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个人简介

• Listed in ISI HighlyCited.com in the field of Materials Science • Fellow, American Physical Society • Fellow, Polymer Materials Science & Engineering Div., American Chemical Society • Honorary Professor, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences • International Adhesion Society (94 Japan) Award • Research Excellence Award, College of Engineering, U. of Michigan, 2002 • Honorary Professor, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, 2001 • Karakash Lecturer, Lehigh University, Sept., 1991 • Invited Professor, Swiss Federal Institute of Technology at Lausanne, 92 - 93 • Visiting Monbushu Professor, Research Inst. for Applied Mechanics, Kyushu University, Japan, 1990-1991. • Best Paper Award, Div. of Plastics Analysis, Soc. of Plastics Engineers ANTEC 1995, Boston • Best Paper Award, Div. Rubber Chemistry, ACS, Philadelphia Meeting 1982

研究领域

Polymer/Materials/Nanoscience

近期论文

查看导师新发文章 (温馨提示:请注意重名现象,建议点开原文通过作者单位确认)

Sun NJ, Yee AF, Nanovoid Relaxation in a Series of Copolyester Glasses under Cyclic Loading Studied Using a New Technique: Synchronous PALS, accepted for publication in J. Polym Sci B: Polym Phys. Yim EKF, Reano RM, Pang SW, Yee AF, Chen CS, Leong KW, Nanopattern-induced changes in morphology and motility of smooth muscle cells , BIOMATERIALS 26: 5405, 2005 Wang K, Chen L, Wu JS, Toh ML, He CB, Yee AF, Epoxy nanocomposites with highly exfoliated clay: Mechanical properties and fracture mechanisms, MACROMOLECULES 38 (3): 788, 2005 Kong YP, Low HY, Pang SW, Yee AF, Duo-mold imprinting of three-dimensional polymeric structures, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 22 (6): 3251 2004 Reano RM, Kong YP, Low HY, Tan L, Wang F, Pang SW, Yee AF, Stability of functional polymers after plasticizer-assisted imprint lithography JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 22 (6): 3294, 2004 Tan L, Kong YP, Pang SW, Yee AF, Imprinting of polymer at low temperature and pressure, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 22 (5): 2486, 2004 Li XY, Yee AF, Design of mechanically robust high-T-g polymers: Mechanical properties of glassy poly(ester carbonate)s with cyclohexylene rings in the backbone, MACROMOLECULES 37 (19): 7231, 2004 Kong YP, Tan L, Pang SW, Yee AF, Stacked polymer patterns imprinted using a soft inkpad, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 22 (4): 1873, 2004 Choi J, Yee AF, Laine RM, Toughening of cubic silsesquioxane epoxy nanocomposites using core-shell rubber particles: A three-component hybrid system, MACROMOLECULES 37: (9) 3267, 2004 Tan L, Kong YP, Bao LR, Huang XD, Guo LJ, Pang SW, Yee AF, Imprinting polymer film on patterned substrates, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 21: (6) 2742, 2003 Bao LR, Tan L, Huang XD, Kong YP, Guo LJ, Pang SW, Yee AF, Polymer inking as a micro- and nanopatterning technique, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 21: (6) 2749, 2003 Li XY, Yee AF, Design of mechanically robust high-T-g polymers: Synthesis and dynamic mechanical relaxation behavior of glassy poly(ester carbonate)s with cyclohexylene rings in the backbone, MACROMOLECULES 36: (25) 9411, 2003 Li XY, Yee AF, Design of mechanically robust high-T-g polymers: Physical properties of glassy poly(ester carbonate)s with cyclohexylene rings in the backbone, MACROMOLECULES 36: (25), 9421, 2003 Lee SS, Yee AF, Temperature-dependent transition of deformation mode in poly(1,4-cyclohexylenedimethylene terephthalate)/poly(ethylene terephthalate) copolymers, MACROMOLECULES 36: (18), 6791, 2003 Choi J, Yee AF, Laine RM, Organic/inorganic hybrid composites from cubic silsesquioxanes. Epoxy resins of octa(dimethylsiloxyethylcyclohexylepoxide) silsesquioxane, MACROMOLECULES 36: (15), 5666, 2003 Li L, Yee AF, Effect of the scale of local segmental motion on nanovoid growth in polyester copolymer glasses, MACROMOLECULES 36: (8), 2793, 2003 Huang XD, Bao LR, Cheng X, Guo LJ, Pang SW, and Yee AF, Reversal imprinting by transferring polymer from mold to substrate, J VAC SCI TECHNOL B 20 (6): 2872, 2002 Bao LR, Cheng X, Huang XD, Guo LJ, Pang SW, and Yee AF, Nanoimprinting over topography and multilayer three-dimensional printing, J VAC SCI TECHNOL B 20 (6): 2881, 2002

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