-Yu Wu* and Jenq-Gong Duh! Facile and controllable one-pot synthesis of nickel-doped LiMn0.8Fe0.2PO4 nanosheets as high performance cathode materials for lithium-ion batteries 2017年
Bih-Show Lou, Yi-Yuan Lin, Chuan-Ming Tseng, Yu-Chu Lu*, Jenq-Gong Duh, and Jyh-Wei Lee! Plasma electrolytic oxidation coatings on AZ31 magnesium alloys with Si3N4 nanoparticle additives 2017年
Chi-Yu Lu*, Wahyu Diyatmika*, Bih-Show Lou, Yu-Chu Lu*, Jenq-Gong Duh and Jyh-Wei Lee! Influences of target poisoning on the mechanical properties of TiCrBN thin films grown by a superimposed high power impulse and medium frequency magnetron sputtering 2017年
Qi Bao*!, Joseph Lee*, and Jenq-Gong Duh Building 3D Porous, Elastic and Hydrophilic Current Collectors: Prolonging the Cycling Life of Si Based Anode for Lithium Ion Batteries 2017年
Joseph Lee* and Jenq-Gong Duh! Structural evolution of Zr-Cu-Ni-Al-N thin film metallic glass and its diffusion barrier performance in Cu-Si interconnect at elevated temperature 2017年
Wei-Yu Chen*, Rui-Wen Song* and Jenq-Gong Duh! Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC Technologies 2017年
Yi-Chun Jin* and Jenq-Gong Duh! Kinetic Study of High Voltage Spinel Cathode Material in a Wide Temperature Range for Lithium Ion Battery 2017年
Joseph Lee*, Ming-Li Liou and Jenq-Gong Duh! The Development of a Zr-Cu-Al-Ag-N Thin Film Metallic Glass Coating in Pursuit of Improved Mechanical, Corrosion, and Antimicrobial Property for Bio-medical Application 2017年
Collin Fleshman*, Wei-Yu Chen*, Tzu-Ting Chou*, Jia-Hong Huang and Jenq-Gong Duh! The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint 2017年
Bing-Hong Chen*, Chun-Chi Chang* and Jenq-Gong Duh! Carbon Assisted Technique for Recycled Silicon/Silicon Carbide Composite in Lithium Ion Batteries 2017年
Wei-Ting Wong*, Bing-Hong Chen*, Irish Valerie B. Maggay*, Chang Liu*, Jenq-Gong Duh and Wei-Ren Liu! Synthesis and Electrochemical Properties of Hierarchically Porous Zn(Co1-xMnx)2O4 Anode for Li-Ion Batteries via Cation Substitution Design 2017年
Chun-Chi Chang* and Jenq-Gong Duh! Duplex Coating Technique to Improve the Adhesion and Tribological Properties of CrAlSiN Nanocomposite Coating 2017年
Wei-Yu Chen* and Jenq-Gong Duh! Suppression of Cu3Sn layer and formation of multi-orientation IMCs during thermal aging in Cu/Sn-3.5Ag/Cu-15Zn transient liquid-phase bonding in novel 3D-IC Technologies 2017年
Yi-Chun Jin* and Jenq-Gong Duh! Hierarchically-Structured Nanocrystalline Lithium Rich Layered Composites with Enhanced Rate Performances for Lithium Ion Battery 2017年
Pei-Hung Kuo*, Joseph Lee*, and Jenq-Gong Duh! Ultra-thin metallic glass film of Zr–Cu–Ni–Al–N as diffusion barrier for Cu–Si interconnects under fully recrystallized temperature 2018年
Hao Yang*, Yan Wang*, and Jenq-Gong Duh! Developing a Diamine-Assisted Polymerization Method To Synthesize Nano-LiMnPO4 with N-Doped Carbon from Polyamides for High-Performance Li-Ion Batteries 2018年
Cheng-Yu Wu*, Wei-En Chang*, Yu-Guang Sun*, Jyh-Ming Wu and Jenq-GongDuh! Three-dimensional S-MoS2@α Fe2O3 nanoparticles composites as lithium-ion battery anodes for enhanced electrochemical performance 2018年
