杭弢 - 上海交通大学 - 材料科学与工程学院

个人简介

2000至2004 上海交通大学材料科学与工程学院本科毕业 2004至2010 上海交通大学材料科学与工程学院博士毕业 2007至2008 美国密西根大学材料科学与工程系联合培养 2010至2013 日本早稻田大学应用化学系博士后 2013至2014 上海交通大学材料科学与工程学院讲师 2014至今上海交通大学材料科学与工程学院副教授

研究领域

电化学纳米技术

近期论文

查看导师新发文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Y Wu, T Hang*, J. Komadina, H Ling and M Li. High-adhesive superhydrophobic 3D nanostructured silver films applied as sensitive, long-lived, reproducible and recyclable SERS substrates. Nanoscale, 2014, 6, 9720. X Qian, T Hang*, H Nara, T Yokoshima, M Li and T Osaka. Electrodeposited three-dimensional porous SieOeC/Ni thick film as high performance anode for lithium-ion batteries. J. Power Sources, 2014, 272, 794. T Hang, D Mukoyama, H Nara, T Yokoshima, T Momma, M Li and T Osaka*. Electrochemical impedance analysis of electrodeposited Si-O-C composite thick film on Cu microcones-arrayed current collector for lithium ion battery anode. J. Power Sources, 2014, 256, 226. Y Wu, T Hang*, Z Yu, L Xu and M Li. Lotus leaf-like dual-scale silver film applied as a superhydrophobic and self-cleaning substrate. Chem. Comm., 2014, 50, 8405. J Sanetuntikul, T Hang* and S Shanmugam. Hollow nitrogen-doped carbon spheres as efficient and durable electrocatalysts for oxygen reduction. Chem. Comm., 2014, 50, 9473. H Cao, T Hang*, H Ling, L Gao, and M Li. Linear Sweep Voltammetric Study on the Copper Electrodeposition of Though-Silicon-Vias. J. Electrochem. Soc., 2014, 161, D349. Y Wu, T Hang*, N Wang, Z Yu and M Li. Highly durable non-sticky silver film with a microball-nanosheet hierarchical structure prepared by chemical deposition substrates. Chem. Comm., 2013, 49, 10391. T Hang, H Nara, T Yokoshima, T Momma and T Osaka*. Silicon composite thick film electrodeposited on a nickel micro-nanocones hierarchical structured current collector for lithium batteries. J. Power Sources, 2013, 222, 503. T Hang, D Mukoyama, H Nara, N Takami, T Yokoshima, T Momma and T Osaka*. Electrochemical impedance spectroscopy analysis for lithium-ion battery using Li4Ti5O12 anode. J. Power Sources, 2013, 222, 442. H Cao, T Hang*, H Ling and M Li, Behaviors of Chloride Ions in Methanesulfonic Acid Bath for Copper Electrodeposition of Through-Silicon-Via. J. Electrochem. Soc., 2013, 160, D146.