当前位置: X-MOL首页全球导师 国内导师 › 孟焱

研究领域

(1)超支化材料的制备和性能 低介电材料,高强高韧材料,光致发光材料 (2)高性能热固性材料 高强高韧和低介环氧制备,固化动过程的优化和残余应力控制 (3)有机无机杂化材料和高分子合金 (4)高聚物的黏弹性(讲授高聚物黏弹性与松弛研究生课程) 材料的物理老化和长储性能,应用流变学 (5)高聚物的热分析

近期论文

查看导师新发文章 (温馨提示:请注意重名现象,建议点开原文通过作者单位确认)

(1)Y. Meng and S.L. Simon,Relation between Mobility Factor and Diffusion Factor for Thermoset Cure,Thermochim. Acta, 437(1-2): 179 (2005). (2)Y. Meng and S.L. Simon,Pressure Relaxation of Polystyrene and its Comparison to Shear Response, J. Polym. Sci., Part B: Polym. Phys., 45:3375 (2007). (3)Y. Meng, P. Bernazzani, P.A. O’Connell, G.B. McKenna and S.L. Simon,A New Pressurizable Dilatometer for Measuring the Time-Dependent Bulk Modulus and PVT Properties of Polymeric Materials,Rev. Sci. Instrum., 80, 053903 (2009). (4)Yan Meng and Joshua U Otaigbe,Mechanism of unexpected viscosity decrease of polymer melts by low-Tg inorganic phosphate glass during processing,Appl. Rheol. 21(4): 42654 (2011). (5)Qi Li, Xiaoyu Li, Yan Meng, Curing of DGEBA epoxy using a phenol-terminated hyperbranched curing agent: Cure kinetics, gelation, and the TTT cure diagram, Thermochim. Acta, 549: 69–80 (2012)

推荐链接
down
wechat
bug