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张桥杰.基于激光位移传感器在机测量砂轮直径[J],组合机床与自动化加工技术,2022,2:84-88,92
康仁科.大尺寸硅片超精密磨削技术与设备的发展动态[A],全国身产工程第十届年会,2022
曹克.微晶刚玉砂轮磨削钛合金TC17磨削力研究[J],金刚石与磨料磨具工程,2022,5:1-7,14
高尚.微晶玻璃超精密磨削的表面/亚表面损伤及其材料去除机理研究[J],机械工程学报,2022,7:180-188
高尚.新一代半导体材料氧化镓单晶的制备方法及其超精密加工技术研究进展[J],Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,2022,57(9):213-232
朱祥龙.晶硅片超精密磨削技术与设备[J],中国机械工程,2022,21(18):2156-2164
卢成.涡轮轴内壁积碳清理设备结构设计与分析[J],组合机床与自动化加工技术,2022,05:124-127
康仁科.激光晶片抛光中磨粒运动轨迹分布均匀性分析[J],金刚石与磨料磨具工程,2022,3:40-45
马进.环抛机直驱电机转台系统设计[J],组合机床与自动化加工技术,2022,9:68-71
朱祥龙.Design of Double-Sided Polishing Machine for Functional Crystal Substrate. The International Symposi[A],The 17th International Symposium on Advances in Abrasive Technology,2022,1017:580-585
Yang, Mingwei.Development of the measurement-grinding integrated machine tool[A],ISAAT 2017 - Proceedings of the 20th International Symposium on Advances in Abrasive Technology,2022,458-464
朱祥龙.Development of three-dimensional dynamometer for wafer grinder[J],Advanced materials research,2022,126-128:361-366
朱祥龙.Development of ultra-precision grinder for 300mm wafers[J],Advanced materials research,2022,565:609-614
李崎岩.Deviation analysis of wall thickness measurement for tube parts with large depth to diameter ratio[A],The 21st International Symposium on Advances in Abrasive Technology,2022
Pan, Bo.Double-sided lapping of thin copper substrate by textured fixed-abrasive pad[A],19th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2019,2022,432-435
Yao, Weihua.Effect of grinding residual height on the surface shape of ground wafer[J],JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2022,299
莫宇博.Error analysis and Device Improvement for Measuring Straightness of Deep Hole Based on Photoelectric[A],The 22nd International Symposium on Advances in Abrasive Technology,2022,1-7
董志刚.Experimental investigation on grinding performance of microcrystalline alumina abrasive grinding whe[A],Advanced materials research,2022,797:597-602
董志刚.Experimental investigation on grinding performance of microcrystalline alumina abrasive grinding whe[J],Advanced materials research,2022,797:597-602
朱祥龙.Grinding Marks in Back Grinding of Wafer with Outer Rim[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C JOURNAL OF ME,2022,234(16):3195-3206
Liu, Zhiqiang.FEM-based optimization approach to machining strategy for thin-walled parts made of hard and britt[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,110(5-6):1399-1413
郭江.Finishing of rectangular microfeatures by localized vibration-assisted magnetic abrasive polishing ([A],6th International Conference on Nanomanufacturing,2022
Fan, Kangnan.Investigation on electrochemical grinding (ECG) of pure iron material[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022
Mu, Qing.Investigation on surface/subsurface damage mechanism in yttrium aluminum garnet crystal lapping and [A],19th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2019,2022,440-441
Liu, Haijun.Three-point-support method based on position determination of supports and wafers to eliminate gra[J],PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE,2022,46:339-348
郭江.6th International Conference on Nanomanufacturing[A],Finishing of rectangular microfeatures by localized vibration-assisted magnetic abrasive polishing (VAMAP) method,2022
Fan, Kangnan.A facile electrochemical machining process to fabricate superhydrophobic surface on iron materials[J],JOURNAL OF DISPERSION SCIENCE AND TECHNOLOGY,2022,42(3):457-464
郑非非.Analysis of material removal behavior in ultrasonically assisted scratching of RB-SiC from energy [J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,98(9-12):2257-2270
朱祥龙.An empirical equation for prediction of silicon wafer deformation[J],Materials Research Express,2022,4(6)
张玉.A new model of grit cutting depth in wafer rotational grinding considering the effect of the grindin[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2022,72:461-468
朱祥龙.A novel method for grinding wheel setting based on acoustic emissions[A],19th International Symposium on Advances in Abrasive Technology, ISAAT 2016,2022,874:79-84
Zhang, Zili.A novel chemical mechanical polishing slurry for yttrium aluminum garnet crystal[J],APPLIED SURFACE SCIENCE,2022,496
