江國寧 - 台湾清华大学

当前位置： X-MOL首页 › 全球导师 › 国内导师 › 江國寧

江國寧講座教授收藏完善纠错
台湾清华大学工学院
登录后才能查看导师的联系方式，马上登录...

个人简介

學歷喬治亞理工學院美國機械工程博士 ~ 1989年經歷國立清華大學教授動力機械工程系 ~ 國家高速電腦中心組長應用與研究組 ~ 中華民國電腦輔助工程協會秘書長 ~ 工研院顧問南分院微系統技術中心 ~ 工研院組長電子所 ~ 優群科技股份有限公司獨立董事 ~ 美國機械工程師學會台灣分會秘書長 ~ 台灣國際微電子暨構裝學會理事長 ~ 國立清華大學特聘教授 ~ IEEE Transactions on Advanced Packaging Associate Editor, IEEE Transactions on Advanced Packaging 副編輯 ~ Journal of Mechanics 副編輯 ~ Journal of electronic package － ASME Transactions 副編輯 ~ IEEE Transactions on Components and Packaging Technologies 副編輯 ~ 中華民國力學學會理事長 2018年~ IEEE Transactions on Components, Packaging and Manufacturing Technology 資深領域主編 2018年~ Journal of Mechanics (SCI) 總主編 2014年~ IEEE Components, Packaging and Manufacturing Technology 總會理事 2014年~2016年俄羅斯國際工程院通訊院士(Foreign Member) 2013年 EEE Transactions on Components, Packaging and Manufacturing Technology 共同總主編 2012年~2018年 IEEE Senior Member 國立清華大學主任工學院先進封裝中心 ~ 美國MacNeal-Schwendler Co. (MSC/NASTRAN) 資深工程師 ~ 國家高速網路與計算中心主任 2010年~2013年美國機械工程師學會會士 (ASME Fellow) 2004年校內榮譽 2008 國立清華大學第3屆傑出產學合作獎清華大學 2002 清華大學工學院傑出教學獎清華大學校外榮譽 2015~2018 科技部傑出研究獎中華民國科技部 2012 中華民國力學學會第七屆會士中華民國力學學會 2012 IEEE Fellow 2011 99年度國科會傑出研究獎行政院國家科學委員會 2010~2013 國科會傑出研究獎行政院國家科學委員會 2009 過去2000-2009十年，Award for Excellent Contribution for ”Simulation and Modeling of Micro/Nanoelectronics and Systems” 2009 Significant Contribution Award for "Electronic Packaging Technology" from IEEE ICEPT2009 Conference 10th Anniversary of International Conference on Electronic Packaging Technology & High Density Packaging 2003~2006 國科會傑出研究獎行政院國家科學委員會最新研究主題 3D/Stack and Wafer Level Packaging Structure Design and Thermal Performance Assessment Through Silicon Via Technology Copper Low-K IC related applications High Density Packaging Design LED/Solar Cell Chip, Packaging Reliability and Thermal Dissipation Technology Silicon-Based Pressure Sensor Strained Silicon Non-linear and Temperature Dependent Finite Element Methods Impact/Crashworthness, Contact and Drop Test Thermo-Electromigration Computational Nano-Mechanics 教師_江國寧_科技部計劃 2014 潛變與應變率對先進封裝結構長期壽命之影響分析江國寧主持人 2014年08月 ~ 2015年07月科技部 2014 「CO2地質封存解密－卡爾邦尼亞大飯店」科普產學合作計畫江國寧主持人 2014年08月 ~ 2015年07月科技部 2013 多尺度模擬層狀石墨烯材料之熱與力學性質江國寧主持人 2013年08月 ~ 2014年07月國科會 2013 機械固力學門研究發展及推動小組江國寧主持人 2013年08月 ~ 2014年07月國科會 2013 LED封裝模組之加速光亮度老化理論、測試與驗證研究江國寧主持人 2013年08月 ~ 2014年07月國科會 2012 電力模組封裝結構之可靠度、散熱與電子遷移效應分析-3 江國寧主持人 2012年08月 ~ 2013年07月國科會 / 2012 溫度、應力與電子流共伴效應對晶片線路與封裝接點破壞模式影響研究-2 江國寧主持人 2012年08月 ~ 2013年07月國科會 / 2011 溫度、應力與電子流共伴效應對晶片路線與封裝接點破壞模式影響研究（1/3）江國寧主持人 2011年08月 ~ 2012年07月國科會 / 2011 電力模組封裝結構之可靠度、散熱與電子遷移效應分析（2/3）江國寧主持人 2011年08月 ~ 2012年07月國科會 / 2010 以矽穿孔接合式三維晶片極其封裝結構之散熱效能與長時可靠度分析（3/3）江國寧主持人 2010年08月 ~ 2011年07月國科會 / 2010 電力模組封裝結構之可靠度、散熱與電子遷移效應分析（1/3）江國寧主持人 2010年08月 ~ 2011年07月國科會 / 2009 微型堆疊式封裝結構之可靠度及散熱分析與設計（3/3）江國寧主持人 2009年08月 ~ 2010年07月國科會 / 2009 以矽穿孔接合式三維晶片極其封裝結構之散熱效能與長時可靠度分析（2/3）江國寧主持人 2009年08月 ~ 2010年07月國科會 / 2009 2009全國中學生力學競賽江國寧主持人 2009年01月 ~ 2009年12月國科會 / 2008 以矽穿孔接合式三維晶片極其封裝結構之散熱效能與長時可靠度分析（1/3）江國寧主持人 2008年08月 ~ 2009年07月國科會 / 2008 微型堆疊式封裝結構之可靠度及散熱分析與設計（2/3）江國寧主持人 2008年08月 ~ 2009年07月國科會 / 2007 使用低介電材質銅晶片之先進封裝結構的破壞機制分析研究(3/3) 江國寧主持人 2007年08月 ~ 2008年07月國科會 / 2007 微型堆疊式封裝結構之可靠度及散熱分析與設計（1/3）江國寧主持人 2007年08月 ~ 2008年07月國科會 / 2006 內含系統式晶圓級封裝之設計，製造與可靠度分析(3/3) 江國寧主持人 2006年08月 ~ 2007年07月國科會 / 2006 使用低介電材質銅晶片之先進封裝結構的破壞機制分析研究(2/3) 江國寧主持人 2006年08月 ~ 2007年07月國科會 / 2005 內含系統式晶圓級封裝之設計、製造與可靠度分析（2/3）江國寧主持人 2005年08月 ~ 2006年07月國科會 / 2005 使用低介電材質銅晶片之先進封裝結構的破壞機制分析研究（1/3）江國寧主持人 2005年08月 ~ 2006年07月國科會教師_江國寧_業界計劃 2010 LED複合基板結構設計與製程應力模擬分析江國寧主持人 2010年06月 ~ 2011年05月晶元光電股份有限公司 / 2010 以破壞力學理論及模擬分析法預估電力模組的接點可靠度研究江國寧主持人 2010年08月 ~ 2011年07月台達電子工業有限公司 / 2010 Simuiation,Validation and Reliability Assessment of FC-BGA 江國寧主持人 2010年09月 ~ 2011年08月台灣積體電路製造股份有限公司 / 2009 以破壞力學理論及模擬分析法預估電力模組的接點可靠度研究江國寧主持人 2009年03月 ~ 2010年02月台達電子工業股份有限公司 / 2009 製程殘餘應力分析模型的開發江國寧主持人 2009年08月 ~ 2010年07月工研院 / 2009 太陽電池接收器結構與可靠度封裝計數之模擬及分析江國寧主持人 2009年01月 ~ 2009年12月行政院原子能委員會核能研究所 / 2009 3DIC-SIP 介面可靠度分析與驗證江國寧主持人 2009年01月 ~ 2009年12月工研院 / 2009 LED晶片極限強度測試與最佳化設計江國寧主持人 2009年03月 ~ 2010年06月晶元光電股份有限公司 / 2009 3D-IC專利分析計畫江國寧主持人 2009年04月 ~ 2009年12月工研院 / 2009 MEMS麥克風封裝應變量測分析江國寧主持人 2009年12月 ~ 2010年12月工研院 / 2008 高倍率聚光型太陽電池封裝技術開發江國寧主持人 2008年01月 ~ 2008年12月行政院原子能委員會核能研究所 / 2008 Sip疊孔結構介面應變能釋放率之驗證與應用江國寧主持人 2008年01月 ~ 2008年12月工研院 / 2008 LED晶元多層膜界層破裂分析與最佳化設計計畫書江國寧主持人 2008年03月 ~ 2009年02月晶元光電股份有限公司 / 2008 新型可堆疊式系統級封裝技術之產品可靠度與散熱特性分析江國寧主持人 2008年03月 ~ 2009年02月育霈科技股份有限公司 / 2007 Low-K layer adhesive strength and crack behavior prediction using uncertainty analysis and statistic 江國寧主持人 2007年01月 ~ 2007年12月台積電 / 2007 聚光型太陽電池封裝技術研發江國寧主持人 2007年01月 ~ 2007年12月原子能委員會核能研究所 / 2007 Sip 疊孔Interconnects 介面破壞模型江國寧主持人 2007年01月 ~ 2007年12月工研院 / 2007 LED晶片之可靠度與最佳化設計計畫江國寧主持人 2007年01月 ~ 2007年12月晶元光電股份有限公司 / 2007 晶圓級系統晶片構裝掉落測試分析研究江國寧主持人 2007年08月 ~ 2008年07月育霈科技股份有限公司 / 2006 晶圓級多晶片模組散熱結構最佳化設計及可靠度分析江國寧主持人 2006年08月 ~ 2007年07月育霈科技股份有限公司 / 2006 新型可滑動之彎曲導線式晶圓級晶片尺寸構裝之可靠度分析-II 江國寧主持人 2006年03月 ~ 2006年12月育霈科技股份有限公司 / 2006 超低壓力之矽材微壓阻式壓力感測器之設計與分析江國寧主持人 2006年01月 ~ 2006年12月榮清計畫 / 2006 Investigation of the delamination and kinking behavior of staked low-k layers 江國寧主持人 2006年01月 ~ 2006年12月台灣積體電路製造股份有限公司 /

研究领域

1.微電子/微機電/光電封裝，MEMS/Electronic Packaging Design 2.電腦輔助工程，Computer Aided Engineering 3.奈米力學理論與模擬技術，Nano-Mechanics Theory and Simulation Technology 4.結構長時可靠度與散熱分析，Structure Long-term Reliability Assessment and Thermal Management

近期论文

查看导师新发文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

