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Li, Chu; Tao, Ran; Luo, Shuang; Gao, Xiang;Zhang, Kai*; Li, Zhigang*，“Enhancing and Impeding Heterogeneous Ice Nucleation through Nanogrooves”，The Journal of Physical Chemistry
Kai Zhang*, Guowei David Xiao, Zhaoming Zeng, Chuiming Wan, Jie Li, Shihan Xin, Xiaowu He, Shaojia Deng, Yu Zhang, Chengqiang Cui, Yunbo He, Lisa Liu, Cheng Sheng Ku, Matthew M. F. Yuen, A novel thermally conductive transparent die attach adhesive for high performance LEDs, Materials Letters, 235 (2019) 216-219
Huiru Yang, Zeping Wang, Huaiyu Ye,Kai Zhang*, Xianping Chen, Guoqi Zhang, Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study, Applied Surface Science 459 (2018) 554-561
Bin Yang, Chengqiang Cui, Yu Zhang,Kai Zhang*, Zhangqiao Zhou, Xun Chen, Xin Chen, Jian Gao, Yunbo He, Hui Tang and Yun, “New Surface Treatment Method for Silver Alloy Wire and Its Performance Evaluation”, 19th International Conference on Electronic Packaging Technology (ICEPT), pp.1237-1240, Shanghai, China, 8-11 Aug., 2018
Kai Zhang*, Jie Li, et al, “Highly Thermal Conductive Transparent Die Attach Material for LEDs”, 17th Electronic Packaging Technology Conference (EPTC), Singapore, 2-4 Dec., 7412390, 2015, oral presented
Sheng-Yun Huang, Bo Zhao,Kai Zhang, et al, “Enhanced reduction of graphene oxide on recyclable copper foils to fabricate graphene films with superior thermal conductivity”, Scientific Reports 5, Article number: 14260, 2015
Zhaoli Gao, Xinfeng Zhang,Kai Zhang, et al, "Growth of Vertically Aligned Carbon Nanotube Arrays on Al Substrates Through Controlled Catalyst Diffusion", The Journal of Physical Chemistry C, Vol. 119, pp.15636-15642, 2015
Jie Li, Kai Zhang*, Xinfeng Zhang, Matthew Ming-Fai Yuen, Lisa Liu, Cheng Sheng Ku, “Enhancing the Thermal Conductivity of Silicone Composites by Increasing Crosslink Degree”, 15th International Conference on Electronic Packaging Technology (ICEPT), pp.329-333, Chengdu China, 12-15 Aug., 2014
Hu-Ming Ren,Kai Zhang, et al, “Preparation and performance of Ag-coated Cu flakes filled epoxy as electrically conductive adhesives”, Journal of Solid State Lighting, Vol.1, Article No.10, 2014
Sheng-Yun Huang,Kai Zhang, et al, “Facile synthesis of flexible graphene-silver composite papers with promising electrical and thermal conductivity performances”, RSC Adv., Vol.4, pp.34156-34160, 2014
Zhihua Cao,Kai Zhang, et al, “High Performance Phase Change Thermal Interface Materials Based on Porous Graphitic Carbon Spheres-Paraffin Wax Composite”, 64th IEEE Electronic Components and Technology Conference (ECTC), pp. 464-469, San Diego, CA, USA, 27-30 May, 2014
Kai Zhang*, Xinfeng Zhang, et al, “Thermal improvement of die attach by using PDMS-grafted particles as filler and Its application in solid state lighting”, 14th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.146-152, Wroclaw, Poland, 14-17 April, 2013, oral presented
Xinfeng Zhang,Kai Zhang, et al, “Highly conductive die attach adhesive from percolation control and its applications in light emitting device thermal management”, Appl. Phys. Lett., Vol.102, 014101, 2013
Kai Zhang*, Xinfeng Zhang, et al, “Thermal Improvement of Die Attach with Iodine Treatment and Its Application in Solid State Lighting”, 13th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.231-234, Cascais, Portugal, 16-18 April, 2012, oral presented
Kai Zhang*, David G.W. Xiao, et al, "Novel Cooling Solutions for LED Solid State Lighting”, 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT&HDP), pp.1128-1132, Shanghai, China, 8-11 Aug., 2011, oral presented,Award: Philips Outstanding Paper
Kai Zhang*, Haibo Fan, et al, “Thermal Performance of LED Packages for Solid State Lighting with Novel Cooling Solutions”, 12th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp.121, Linz, Austria, 18-20 April, 2011, oral presented,Keynote
Zhaoli Gao,Kai Zhang, et al, “Fabrication of carbon nanotube thermal interface material on aluminum alloy substrates with low pressure CVD”, Nanotechnology, Vol.22, 265611, 2011
Chong Li, Hai-Bo Fan, Kai Zhang, et al, “Flow dependence of interfacial thermal resistance in nanochannels”, Journal of Chemical Physics, Vol.132, 094703, 2010
H.B. Fan,Kai Zhang, et al, “The interfacial thermal conductance between a vertical single-wall carbon nanotube and a silicon substrate”, Journal of Applied Physics, Vol.106, 034307, 2009
Kai Zhang*, Y Chai, Matthew M.F. Yuen, et al, “Carbon nanotube thermal interface material for high-brightness light-emitting-diode cooling”, Nanotechnology, Vol.19, 215706, 2008
Kai Zhang*, Matthew M.F. Yuen, et al, “Directly Synthesizing CNT-TIM on Aluminum Alloy Heat sink for HB-LED Thermal Management”, 58th IEEE Electronic Components and Technology Conference (ECTC), pp.1659-1663, Orlando, FL, USA, 27-30 May, 2008, oral presented
Kai Zhang*, Matthew M.F. Yuen, et al, “Fabrication of High Thermal Conductivity Carbon Nanotube Arrays by Self Assembled Fe3O4 particles”, CIRP Annals, Vol.56, pp. 245-248, 2007
Kai Zhang*, Matthew M.F. Yuen, "Heat spreader with aligned CNTs designed for thermal management of HB-LED packaging and microelectronic packaging”, 7th International Conference on Electronic Packaging Technology (ICEPT), pp.479-482, Shanghai, China, 26-29 Aug., 2006, oral presented,Award: Philips Best Paper
Kai Zhang*, Matthew M.F. Yuen, N. Wang, J.Y. Miao, David G.W. Xiao, H.B. Fan, “Thermal Interface Material with Aligned CNT and Its Application in HB-LED Packaging”, 56th IEEE Electronic Components and Technology Conference (ECTC), pp.177-182, San Diego, CA, USA, 30 May-2 June, 2006, oral presented
Kai Zhang*, David G. W. Xiao, Cell K.Y. Wong, H.W. Gu, Matthew M.F. Yuen, Philip C.H. Chan, Bing Xu, “Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High Brightness LED Packaging with Flip Chip”, 55th IEEE Electronic Components and Technology Conference (ECTC), pp.60-65, Orlando, FL, USA, 31 May-4 June, 2005, oral presented,Award: 2005 Motorola/IEEE CPMT Graduate Student Fellowship for Research on Electronic Packaging
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