张军.A novel piezoelectric grinding dynamometer for monitoring ultra-precision grinding of silicon wafers[J],Advanced materials research,2022,126-128:707-712
秦炎.Burr removal from measurement data of honeycomb core surface based on dimensionality reduction and r[J],MEASUREMENT SCIENCE TECHNOLOGY,2022,29(11):115010-115010
董志刚.Characterisation of material removal in ultrasonically assisted grinding of SiCp/Al with high volume[J],The International Journal of Advanced Manufacturing Technology,2022,93:2827-2839
董志刚.Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high volu[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,93(5-8):2827-2839
Ma, Guofeng.Mechanical model of thrust force and torque in longitudinal-torsional coupled ultrasonic-assisted dr[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022
张元.Microstructural evolution of soft magnetic 49Fe-49Co-2V alloy induced by drilling[J],MATERIALS DESIGN,2022,189
鲍岩.Model for surface topography prediction in mirror-milling of aircraft skin parts[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,95(5-8):2259-2268
鲍岩.Multipoint support technology for mirror milling of aircraft skins[J],MATERIALS AND MANUFACTURING PROCESSES,2022,33(9):996-1002
鲍岩.Optimization of support location in mirror-milling of aircraft skins[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B JOURNAL OF EN,2022,232(9):1569-1576
Jiang, Guannan.Research on extending electrolyte life using diatomite in electrochemical abrasive machining[A],ISAAT 2017 - Proceedings of the 20th International Symposium on Advances in Abrasive Technology,2022,87-92
朱祥龙.Research on topography control of two-spindle and three-workstation wafer grinder[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C JOURNAL OF ME,2022,225(C9):2232-2241
董志刚.Robust cell wall recognition of laser measured honeycomb cores based on corner type identification[J],OPTICS AND LASERS IN ENGINEERING,2022,136
徐辉.Study and Analysis of Removing the Carbon Deposition on the Inner Surface of a Turbo-Shaft by Chem[J],FRONTIERS IN MATERIALS,2022,7
牛林.Study on Electrochemical Effect in Electrochemical Grinding of Tungsten Alloy[A],The 21st International Symposium on Advances in Abrasive Technology,2022
Kangnan, Fan.Study on electrochemical grinding[A],ISAAT 2017 - Proceedings of the 20th International Symposium on Advances in Abrasive Technology,2022,793-799
朱祥龙.Study into grinding force in back grinding of wafer with outer rim[J],Advances in Manufacturing,2022,8(3):361-368
马付建.Study on the Subsurface Damages of Glass Fiber Reinforced Composites[A],The 16th International Symposium on Advances in Abrasive Technology,2022,797:691-695
Ma, F.J..Study on the subsurface damages of glass fiber reinforced composites[J],Advanced materials research,2022,797:691-695
Kangnan, Fan.Study on electrolyte selection and electrochemical grinding process of hardly machined material[A],ISAAT 2017 - Proceedings of the 20th International Symposium on Advances in Abrasive Technology,2022,267-272
张自力.Study on High Precision Measurement of Chemical Mechanical Polishing Removal Rate of YAG Crystal[A],euspen’s 19th International Conference & Exhibition,2022,1-4
高尚.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],18th International Symposium on Advances in Abrasive Technology, ISAAT 2015,2022
高尚.Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a new[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,63:97-106
朱祥龙.Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder[J],Journal of Semiconductors,2022,32(10)
朱祥龙.Design of Ultra-precision Machine for Integrated Grinding and Polishing of Silicon Wafers[A],6th International Conference on Nanomanufacturing,2018
朱祥龙.Development of ultra-precision grinder for 300mm wafers[A],Advanced materials research,2012,565:609-614
安润莉.Effect of polishing plate properties on YAG crystal disk polishing[A],6th International Conference on Nanomanufacturing,2018
朱祥龙.Experimental research on dressing parameters of the plate in planetary double[A],The 19th International Symposium on Advances in Abrasive Technology,2016,874:172-177
Song D.B..Experimental research on dressing parameters of the plate in planetary double-sided grinding process[A],19th International Symposium on Advances in Abrasive Technology, ISAAT 2016,2016,874:172-177
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