研討會論文 C.J. Huang, C.J. Wu, H.A. Teng, and K.N. Chiang, "Research on Multi-Scale Structural Analysis using the Atomistic-Continuum Equivalent Mechanics," CSWNST-8, Hong Kong, Dec. 19-22, 2010. S. Y. Syu, T. Y. Hung, C. J. Huang, H. J. Wang, H. L. Lee and K.N. Chiang, "Reliability Assessment of 3D Chip Stacking Package Using Metal Bonding and Through Silicon Via Technologies," ASME International Mechanical Engineering Congress & Exposition (IMECE), Vancouver, Canada, Nov. 12-18, 2010. C.J. Huang, C.J. Wu, H.A. Teng, and K.N. Chiang, "Carbon Nanotubes Structural Mechanics Using the Atomistic-Continuum Mechanics and Equivalent Methods," ACCM-7, Taipei, Taiwan, Nov. 15-18, 2010. S. Y. Yang, T. L. Chou, C. F. Huang, C. J. Wu, C. L. Hsu, and K. N. Chiang "Strength Determination of Light-emitting diodes and Chip Structure Design," IMPACT2010, Taipei, Taiwan, Oct 20-22, 2010. N. Y. Wang, S. Y. Chiang, T. L. Chou and K. N. Chiang, "Life Prediction of High Concentration Photovoltaic Modules Subjected to Thermal Cycling Test," IMPACT2010, Taipei, Taiwan, Oct. 20-22. S. Y. Yang, T. L. Chou, C. F. Huang, C. J. Wu, C. L. Hsu, and K. N. Chiang "Determination of Maximum Strength and Optimization of LED Chip Structure," ESTC2010, Berlin, Germany, Sep 14-16, 2010 Yen-Fu Su, Tuan-Yu Hung, Shin-Yueh Yang, and Kuo-Ning Chiang, "A Study on the Thermal Performance of a Chip-in-substrate-type LED Package Structure" ICSJ2010, Tokyo, Japan, August 24-26, 2010. Ning-Yuan Wang, Shih-Ying Chiang, Tsung-Lin Chou, Zun-Hao Shih, Hwen-Fen Hong and Kuo-Ning Chiang, "Transient Thermal Analysis of High-Concentration Photovoltaic Cell Module Subjected to Coupled Thermal and Power Cycling Test Conditions," Itherm2010, Las Vegas, Nevada, USA, June 2-5, 2010. T. Y. Hung, S. Y. Chiang, C. Y. Chou, C. C. Chiu, and K. N. Chiang, "Thermal Design and Transient Analysis of Insulated Gate Bipolar Transistors of Power Module," ITherm 2010, Las Vegas, USA, June 2-5, 2010. S. Y. Chiang, T. Y. Hung, Ray Hsing and K. N. Chiang, "Temperature Dependent Current Crowding Analysis of Insulated Gate Bipolar Transistor," ICEP2010, Sapporo, Hokkaido, Japan, May 12-14, 2010. C. J. Wu, M. C. Hsieh, and K. N. Chiang, "Delamination Investigation of Copper Bumps in 3D Chip Stacking Packages Using the Modified Virtual Crack Closure Technique," ICEP 2010, Sapporo, Japan, May 12-14, 2010. Shih-Ying Chiang, Tsung-Lin Chou, Hwen-Fen Hong and Kou-Ning Chiang, "Life Prediction of HCPV Under Thermal Cycling Test Condition," MAM2010, Mechelen, Belgium, Mar 7-10, 2010. C. J. Wu, M. C. Hsieh, C. C. Chiu, M. C. Yew, and K. N. Chiang "Interfacial Delamination Investigation between Copper Bumps in 3D Chip Stacking Package by Using the Modified Virtual Crack Closure Technique," MAM 2010, Mechelen, Belgium, Mar. 7-10, 2010. Y. F. Su, S. Y. Yang, W. H. Chi and K. N. Chiang, "Light Degradation Prediction of High Power Light Emitting Diode Lighting Modules,"EuroSimE2010, Bordeaux, France, Apr. 26-28, 