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Effect of Ti addition on the wetting and brazing of Sn0.3Ag0.7Cu filler on SiC ceramic
Journal of the American Ceramic Society ( IF 3.5 ) Pub Date : 2018-12-21 , DOI: 10.1111/jace.16245 Mianmian Li 1 , Xiaoguo Song 1, 2 , Shengpeng Hu 1, 2 , Zubin Chen 1, 2 , Yanyu Song 1 , Chaonan Niu 1, 2
Journal of the American Ceramic Society ( IF 3.5 ) Pub Date : 2018-12-21 , DOI: 10.1111/jace.16245 Mianmian Li 1 , Xiaoguo Song 1, 2 , Shengpeng Hu 1, 2 , Zubin Chen 1, 2 , Yanyu Song 1 , Chaonan Niu 1, 2
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The wetting behavior of Sn0.3Ag0.7Cu (SAC) filler with the addition of Ti on SiC ceramic was investigated using sessile drop method. SiC/SiC was brazed by SAC‐Ti filler with different Ti content at 1223 K (950°C) for 10 minutes. The wettability of SAC‐Ti filler on SiC was significantly enhanced with the addition of Ti. The contact angle decreased at first and then increased with increasing Ti content. The lowest contact angle of 9° was obtained with SAC‐1.5Ti (wt%) filler. When Ti content further increased to 2.0 wt%, the contact angle increased, due to the intense reaction of Ti–Sn. The reaction between Ti and SiC controlled the wetting behavior of SAC‐Ti on the SiC substrate and the reaction products such as TiC and Ti5Si3 were formed. The wetting of SAC‐Ti on SiC was reaction‐controlled. Interfacial reaction products TiC and Ti5Si3 were observed. The wetting activation energy in spreading stage was calculated to be 129.3 kJ/mol. Completely filled SiC/SiC joints were obtained using the filler with Ti content higher than 0.5 wt%. The fillet height increased firstly then decreased with mounting Ti content. The shear strength of joints increased first with the addition of Ti then decreased with Ti content increasing to 2.0 wt%. The highest shear strength of 35.7 MPa was obtained with SAC‐1.5 Ti (wt%) filler.
中文翻译：
钛添加对SiC陶瓷上Sn0.3Ag0.7Cu填料润湿和钎焊的影响
采用无滴法研究了在SiC陶瓷上添加Ti的Sn0.3Ag0.7Cu（SAC）填料的润湿行为。SiC / SiC由具有不同Ti含量的SAC-Ti钎料在1223 K（950°C）钎焊10分钟。添加Ti可以大大提高SAC-Ti填料在SiC上的润湿性。接触角首先减小，然后随着Ti含量的增加而增加。使用SAC-1.5Ti（wt％）填料可获得9°的最低接触角。当Ti含量进一步增加到2.0 wt％时，由于Ti-Sn的强烈反应，接触角增加。Ti和SiC之间的反应控制了SAC-Ti在SiC衬底上以及TiC和Ti 5 Si 3等反应产物的润湿行为形成了。SAC-Ti在SiC上的润湿是受反应控制的。观察到界面反应产物TiC和Ti 5 Si 3。铺展阶段的湿活化能经计算为129.3 kJ / mol。使用Ti含量高于0.5 wt％的填料可获得完全填充的SiC / SiC接头。圆角的高度首先随着安装的Ti含量而增加，然后降低。接头的剪切强度首先随着添加Ti而增加，然后随着Ti含量增加到2.0 wt％而降低。使用SAC-1.5 Ti（wt％）填料可获得35.7 MPa的最高剪切强度。
更新日期：2018-12-21
中文翻译：
钛添加对SiC陶瓷上Sn0.3Ag0.7Cu填料润湿和钎焊的影响
采用无滴法研究了在SiC陶瓷上添加Ti的Sn0.3Ag0.7Cu（SAC）填料的润湿行为。SiC / SiC由具有不同Ti含量的SAC-Ti钎料在1223 K（950°C）钎焊10分钟。添加Ti可以大大提高SAC-Ti填料在SiC上的润湿性。接触角首先减小，然后随着Ti含量的增加而增加。使用SAC-1.5Ti（wt％）填料可获得9°的最低接触角。当Ti含量进一步增加到2.0 wt％时，由于Ti-Sn的强烈反应，接触角增加。Ti和SiC之间的反应控制了SAC-Ti在SiC衬底上以及TiC和Ti 5 Si 3等反应产物的润湿行为形成了。SAC-Ti在SiC上的润湿是受反应控制的。观察到界面反应产物TiC和Ti 5 Si 3。铺展阶段的湿活化能经计算为129.3 kJ / mol。使用Ti含量高于0.5 wt％的填料可获得完全填充的SiC / SiC接头。圆角的高度首先随着安装的Ti含量而增加，然后降低。接头的剪切强度首先随着添加Ti而增加，然后随着Ti含量增加到2.0 wt％而降低。使用SAC-1.5 Ti（wt％）填料可获得35.7 MPa的最高剪切强度。
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