近期论文
查看导师新发文章
（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）
朱祥龙.Study into grinding force in back grinding of wafer with outer rim[J],Advances in Manufacturing,2022,8(3):361-368
高尚.Study on the subsurface damage distribution of the silicon wafer ground by diamond wheel[J],Advanced materials research,2022,126-128:113-118
康仁科.Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer[A],ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XV,2022,416:529-534
康仁科.Study on grinding performance of soft abrasive wheel for silicon wafer[J],KEY ENGINEERING MATERIALS,2022,416:529-534
高尚.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],18th International Symposium on Advances in Abrasive Technology, ISAAT 2015,2022
高尚.Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond d...[J],MATERIALS AND MANUFACTURING PROCESSES,2022,32(2):121-126
董志刚.Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,83(5-8):1231-1239
高尚.Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a ...[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,63:97-106
高尚.Surface layer damage of quartz glass induced by ultra-precision grinding with different grit size[A],The Second International Conference on Applied Engineering, Materials and Mechanics (ICAEMM 2017),2022,872:19-24
康仁科.Surface layer damage of silicon wafers sliced by wire saw process[J],Advanced materials research,2022,797:685-690
高尚.Recent advances in micro- and nano-machining technologies[J],机械工程前沿,2022,12(1,SI):18-32
Liu, H.J..Development of a measuring equipment for silicon wafer warp[J],Advanced materials research,2022,797:561-565
高尚.Warping of silicon wafers subjected to back-grinding process[J],PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE,2022,40:87-93
Liu, Haijun.ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS ...[J],Metrology and Measurement Systems,2022,22(4):531-546
张玉.A new model of grit cutting depth in wafer rotational grinding considering the effect of the grin...[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2022,72:461-468
杨国林.A novel reverse helical milling process for reducing push-out delamination of CFRP[J],COMPOSITE STRUCTURES,2022,253
高尚.Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B JOURNAL OF EN,2022,227(B4):578-586
Wu, Y. Q..Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained us...[J],JOURNAL OF MATERIALS SCIENCE,2022,54(3):1958-1966
高尚.Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,79:165-170
董志刚.Grinding performance evaluation of the developed chemo-mechanical grinding (CMG) tools for sapphi...[J],Advanced materials research,2022,565:105-110
Liu, Zhiqiang.FEM-based optimization approach to machining strategy for thin-walled parts made of hard and br...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,110(5-6):1399-1413
朱祥龙.Grinding Marks in Back Grinding of Wafer with Outer Rim[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C JOURNAL OF ME,2022,234(16):3195-3206
高尚.Edge chipping of silicon wafers in diamond grinding[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE,2022,64:31-37
董志刚.Effects of taping on grinding quality of silicon wafers in backgrinding[J],FRONTIERS OF MECHANICAL ENGINEERING,2022,16(3):559-569
高尚.Effect of Strain Rate on the Deformation Characteristic of AlN Ceramics under Scratching[J],MICROMACHINES,2022,12(1)
高尚.Warping of silicon wafers subjected to back-thinning process[J],PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE,2022,40(-):87-93
Cai, Linquan.Material removal mechanism and deformation characteristics of AIN ceramics under nanoscratching[J],CERAMICS INTERNATIONAL,2022,45(16):20545-20554