2010. H. H. Chang, J. H. Huang, C. W. Chiang, Z. C. Hsiao, H. C. Fu, Y. H. Chen and K. N. Chiang, “Process Integration for 3D Chip Stacking with Thin Wafer Handling Technology,” in Materials for Advanced Metallization Conference, Mar. 7-10, Mechelen, Belgium, 2010. Chao-Jen Huang, Chung-Jung Wu, Hung-An Teng, and Kuo-Ning Chiang "A Robust Nano-Mechanics Approach for Tensile and Modal Analysis Using Atomistic-Continuum Mechanics Method," ICONN 2010, Sydney, Australia, Feb 22-26, 2010. Tsung-Lin Chou, Shin-Yueh Yang, and Kuo-Ning Chiang, “Overview and Applicability of Residual Stress Estimation of Film-Substrate Structure,” International Conference of Advanced Manufacturing, Feburary 2-5, 2010, Kenting, Taiwan. H. A. Deng, S. Y. Yang, C. N. Han, T. L. Chou, and K. N. Chiang "Warpage Analysis of High Power InGaN Light Emitting Diodes after Laser Lift-off," EMAP 2009, Penang, Malaysia, Dec 1-3, 2009. S. Y. Chiang, T. L. Chou, Z. H. Shih, H. F. Hong and K. N. Chiang "Non-Uniform Thickness Effect of Die Bonding Interface in High-Concentration Photovoltaic Module," EMAP 2009, Penang, Malaysia, Dec 1-3, 2009. Shin-Yueh Yang, Shih-Ying Chiang, Chan-Yen Chou, Ming-Chih Yew, and Kuo-Ning Chiang, "Reliability Analysis of Copper Interconnections of System-in-Packaging," 4th IMPACT, Oct. 21-23, Taipei, Taiwan.2009. Masafumi Sano, Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Chao-Jen Huang, and Kuo-Ning Chiang, "Reliability and Parametric Study on Chip Scale Package Under Board-Level Drop Test," 4th IMPACT, Oct. 21-23, Taipei, Taiwan. 2009. Tsung-Lin Chou, Chien-Fu Huang, Cheng-Nan Han, Shin-Yueh Yang, and Kuo-Ning Chiang, “Fabrication Process Simulation and Reliability Improvement of High- brightness LEDs,” 20th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF2009), October 5-9, 2009, Arcachon, France (All accepted contributions to the conference have been published as a special issue of Microelectronics Reliability.) C. Y. Chou, C. J. Huang, M. Sano, and K. N. Chiang, "Metal trace impact life prediction model for stress buffer enhanced package," 17th European Microelectronics and Packaging Conference & Exhibition (EMPC2009), Rimini, Italy, June 15-18, 2009. T. Y. Hung, M. C. Yew, C. Y. Chou, and K. N. Chiang, "A study of thermal performance for chip-in-substrate package on package," 17th European Microelectronics and Packaging Conference & Exhibition (EMPC2009), Rimini, Italy, June 15-18, 2009. H. H. Chang, Y. C. Shih, Z. C. Hsiao, C. W. Chiang, Y. H. Chen and K. N. Chiang, "3D Stacked Chip Technology Using Bottom-up Electroplated TSVs",Electronic Components and Technology Conference (ECTC 2009), San Diego, California USA, May 26-29, 2009. C. J. Wu, M. C. Hsieh, and K. N. Chiang, "Strength Evaluation of Silicon Die for 3D Chip Stacking Packages Using ABF as Dielectric and Barrier