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Renke Kang, Yu Zhang, Shang Gao*, Jinxing Huang, Xianglong Zhu. High surface integrity fabrication of silicon wafers using a newly developed nonwoven structured grind-polishing wheel. Journal of Manufacturing Processes, 2022, 77: 229-239
Renke Kang, Pengnan Zhang, Zhaocheng Wei, Zhigang Dong,Yidan Wang*. Experimental Study on Ultrasonic Assisted Turning of GH4068 Superalloy. Materials. 2023; 16(9):3554.
Renke Kang, Jinting Liu, Zhigang Dong*, Feifei Zheng, Yan Bao, Jiadong Duan. An Improved Cutting Force Model for Ultrasonically Assisted Grinding of Hard and Brittle Materials. Applied Sciences, 2021, 11(9), 3888.
Shang Gao, Honggang Li, Renke Kang*, Yu Zhang, Zhigang Dong. Effect of Strain Rate on the Deformation Characteristic of AlN Ceramics under Scratching. Micromachines. 2021; 12(1):77.
Zhigang Dong, Yan Qin, Renke Kang*, Yidan Wang, Jiansong Sun, Xianglong Zhu, Yao Liu. Robust cell wall recognition of laser measured honeycomb cores based on corner type identification. Optics and Lasers in Engineering, 2021,136: 106321.
Liwei Ou, Zhigang Dong, Renke Kang*, Kang Shi, Dongming Guo. Photoelectrochemically combined mechanical polishing of n-type gallium nitride wafer by using metal nanoparticles as photocathodes. International Journal of Advanced Manufacturing Technology, 2019, 105: 4483-4489.
Shang Gao, Yueqin Wu, Renke Kang*, Han Huang*. Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3. Materials Science in Semiconductor Processing, 2018,79:165-170.
Shang Gao, Jialu Qu, Honggang Li, Renke Kang*. Effect of Fiber Type and Content on Mechanical Property and Lapping Machinability of Fiber-Reinforced Polyetheretherketone. Polymers (Basel). 2022;14(6):1079.
Yuan Zhang, Zhigang Dong, Yan Bao, Renke Kang*, Xin Huang, Dongming Guo. Comparison of surface integrity for dry and wet drilling of 49Fe-49Co-2V alloy, Chinese Journal of Aeronautics, 2022, 35(6), 325-338
Shang Gao*, Honggang Li, Han Huang, Renke Kang*, Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing, Applied Surface Science, 2022, 599: 153982
Zhigang Dong, Qian Zhang, Haijun Liu, Renke Kang*, Shang Gao. Effects of taping on grinding quality of silicon wafers in backgrinding. Frontiers of Mechanical Engineering, 2021, 16(3): 559‒569.
Sen Yin, Zhigang Dong, Yan Bao, Renke Kang*, Wenhao Du, Yanan Pan, Zhuji Jin. Development and optimization of ultrasonic elliptical vibration cutting device based on single excitation. Journal of Manufacturing Science and Engineering, 2021, 143(8), 1-29.
Xianglong Zhu, Weihua Yao, Xiaoguang Guo, Renke Kang*, Muhammad Jawad Ahmad. The effect of the chuck shape on the wafer topography in back grinding of wafer with outer rim. Advances in Mechanical Engineering. 2021, 13(10), 1-10.
Feifei Zheng, Zhigang Dong, Renke Kang*, Bi Zhang, Xianglong Zhu, Jinting Liu. Analysis of material removal behavior in ultrasonically assisted scratching of rb-sic from energy aspects. International Journal of Advanced Manufacturing Technology, 2018,98(9-12):2257-2270.
Xianglong Zhu, Yu Li, Zhigang Dong, Renke Kang*, Shang Gao. Study into grinding force in back grinding of wafer with outer rim. Advances in Manufacturing, 2020, 8:361-368.
Xianglong Zhu, Yu Li, Zhigang Dong, Renke Kang*, Shang Gao, Liansheng Li. Grinding Marks in Back Grinding of Wafer with Outer Rim. ARCHIVE Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science, 2020, 234(16):3195-3206.
Jiang Guo, Jianguo Zhang, Yanan Pan, Renke Kang *, Yoshiharu Namba, Paul Shore, Xiaobin Yue, Baorui Wang, Dongming Guo. A critical review on the chemical wear and wear suppression of diamond tools in diamond cutting of ferrous metals. International Journal of Extreme Manufacturing, 2020, 2, 012001.
Sen Yin, Yan Bao, Yanan Pan, Zhigang Dong, Zhuji Jin, Renke Kang*. Design of ultrasonic elliptical vibration cutting system for tungsten heavy alloy. Frontiers of Mechanical Engineering. 2023, 17:59.
Zhigang Dong, Nianwei Xu, Yuan Zhang, Lu Han, Renke Kang*, Xiaofeng Wu & Yan Wang. Mechanism of gradient strengthening layer formation based on microstructure and microhardness of Inconel 718 grinding surface, The International Journal of Advanced Manufacturing Technology, 2022,120:2363–2372.
Guolin Yang, Zhigang Dong, Shang Gao, Yan Bao, Renke Kang*, Dongming Guo. A novel reverse helical milling process for reducing push-out delamination of CFRP. Composite Structures, 2020,253:112778.
Feifei Zheng, Zhigang Dong, Jiatong Zhang, Jinting Liu, Renke Kang*. Influence of Ultrasonic Vibration on Material Removal of Scratching on RB-SiC with Single Diamond Tool. Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2019, 55: 225-232.
Shang Gao, Zongchao Geng, Yueqin Wu, Ziguang Wang, Renke Kang*. Surface Integrity of Quartz Glass Induced by Ultra-precision Grinding. Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2019, 55: 186-195.
Jiang Guo, Zengxu He, Bo Pan, Bin Wang, Qian Bai, Jinxing Kong, Renke Kang*. Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping. Chinese Journal of Mechanical Engineering. 2023, 36: 15.
Zhigang Dong, Zhang Haitao, Yan Bao, Feng Yang, Zhongwang Wang, Renke Kang*. Material Removal Behavior of Ultrasonic Vibration Helical Grinding of SiCf/SiC Composites. Journal of Manufacturing Science and Engineering. 2023, 145: 1-22.
Hao Wang, Xiaoguang Guo, Zhigang Dong, Song Yuan, Yan Bao, Renke Kang*. Effects of Cutting Force on Formation of Subsurface Damage During Nano-Cutting of Single-Crystal Tungsten. International Journal of Mechanical Sciences, 2022, 225:107384.
Jiansong Sun, Zhigang Dong, Xuanping Wang, Yidan Wang, Yan Qin, Renke Kang*. Simulation and experimental study of ultrasonic cutting for aluminum honeycomb by disc cutter. Ultrasonics, 2020, 103:106102.
Jiang Guo, Xiaolin Shi, Chuanping Song, Lin Niu, Hailong Cui, Xiaoguang Guo, Zhen Tong, Nan Yu, Zhuji Jin, Renke Kang*. Theoretical and experimental investigation of chemical mechanical polishing of W–Ni–Fe alloy. International Journal of Extreme Manufacturing ,2021,3(2):125-137.
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