任华 - 南京大学 - 现代工程与应用科学学院

研究领域

1.功能高分子材料 2.纤维增强复合材料 3.高性能环氧树脂 4.粉末涂料

近期论文

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[1] Ren H, Sun JZ, Wu BJ, Zhou QY, Synthesis and characterization of a novel epoxy resin containing naphthyl/dicyclopentadiene moieties and its cured polymer, Polymer, 2006, 47, 8309-8315. [2] Ren H, Sun JZ, Wu BJ, Zhou QY, Synthesis and properties of a novel novolac curing agent containing naphthyl and dicyclopentadiene moieties, Chin. J. Chem. Eng., 2007, 15:1, 127-131. [3] Ren H, Sun JZ, Wu BJ, Zhou QY, Synthesis and properties of a phosphorus-containing flame retardant epoxy resin based on bis-phenoxy (3-hydroxy) phenyl phosphine oxide, Polym. Degrad. Stabil., 2007, 92, 956-965. [4] Ren H, Sun JZ, Zhao Q, Zhou QY, Ling Qincai, Synthesis and characterization of a novel heat resistant epoxy resin based on N,N’-bis(5-hydroxy-1-naphthyl)pyromellitic diimide, Polymer, 2008, 49, 5249-5256 [5] Ren H, Sun JZ, Zhao Q, Cai ZQ, Ling QC, Zhou QY, Cure kinetics of an epoxy resin containing naphtyl/dicyclopentadiene moieties and bis-phenoxy (3-hydroxy) phosphine oxide system and properties of its cured polymer, J. Appl. Polym. Sci., 2009, 112, 761-770. [6] Ren H, Chen WN, Fan L, Study on the cure kinetics of a silicone-modified waterborne epoxy curing agent by the advanced isoconversional method, Polym-Plast. Tech. Eng. , 2010,49:8, 836-841. [7] Ren H, Xiao J, Chen WN, Preparation of epoxy resin based on 1,5-naphthalenediol and its application in carbon fiber-reinforced composites, Polym-Plast. Tech. Eng. , 2011, 50: 6, 599-604. [8] Ren H, Tang SC, Syed J.A., Meng XK, A naphthyl-imide based epoxy resin: cure kinetics and application in carbon fiber reinforced composites, High Perform. Polym. , 2012, 24(7): 580-588 [9] Ren H, Meng XK, Preparation of Z-pin from different resin and evaluation of interlaminar reinforcement effect by pullout test,Adv. Mater. Res. 2012,486,444-446. [10]Ren H, Tang SC, Syed J.A.,Meng XK, Incorporation of silver nanoparticles coated with mercaptosuccinic acid/poly (ethylene glycol) copolymer into epoxy for enhancement of dielectric properties, Mater. Chem.Phys. 2012, 673-680