Layer in Through-Silicon Via,", Materials for Advanced Metallization Conference (MAM 2009), Grenoble, France, Mar. 8-11, 2009. C. C. Chiu, C. J. Huang, S. Y. Yang, C. C. Lee, and K. N. Chiang, "Investigation of the Delamination Mechanism of the Thin Film Dielectric Structure in Flip Chip Packages" Materials for Advanced Metallization Conference (MAM 2009), Grenoble, France, Mar. 8-11, 2009. Masafumi Sano, Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Kuo-Ning Chiang, “Uncertainty and Reliability Analysis of Chip Scale Package Subjected to Board-level Drop Test”, International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE2009), Delft, Netherlands April 27-29, 2009. C. J. Huang, C. Y. Chou, K. N. Chiang, “Dynamic Study and Structure Enhancement of Small Outline Dual-in-line Memory Module”, International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE2009), Delft, Netherlands April 27-29, 2009. W. H. Chi, T. L. Chou, C. N. Han, S. Y. Yang, and K. N. Chiang, "Analysis of Thermal Performance for High Power Light Emitting Diodes Lighting Module", International Conference on Electronics Packaging (ICEP 2009),Kyoto, Japan, April 14-16, 2009 C. J. Wu, M. C. Hsieh, and K. N. Chiang, "Die-Cracking Evaluation of Silicon Chip Covered with Polymer Film for 3D Chip Stacking Packages," International Conference on Electronics Packaging, ICEP 2009, Kyoto, Japan, Apr. 14-16, 2009. SCI期刊論文 W. H. Chi, T. L. Chou, C. N. Han, S. Y. Yang, and K. N. Chiang, “Analysis of Thermal and Luminous Performance of MR-16 LED Lighting Module,” IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue: 4, pp. 713-721, 2010. C.C. Chiu, C.J. Huang, S.Y. Yang, C.C. Lee, and K.N. Chiang, "Investigation of the delamination mechanism of the thin film dielectric structure in flip chip packages," Microelectronic Engineering, vol. 87, pp. 496-500, 2010. C.J. Wu, M.C. Hsieh, and K.N. Chiang, "Strength evaluation of silicon die for 3D chip stacking packages using ABF as dielectric and barrier layer in through-silicon via," Microelectronic Engineering, vol. 87, pp. 505-509, 2010. C. C. Lee, C. C. Lee, and K. N. Chiang, “Electromigration Characteristic of SnAg3.0Cu0.5 Flip Chip Interconnection,” IEEE Trans. Adv. Packag, Vol. 33, Issue: 1, pp. 189-195, 2010. C. Y. Chou, T. Y. Hung, C. J. Huang, and K. N. Chiang, “Development Of Empirical Equations For Metal Trace Failure Prediction Of Wafer Level Package Under Board Level Drop Test,” IEEE Trans. Adv. Packag, Vol. 33, Issue: 3, pp. 681-689, 2010. C. J. Wu, M. C. Hsieh, C. C. Chiu, M. C. Yew, and K. N. Chiang, “Interfacial delamination investigation between copper bumps in 3D chip stacking package by using the modified virtual crack closure technique,” Microelectronic Engineering, in press, 2010. Tsung-Lin Chou, Chen-Hung Chu, Hsin-Nan