Guan-Ting Ye*, Po-Yu Chen and Jenq-Gong Duh! Investigation of electrochemical properties of bio-inspired SiOx/PI multilayered thin film anode for lithium ion batteries 2018年
Heng Tao*, M.T. Tsai*, Hsien-Wei Chen*, J.C. Huang and Jenq-Gong Duh! Improving high-temperature tribological characteristics on nanocomposite CrAlSiN coating by Mo doping 2018年
Wan-Ting Tsou*, Cheng-Yu Wu*, Hao Yang*, Jenq-Gong Duh! Improving the electrochemical performance of Lithium–Sulfur batteries using an Nb-Doped TiO2 additive layer for the chemisorption of lithium polysulfides 2018年
Yan Wang*, Cheng-Yu Wu*, Hao Yang* and Jenq-Gong Duh! Rational design of a synthetic strategy, carburizing approach and pore-forming pattern to unlock the cycle reversibility and rate capability of microagglomerated LiMn0.8Fe0.2PO4 cathode materials 2018年
Che-Ya Wu*, Hao Yang*, Cheng-Yu Wu*, Jenq-Gong Duh! Flower-like structure of SnS with N-doped carbon via polymer additive for lithium-ion battery and sodium-ion battery 2018年
Yu-Chu Lu*, Hsien-Wei Chen*, Chun-Chi Chang, Cheng-Yu Wu*, Jenq-Gong Duh! Tribological properties of nanocomposite Cr-Mo-Si-N coatings at elevated temperature through silicon content modification 2018年
Collin Fleshman*, Jenq-Gong Duh! The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging 2019年
Rui-Wen Song*, Collin Jordon Fleshman*, Hao-Chen*, Su-Yueh Tsai, Jenq-Gong Duh! Suppressing interfacial voids in Cu/In/Cu microbump with Sn and Cu addition 2019年
Hao Chen*, Tzu-Ting Chou*, Collin Jordan Fleshman*, Jenq-Gong Duh! Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints 2019年
Tzu-Ting Chou*, Rui-Wen Song*, Hao Chen*, Jenq-Gong Duh! Low thermal budget bonding for 3D-package by collapse-free hybrid solder 2019年
Rui-Wen Song*, Tzu-Ting Chou*, Collin Jordan Fleshman*, Hao Chen* and Jenq-Gong Duh! The Architecture Design and Novel Material Selection for Improved Reliability of Solder Interconnections in Microelectronic Packaging 2019年
Chang Liu*, Bing-Hong Chen*, Wei-Ren Liu, Jenq-Gong Duh! Synthesis and theoretical calculations of N-doped ZnCo2O4 anode for lithium-ion anode via gradient pressure-induced processes and theoretical calculations 2019年
Cheng-Yu Wu*, Qi Bao*, Yen Chung Lai, Xin Liu*, Yu-Chu Lu* Heng Tao* and Jenq-Gong Duh! In-situ thermal annealing Pt/Ti interphase layers for epitaxial growth of improved Li(Ni0.5Mn0.3Co0.2)O2 solid thin-film cathodes 2019年
Ren-Chin Chen*, Li-Yin Hsiao*, Cheng-Yu Wu*, Jenq-Gong Duh! Facile synthesizing silicon waste/carbon composites via rapid thermal process for lithium-ion battery anode 2019年
Hou Heng Lin*, Hao Yang*, Che Ya Wu*, Sheng Yu Hsu* and Jenq-Gong Duh! Atmospheric Pressure Plasma Jet Irradiation of N Doped Carbon Decorated on Li4Ti5O12 Electrode as a High Rate Anode Material for Lithium Ion Batteries 2019年
Cheng-Yu Wu*, Jenq-Gong Duh! Ionic network for aqueous-polymer binders to enhance the electrochemical performance of Li-Ion batteries 2019年
Tzu-Ting Chou*, Collin Jordon Fleshman*, Hao Chen* and Jenq-Gong Duh! Improving thermal shock response of interfacial IMCs in Sn–Ag–Cu joints by using ultrathin-Ni/Pd/Au metallization in 3D-IC packages 2019年
Tzu-Ting Chou*, Rui-Wen Song*, Wei-Yu Chen*, and Jenq-Gong Duh! Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy 2019年
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