赵修臣 - 北京理工大学

个人简介

现任材料加工系党支部书记、电子封装技术专业责任教授、国防科技工业元器件封装技术创新中心专家委员会委员，先后获得北京市本科毕业论文优秀指导教师、北京理工大学优秀共产党员、三育人先进个人、优秀班主任等荣誉称号。主讲《电子制造工程导论》、《微连接原理》、《电子封装工艺》、《焊接工程基础》等本科生课程。先后主持并参与完成了科工局基础科研、国家科技支撑、总装预研、总装预研基金及航天创新基金等数十项科研工作，在国内外学术期刊发表SCI和EI论文百余篇，获批国家发明专利十余项，并获得中国产学研合作创新成果二等奖。

研究领域

电子封装互连材料研究先进电子封装工艺与可靠性研究微纳材料制备及应用研究新型合金制备及性能研究

近期论文

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Electromagnetic wave absorption performance and electrochemical properties of multifunctional materials:Air@Co@Co3Sn2@SnO2 hollow sphere/reduced graphene oxide composites[J].CHEMICAL ENGINEERING JOURNAL,2021,420：130479 A first-principles computation-driven mechanism study on the solders dilute doping effects to η’-Cu6Sn5 growth kinetics[J]. JOURNAL OF MATERIALS SCIENCE,2021,56:9741–9753 Effects of endogenous Al and Zn phases on mechanical properties of Sn58Bi eutectic alloy[J]. MATERIALS CHARACTERIZATION,2021,175：111089 Effects of minor alloying with Ge and In on the interfacial microstructure between Zn-Sn solder alloy and Cu substrate[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2020,831：154812 Improvement of microstructure and tensile properties of Sn-Bi-Ag alloy by heterogeneous nucleation of beta-Sn on Ag3Sn[J]. MATERIALS SCIENCE AND ENGINEERING A,2020,785：139372 Facile synthesis of RGO/Co@Fe@Cu hollow nanospheres with efficient broadband electromagnetic wave absorption[J].CHEMICAL ENGINEERING JOURNAL,2019,372:1-11 Facile, Large-Scale, and Expeditious Synthesis of Hollow Co and Co@Fe Nanostructures: Application for Electromagnetic Wave Absorption[J]. JOURNAL OF PHYSICAL CHEMISTRY C,2017,121：8557-8568 Vertically porous nickel thin film supported Mn3O4 for enhanced energy storage performance[J]. JOURNAL OF COLLOID AND INTERFACE SCIENCE,2016,483:17-25 Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2015, 627：39-47 电子软钎焊连接技术，译著，北京理工大学出版社，2021