高尚.Grinding performance of diamond grinding tools for sapphire crystal[A],17th International Symposium on Advances in Abrasive Technology, ISAAT 2014,2022,117(-):544-548
Wu, Y. Q..The deformation pattern of single crystal β-Ga2O3 under nanoindentation[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,71(-):321-325
李子源.A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers a...[J],International Journal of Abrasive Technology,2022,10(2):122-133
高尚.工件旋转法磨削硅片的亚表面损伤分布[J],机械工程学报,2022,3:88-94
高尚.工件旋转法磨削硅片的磨粒切削深度模型[J],机械工程学报,2022,17:86-93
高尚.微晶玻璃超精密磨削的表面/亚表面损伤及其材料去除机理研究[J],机械工程学报,2022,7:180-188
高尚.新一代半导体材料氧化镓单晶的制备方法及其超精密加工技术研究进展[J],Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,2022,57(9):213-232
王紫光.单晶硅反射镜的超精密磨削工艺[J],光学精密工程,2019,27(5):1087-1095
林智富.固结金刚石研磨盘加工蓝宝石基片的磨削性能研究[J],人工晶体学报,2016,5:1317-1322
白倩.金属增减材复合制造专业硕士实践教学平台建设[J],实验室科学,2018,21(2):158-160,163
朱祥龙.Design of Ultra-precision Machine for Integrated Grinding and Polishing of Silicon Wafers[A],6th International Conference on Nanomanufacturing,2018
朱祥龙.全日制专业型硕士实践能力培养体系之探析[J],实验室科学,2017,20(5):229-232
王紫光.硅片低损伤磨削砂轮及其磨削性能[J],光学精密工程,2017,25(10):2689-2696
高尚.硅片超精密磨削减薄工艺基础研究[J],机械工程学报,2015,7:52-52
高尚.石英玻璃超精密磨削加工的表面完整性研究[J],机械工程学报,2019,55(05):186-195
于月滨.磨削速度和压力对单晶硅去除特性的影响[J],金刚石与磨料磨具工程,2016,3:1-5,10
高尚.Effect of Strain Rate on the Deformation Characteristic of AlN Ceramics under Scratching[J],Micromachines,2021,12(1)
刘志强.FEM-based optimization approach to machining strategyfor thin-walled parts made of hard and britt...[J],The International Journal of Advanced Manufacturing Technology,2021,110(5-6):1399-1413
Yang, Guolin.A novel reverse helical milling process for reducing push-out delamination of CFRP[J],COMPOSITE STRUCTURES,2021,253
李子源.A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers a...[J],International Journal of Abrasive Technology,2020,10(2):122-133
高尚,吴跃勤,王紫光,康仁科,耿宗超.石英玻璃超精密磨削加工的表面完整性研究[J],机械工程学报,2019,55(5):186-195
王紫光,康仁科,周平,高尚,董志刚.单晶硅反射镜的超精密磨削工艺[J],光学精密工程,2019,27(5):1087-1095
Cai, Linquan,Guo, Xiaoguang,Gao, Shang,Li, Zhiyuan,Kang, Renke.Material removal mechanism and deformation characteristics of AIN ceramics under nanoscratching[J],CERAMICS INTERNATIONAL,2019,45(16):20545-20554
Gao, Shang,Dong, Zhigang,Kang, Renke,Zhang, Bi,Guo, Dongming.Warping of silicon wafers subjected to back-grinding process[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2015,40:87-93
Wu, Y. Q.,Gao, S.,Kang, R. K.,Huang, H..Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained us...[J],JOURNAL OF MATERIALS SCIENCE,2019,54(3):1958-1966
Gao, Shang,Huang, Han.Recent advances in micro- and nano-machining technologies[J],FRONTIERS OF MECHANICAL ENGINEERING,2017,12(1,SI):18-32
高尚,康仁科.硅片超精密磨削减薄工艺基础研究[J],机械工程学报,2015,7:52-52
Gao, Shang,Wu, Yueqin,Kang, Renke,Huang, Han.Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2018,79:165-170
朱祥龙,李俊卿,董志刚,康仁科,高尚,郭东明.Design of Ultra-precision Machine for Integrated Grinding and Polishing of Silicon Wafers[A],2018
Wu, Y. Q.,Gao, S.,Huang, H..The deformation pattern of single crystal β-Ga2O3 under nanoindentation[J],Materials Science in Semiconductor Processing,2017,71(-):321-325
朱祥龙,高尚,康仁科,董志刚,崔岩.全日制专业型硕士实践能力培养体系之探析[J],实验室科学,2017,20(5):229-232
王紫光,高尚,朱祥龙,董志刚,康仁科.硅片低损伤磨削砂轮及其磨削性能[J],光学精密工程,2017,25(10):2689-2696
Gao, Shang,Huang, Han,Zhu, Xianglong,Kang, Renke.Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a ...[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2017,63:97-106
京公网安备 11010802027423号