卢启军 - 西安电子科技大学

个人简介

教育经历 2012.08-2015.09 西安电子科技大学微电子学与固体电子学工学博士学位 2009.08-2012.03 西安电子科技大学电力电子与电力传动工学硕士学位 2005.10-2009.07 西安理工大学电子科学与技术工学学士学位工作经历 2020.05-至今西安电子科技大学微电子学院副教授/硕士生导师 2018.06-2020.04 西安电子科技大学微电子学院讲师/硕士生导师 2017.11-2018.05 西安电子科技大学微电子学院讲师 2015.11-2017.10 西安电子科技大学微电子学院师资博士后/讲师

研究领域

硅基射频集成电路与系统（低噪声放大器、功率放大器、混频器、锁相环、频率综合器、无源电路等）硅基微波/毫米波有源相控阵一体化集成收发系统（低噪声放大器、功率放大器、移相器、衰减器、混频器等）相控阵封装天线（微带天线、背腔天线、缝隙天线等）三维集成系统（TSV模型及SI、硅基集成化无源器件等）

近期论文

查看导师新发文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Tao Zhang, Qijun Lu*, Zhangming Zhu, Jincan Hu, Haiyang Xia, Lianming Li, and Tiejun Cui, “Milimeter-Wave Antenna-in-Package Applications Based on D263T Glass Substrate,” IEEE Access, 8: 67921−67928, Apr. 2020. Qijun Lu, Zhangming Zhu*, Guangbao Shan, Yang Liu, Xiaoxian Liu, and Xiangkun Yin, “3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Milimeter-Wave Applications,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(9): 1855−1862, Sep. 2019. Guangbao Shan, Qijun Lu*, Song Liu, and Yintang Yang, “Through-Silicon Capacitor Interconnection for High Frequency 3-D Microsystem,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(7): 1310−1318, Jul. 2019. Qijun Lu, Zhangming Zhu*, Yang Liu, Xiaoxian Liu, and Xiangkun Yin, “Wideband Electromagnetic Modeling of Coaxial- Annular Through-Silicon Vias,” IEEE Transactions on Electromagnetic Compatibility, 60(6): 1915−1922, Dec. 2018. Jianqin Deng, Qijun Lu*, Yingtang Yang, and Zhangming Zhu, “A 110-170 GHz Spatial Power-Combined Frequency Tripler with 5.7%-7.8% Efficiency and 0.5 W Power Handling,” Microwave and Optical Technology Letters, 60(5): 1079−1085, May 2018. Qijun Lu*, Zhangming Zhu, Yintang Yang, Ruixue Ding, and Yuejin Li, “Closed-Form Internal Impedance Model and Characterization of Mixed Carbon Nanotube Bundles for Three-Dimensional Integrated Circuits,” Chinese Physics B, 27(1): 017303, Jan. 2018. Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, and Yuejin Li, “High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(12): 2036−2044, Dec. 2017. Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, and Yuejin Li, “Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias,” IEEE Transactions on Nanotechnology, 16(4): 695−702, Jul. 2017. Qijun Lu, Zhangming Zhu*, Yintang Yang, and Ruixue Ding, “Analysis of Propagation Delay and Repeater Insertion in Single-Walled Carbon Nanotube Bundle Interconnects,” Microelectronics Journal, 54: 85−92, Jul. 2016. Qijun Lu, Zhangming Zhu*, Yintang Yang, and Ruixue Ding, “Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias,” IEEE Transactions on Electron Devices, 62(5): 1544−1552, May 2015. Qijun Lu, Zhangming Zhu*, Yintang Yang, and Ruixue Ding, “Influence of Temperature on the Conductivity of Multi-Walled Carbon Nanotube Interconnects,” Chinese Physics Letters, 32(4): 047305, Apr. 2015. Qijun Lu, Zhangming Zhu*, Yintang Yang, and Ruixue Ding, “Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs,” IEEE Microwave and Wireless Components Letters, 24(5): 294−296, May 2014. Qijun Lu, Zhangming Zhu*, Yintang Yang, and Ruixue Ding, “Type of Distortionless Through Silicon Via Design Based on the Multiwalled Carbon Nanotube,” IET Micro & Nano Letters, 8(12): 869−871, Dec. 2013.