Chiang, and Kuo-Ning Chiang, “Residual Stress and Thermal Effect of MEMS Pressure Sensor,” Electronic Monthly, Volume 168, pp. 150-167, July 2009. (in Chinese) C. C. Lee, C. C. Chiu, C. C. Hsia, and K. N. Chiang, "Interfacial fracture analysis of CMOS Cu/Low-k BEOL interconnect in advanced packaging structures," IEEE Transactions on Advanced Packaging, Vol. 32, No.1, pp. 53-61, 2009. Tsung-Lin Chou, Chen-Hung Chu, Chun-Te Lin and Kuo-Ning Chiang, “Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor,” Sensors & Actuators: A. Physical, Volume 152, Issue 1, pp. 29-38, 2009. Tzu-Sen Yang, Yujia Cui, Chien-Ming Wu, Jem-Mau Lo, Chi-Shiun Chiang,Wun-Yi Shu, Chung-Shan Yu, Kuo-Ning Chiang, and Ian C. Hsu, "Determining the Zero-Force Binding Energetics of Intercalated DNA Complex Using Single Molecule Approach," ChemPhysChem, 10, 2791-2794 2009. Tsung-Lin Chou, Chien-Fu Huang, Cheng-Nan Han, Shin-Yueh Yang, and Kuo-Ning Chiang, “Fabrication Process Simulation and Reliability Improvement of High- brightness LEDs,” Microelectronics Reliability, Volume 49, Issue 9-11, pp. 1244-1249, 2009. Ming-Chih Yew, Mars Tsai, Dyi-Chung Hu, Wen-Kun Yang, Kuo-Ning Chiang, "Reliability analysis of a novel fan-out type WLP," Soldering & Surface Mount Technology Volume 21(3): p. 30-38 , 2009. C. J. Wu, C. Y. Chou, C. N. Han, and K. N. Chiang, "Estimation and Validation of Elastic Modulus of Carbon Nanotubes Using Nano-Scale Tensile and Vibrational Analysis," Computer Modeling in Engineering and Science, Vol. 41, No. 1, pp. 49-68, 2009. M. C. Yew, C. C. A. Yuan, C. J. Wu, D. C. Hu, W. K. Yang, and Kuo-Ning Chiang, “Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level Packaging,” IEEE Transactions on Advanced Packaging, Volume, 32, No. 2, pp. 390-398, 2009. H. T. Ku, and K. N. Chiang, "The mechanical stress resistance capability of stress buffer structures in analog devices," Microelectronic Reliability, Vol. 48, pp. 716-723, 2008. C. C. Chiu, C. C. Lee, T. L. Chou, C. C. Hsia, and K. N. Chiang, "Analysis of Cu/Low-k structure under back end of line process," Microelectronic Engineering, Vol. 85, Issue 10, pp. 2150-2154, 2008. C. C. Lee, T. L. Chou, C. C. Chiu, C. C. Hsia, and K. N. Chiang, "Cracking energy estimation of ultra low-k package using novel prediction approach combined with global–local modeling technique," Microelectronic Engineering, Vol. 85, Issue 10, pp. 2079-2084, 2008. C. Y. Chou, T. Y. Hung, S. Y. Yang, M. C. Yew, W. K. Yang, and K. N. Chiang, "Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact," Microelectronics Reliability, Vol. 48, pp. 1149-1154, 2008. Chang-Chun Lee, Tai-Chun Huang, Chin-Chiu Hsia, and Kuo-Ning Chiang, “Interfacial Fracture Investigation of Low-k Packaging Using J-Integral Methodology,” IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 