董显平 - 上海交通大学 - 材料科学与工程学院

个人简介

教育经历 1985-09 ~ 1989-06 南昌大学机械系学士 1992-09 ~ 1995-06 哈尔滨工业大学材料科学与工程学院硕士 1998-09 ~ 2003-06 上海交通大学材料科学与工程学院博士工作经历 1989-01 ~ 1992-01 江西省永平耐酸泵厂助理工程师 1995-01 ~ 2003-01 上海交通大学材料科学与工程学院讲师 2004-01 ~ 至今上海交通大学材料科学与工程学院副研究员

研究领域

研究方向一高温结构材料研究方向二电子薄膜材料长期从事高温合金、耐热钢、硅系金属间化合物及其环境稳定性等方面的研究。研究主题涉及：新型耐热钢、镍基高温合金、高熵合金、金属间化合物材料等的高温强韧化机制及其冶炼与成型技术；溅射靶材与薄膜性能之间非线性关系机理；材料氧化与腐蚀等。历年来主要主持或参与的纵向科研项目近20项（其中包括“973”计划项目、 “863”计划项目、国家重点研发计划项目、国家自然科学基金重点项目、国家自然科学基金面上项目、上海市科委重大科技项目、上海市科委重点科技项目、上海市科委面上或专项基金项目等）；并与宝钢集团、上海电气集团、广东风华高新科技股份有限公司、中国振华集团云科电子有限公司等大型企业进行课题合作研究，主持横向科研项目30余项。期间，申请国家发明专利10余项，发表论文100余篇（其中多数为SCI收录期刊）。获中国航天工业总公司科技进步三等奖一项、上海市科技进步三等奖一项、上海市发明专利二等奖一项。

近期论文

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Yuqin Zhang, Xianping Dong* and Jiansheng Wu. Corrosion behavior of sputtered Cr-Si-Ni resistive films in acidic and alkaline environments. Material Chemistry and Physics, 2005,93: 348~355. Xianping Dong and Jiansheng Wu. The effect of zirconium on the crystallization behavior and electrical properties of Cr-Si-Al resistive films. Material Science and Engineering A, 2004,371(1/2): 1~8. Xianping Dong and Jiansheng Wu. The role of aluminum in the crystallization of Cr-Si-Ni resistive films. Material Science and Engineering A, 2003,339(1/2): 297~301. Dong XP and Wu JS. Study on the crystallization of amorphous Cr-Si-Ni thin films using in situ X-ray diffraction. J. Mater. Sci. Technol., 2001, 17: s43-46. Xianping Dong and Jiansheng Wu. Formation of an intermetallic phase by crystallization in Cr-Si-Ni-Al amorphous films. Journal of Alloys and Compounds, 2003，359(1):256~260. Zhang B, Dong XP*, Xu XF and Wu JS. Preparation and characterization of tantalum-doped indium tin oxide films deposited by magnetron sputtering, Scripta Materialia, 2008,58: 203-206. Wang XJ, Dong XP*, Wu JS. Effects of Cr dopant on the microstructure and electromigration performance of Cu interconnects. Applied Surface Science, 2009,255: 9273–9278. Xianping Dong and Jiansheng Wu. The crystallization of Cr-Si-Ni-Al amorphous films: Nucleation and growth of intermetallic phase Cr(Al,Si)2. Intermetallics, 2003，11(8):779~785. Wang XJ, Dong XP*, Jiang CH, Wu JS. The effect of chromium dopant on the microstructure and mechanical properties of sputter-deposited copper films. Surface & Coatings Technology, 2009,203(20-21): 3005–3010 Bingbing Zhao, Jifu Fan, Ze Chen, Xianping Dong*, Feng Sun, Lanting Zhang. Evolution of precipitates in a Cu-containing alumina-forming austenitic steel after short-term mechanical tests, Materials Characterization, 2017, 125: 37-45. Xianping Dong, Bo Zhang and Jiansheng Wu. Optical-electrical properties and corrosion behavior of tantalum-doped indium tin oxide film deposited by magnetron sputtering. Materials Science Forum，2010,638-642: 2897-2902. Bingbing Zhao, Jifu Fan, Yize Liu, Lin Zhao, Xianping Dong*, Feng Sun, Lanting Zhang. Formation of L12-ordered precipitation in an alumina-forming austenitic stainless steel via Cu addition and its contribution to creep/rupture resistance, Scripta Materialia, 2015, 109: 64-67. Kai Zhang, Hongyuan Wen, Bingbing Zhao, Xianping Dong*, Lanting Zhang. Precipitation behavior and its impact on mechanical properties in an aged carbon-containing Al0.3Cu0.5CrFeNi2 high-entropy alloy. Materials Characterization, 2019,155:109792 Xianping Dong, Lin Zhao, Feng Sun, Lanting Zhang. Strengthing of an Al-containing austenitic stainless steel at high temperature. Proceedings of ASME Turbo Expo 2013, San Antonio, Texas, USA, June 3-7, 2013. pp. V05AT21A007. Bingbing Zhao, Kaichen Chang, Jifu Fan, Ze Chen, Xianping Dong*, Lanting Zhang. Annealing effects on precipitation and high-temperature properties of a Cu-containing alumina-forming austenitic steel. Materials Letters, 2016, 176: 83-86.