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[1]刘莹,毕杰,于同敏.不同工艺参数与超声振动作用下成形制件的盐雾老化性能[J],中国机械工程,2020,31(9):1115-1122
[2]刘莹,宋满仓,祝铁丽.面向卓越工程师培养的模具方向毕业设计图样规范化研究[J],高教学刊,2019,19:83-85
[3]刘莹,顾硕,于同敏,刘骁,陈聪,关铭.超声振动减小脱模阻力的研究[J],模具制造,2018,18(7):58-63
[4]刘莹,侯世杰,宋满仓,刘军山,刘永云.点浇口对多孔支架基片充填流动平衡的影响[J],模具制造,2017,17(4):33-37
[5]Song, M. C.,Liu, Y.,Li, W. M..Fabricating micro-core by EDM with multi-station narrow slit electrode[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2017,88(9-12):3507-3514
[6]Liu, Ying,Cui, Yan,Wang, Dian-Long,Sun, Jing,Wang, Lei.The Orientation and Achieving Measures of the Training Objective for Mechanical Engineering Maj...[A],2016,119-123
[7]刘莹,李昊宇,宋满仓,李立刚,高杨.COC微流控芯片注塑成型微结构复制度研究[J],塑料工业,2015,43(3):72-75
[8]宋满仓,王敏杰,刘冲,刘莹.Experimental Study on WEDM Machining of PCD and PCBN compacts[A],2015,645:52-57
[9]宋满仓,李文明,刘莹,刘冲.多工位组合电极电火花成形微凹槽结构[J],光学精密工程,2015,23(12):3371-3377
[10]宋满仓,连城林,刘莹,刘冲,刘军山,熊林城.电热式变模温注塑改善微结构复制度方法[J],天津大学学报,2014,48(11):969-973
[11]宋满仓,祝铁丽,杜立群,王敏杰,刘冲,刘莹.微流控芯片基片与盖片一体化注塑成型研究[J],材料科学与工艺,2013,21(1):13-17
[12]陈灿波,刘莹,田慧卿.基于Moldflow的微流控芯片收缩变形研究[J],模具工业,2012,38(8):14-18
[13]刘莹,宋满仓,王敏杰.双十字微通道微流控芯片注塑成型试验研究[A],2012
[14]宋满仓,刘莹,祝铁丽,杜立群,王敏杰,刘冲.塑料微流控芯片的注塑成型[J],纳米技术与精密工程,2011,09(4):329-334
[15]宋满仓,刘莹,祝铁丽,张传赞,刘军山,刘冲.微流控芯片注塑成型缺陷的成因与对策[J],机械工程学报,2011,47(6):33-38
[16]刘莹,宋满仓,王敏杰,张传赞,刘军山,刘冲.微结构塑件注射成型试验研究与缺陷分析[J],高分子材料科学与工程,2010,26(5):104-107
[17]Liu, Y.,Song, M.C.,Wang, M.J.,Zhang, C.Z..Quality defects and analysis of the microfluidic chip injection molding[J],Materials Science Forum,2009,628 629:417-422
[18]刘莹.基于能力培养的塑料成型课程教学改革与探索[J],科技资讯,2009,26:192
[19]宋满仓,刘军山,刘莹,刘冲.Basic Experimental Studies on Injection Molding of Microfluidic Chip[A],2008
[20]祝铁丽,刘莹,于同敏.Preliminary Study of In-mold Shrinkage in Injection Molding Process[A],2008
[21]刘莹,宋满仓,王敏杰.Study and Development of Mold Variothermal System for Micromolding[A],2008