31, pp. 91-99, 2008 K. N. Chiang, C. Y. Chou, C. J. Wu, C. J. Huang, and M. C. Yew, "Analytical solution for estimation of temperature-dependent material properties of metals using modified Morse potential," Computer Modeling in Engineering and Science, Vol. 37, pp. 85-96, 2008. C. C. Lee, S. M. Chang and K. N. Chiang, “Sensitivity Design of DL-WLCSP Using DOE With Factorial Analysis Technology”, IEEE Transaction of Advanced Packaging, Vol 30, No. 1, pp. 44-55, April 2007. C. A. Yuan, G. Q. Zhang, C. N. Han, and K. N. Chiang, "Numerical simulation on the mechanical characteristics of double-stranded DNA under axial stretching and lateral unzipping," J. Appl. Phys. 101, 074702, 2007. C. C. Lee, H. C. Liu and K. N. Chiang, "3D Structure Design and Reliability Analysis of Wafer Level Package with Stress Buffer Mechanism," IEEE Transactions on Component and Packaging Technologies, Vol. 30, No.1, pp.110- 118, 2007. C. C. Chiu, C. J. Wu, C. T. Peng, K. N. Chiang, T. Ku, and K. Cheng, "Failure life prediction and factorial design of lead-free flip chip package," Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Vol.30, No. 3, pp. 481-490, 2007. S. M. Chang, C. Y. Cheng, L. C. Shen, K. N. Chiang, Y. J. Hwang, Y. F. Chen, C. T. Ko, and K. C. Chen, "A novel design structure for WLCSP with high reliability, low cost, and ease of fabrication," IEEE Transactions on Advanced Package, Vol. 30, No. 3, pp. 377-383, 2007. C. T. Lin, and K. N. Chiang, "From atomic-level lattice structure to estimate the silicon mechanical bulk behavior using the atomistic-continuum mechanics," Key Engineering Materials, Vol 334-335 I, pp. 281-284, 2007 C. C. Chiu, H. H. Chang, C. C. Lee, C. C. Hsia, and K. N. Chiang, "Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure," Microelectronics Reliability, Vol. 47, pp. 1506-1511, 2007. M. C. Yew, C. Y. Chou, and K. N. Chiang, "Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis." Microelectronics Reliability, Vol. 47, pp. 1658-1662, 2007. C. C. Lee, C. C. Lee, H. T. Ku, S. M. Chang, and K. N. Chiang, "Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology," Microelectronics Reliability Vol. 47, pp. 196-204, 2007. Ming-Chih Yew, Chien-Chia Chiu, Shu-Ming Chang and Kuo-Ning Chiang, "A Novel Crack and Delamination Protection Mechanism for a WLCSP Using Soft Joint Technology," Soldering & Surface Mount Technology, Vol. 18, Issue 3, 2006, pp. 3-13. K. N. Chiang , Chien Chen Lee, Chang Chun Lee and K. M. Chen, "Current crowding-induced electromigration in SnAg3.0Cu0.5 micro-bumps", Appl. Phys. Lett., 88, 072102, 2006. K. N. Chiang , C.A. Yuan, C. N. Han, C. Y. Chou and Yujia Cui, "Mechanical Characteristic of ssDNA /dsDNA Molecule Under External Loading", Appl. Phy. Lett., 88, 023902, 2006 