刘盼 - 复旦大学 - 工程与应用技术研究院

个人简介

教育工作经历 2019年7月至今，复旦大学工程与应用技术研究院，青年副研究员 2017年2月-2019年7月，Heraeus GmbH（德国），项目经理 2016年10月-2017年1月，UL Transaction Security B.V. (荷兰)，分析师 2016年7月-2020年3月，荷兰代尔夫特理工大学，客座研究员 2012年3月-2016年6月，荷兰代尔夫特理工大学，博士（电子工程） 2009年8月-2011年6月，荷兰代尔夫特理工大学，硕士（可持续能源技术） 2005年9月-2009年7月，北京航空航天大学，学士（材料科学与工程学院）获奖情况 2009-2011，荷兰大使馆，橙色郁金香奖学金 2009-2011，荷兰代尔夫特理工大学，院系奖学金 2018，第七届中国创新创业大赛，第三代半导体专业赛团队组优胜奖 2020，复旦大学，泛海杯大学生创新创业大赛校赛二等奖，指导教师 2020，江苏省普通高校本专科优秀毕业设计论文二等奖，指导教师 2021，第十七届挑战杯全国大学生课外学术科技作品竞赛校赛三等奖，指导教师

研究领域

先进封装材料开发第三代半导体模块封装与可靠性测试柔性半导体封装系统集成碳化硅基器件制备与系统集成

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

J. Tang, J. Zhang, G. Zhang and P. Liu, 'Feasibility Analysis of Crack Initiation Identification of Sintered Silver for a Fast Lifetime Prediction,' 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, pp. 1-5, doi: 10.1109/ICEPT52650.2021.9568197. Z. Zeng, J. Zhang and P. Liu, 'Review of Copper-Silver Core-Shell Sintering Pastes: Technology and Future Trends,' 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, pp. 1-6, doi: 10.1109/ICEPT52650.2021.9568205. P. Liu et al., 'Ultrasonic Thick Wire Bonding Process Simulation and Validation for Silicon Carbide Power Devices,' 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1786-1790, doi: 10.1109/ECTC32696.2021.00282. P. Liu, J. Li, H. v. Zeijl and G. Zhang, 'Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration,' 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 817-823, doi: 10.1109/ECTC32862.2020.00133. P. Liu et al., 'Thermal Simulations of a UV LED module with nanosilver sintered die attach process on graphene-coated copper substrates,' 2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS), Shenzhen, China, 2019, pp. 93-97, doi: 10.1109/SSLChinaIFWS49075.2019.9019813. P. Liu, H. W. van Zeijl, M. R. Venkatesh, R. Sokolovskij, R. Kurt and G. Q. Zhang*, Review on retrofit G4 LED lamps: Technology, challenges, and future trends; 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2015, pp. 2277-2282.;2015 R Sokolovskij, P Liu, H W van Zeijl, B Mimoun, G Q Zhang, Design and fabrication of a foldable 3D silicon based package for solid state lighting applications, J. Micromech. Microeng. Volume 25, Number 5. 2015 Venkatesh, M.R.; Liu, P.; van Zeijl, H.W.; Zhang, G.Q., 'Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications,' Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on , pp.1,6, 7-9 April 2014 Liu, P.; Zhang, J.; Sokolovskij, R.; van Zeijl, H.W.; Mimoun, B.; Zhang, G.Q., 'Geometric optimization of high performance interconnect of Rigid/Flexible/Rigid substrate for Wafer Level Packaging in Solid State Lighting applications by numerical simulations,' Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on , pp.1,6, 14-17 April 2013 P. Liu, H. W. van Zeijl, R. Kurt, G. Q. Zhang. Simulation of LED lamps with different integration methods for retrofit G4 halogen lamps application. China SSL 2012. Isabella, O, Liu, P, Bolman, B, Krc, J & Zeman, M (2011). Modulated surface-textured substrates with high haze for thin-film silicon solar cells. In B Yan, S Higashi, CC Tsai, Q Wang & H Gleskova (Eds.), MRS Proceedings 2011, vol. 1321 (pp. 1-6).