K. N. Chiang, C. Y. Chou, and C. J. Wu, and C. A. Yuan, "Prediction of The Bulk Elastic Constant of Metals Using Atomic-Level Single-Lattice Analytical Method" Appl. Phys. Lett. 88, 171904, 2006 Chen, KM, Houng, KH, Chiang, KN, "Thermal resistance analysis and validation of flip chip PBGA packages", MICROELECTRON RELIAB 46 (2-4): 440-448 FEB-APR 2006 Chang, KC, Chiang, KN, "Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model", J STRAIN ANAL ENG 41 (1): 19-30 JAN 2006 Lee, C. C., Ku, H. T., Chiu, C. C., and Chiang, K. N., “A Novel Prediction Technique for Interfacial Crack Growth of Electronic Interconnect,” Key Engineering Materials, pp.533, 2006. Liu, C. M., Lee, C. C., Ku, H. T., Chiu, C. C., and Chiang, K. N., “Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging,” Key Engineering Materials, pp.521, 2006. K. C. Chang and K. N. Chiang, "Growth Analysis of Interfacial Delamination of Plastic Ball Grid Array Package During Solder Reflow Using Global-Local Finite Element Method." Journal of Strain Analysis for Engineering Design, Vol. 41, No. 1, pp. 19-30, 2006. M. C. Yew, C. Y. Chou, C. S. Huang, W. K. Yang, K. N. Chiang, "The Solder on Rubber (SOR) Interconnection Design and Its Reliability Assessment Based on Shear Strength Test and Finite Element Analysis," Journal of Microelectronics Reliability, Vol. 46, pp. 1874-1879, 2006 Liu, C. M., Lee, C. C., and Chiang, K. N., “Enhancing the Reliability of Wafer Level Packaging by Using Solder Joints Layout Design,” IEEE Transactions on Component and Packaging Technologies, Vol. 29, No. 4, pp. 877-885, 2006. W. H. Chen, S. R. Lin and K. N. Chiang, "Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology", ASME Transactions Journal of Electronic Packaging, Vol. 128, No. 4, pp. 331-338, 2006. C. C. Lee, C. T. Peng, and K. N. Chiang, "Packaging Effect Investigation of CMOS Compatible Pressure Sensor Using Flip Chip and Flex Circuit Board Technologies,” Sensors and Actuators Journal A, Vol 126/1, pp 48-55, 2006. Kuo-Ming Chen, J.D. Wu and Kuo-Ning Chiang, "Effects of Pre-Bump Probing and Bumping Processes on Eutectic Solder Bump Electromigration", Microelectronics and Reliability, In Press, Corrected Proof, Available online 28 February 2006. K. M. Chen and K. N. Chiang, "Developing an Analytic Methodology to Accurately Predict Probing Depth in Integrated Circuit Structures", Journal of Electronic Materials, Vol. 35, pp.257-265, 2006. C. C. Lee, and K. N. Chiang, “Design and Reliability Analysis of a Novel Wafer Level Package with Stress Buffer Mechanism,” Journal of the Chinese Institute of Engineers, Vol. 29, No. 3, pp. 433-443, May 2006. K. N. Chiang, C. H. Chang and C. T. Peng, "Local-Strain Effects in Si/SiGe/Si Islands on Oxide". Appl. Phys. Lett, 87, 191901, 2005.

我收藏的导师 >

便捷的期刊搜索 >

免费课题组网站 >

推荐链接