电子结构：3D电子系统的机械引导后组装（Adv。Funct。Mater。48/2018）
Advanced Functional Materials
(
IF18.5
)
Pub Date : 2018-11-26, DOI: 10.1002/adfm.201870344
Bong Hoon Kim
1
,
Fei Liu
2
,
Yongjoon Yu
3
,
Hokyung Jang
3
,
Zhaoqian Xie
4,
5
,
Kan Li
4,
5
,
Jungyup Lee
3
,
Ji Yoon Jeong
3
,
Arin Ryu
3
,
Yechan Lee
3
,
Do Hoon Kim
3
,
Xueju Wang
1
,
KunHyuck Lee
1
,
Jong Yoon Lee
3
,
Sang Min Won
3
,
Nuri Oh
6
,
Jeonghyun Kim
7
,
Ju Young Kim
8
,
Seong‐Jun Jeong
9
,
Kyung‐In Jang
10
,
Seungmin Lee
11
,
Yonggang Huang
12
,
Yihui Zhang
2
,
John A. Rogers
13
Affiliation
Department of Materials Science and EngineeringSimpson Querrey Institute and Feinberg Medical SchoolCenter for Bio‐Integrated ElectronicsNorthwestern University Evanston IL 60208 USA
Center for Mechanics and MaterialsCenter for Flexible Electronics TechnologyAML, Department of Engineering MechanicsTsinghua University Beijing 100084 China
Frederick Seitz Materials Research LaboratoryUniversity of Illinois at Urbana‐Champaign Urbana IL 61801 USA
Department of Civil and Environmental EngineeringMechanical Engineering, and Materials Science and EngineeringNorthwestern University Evanston IL 60208 USA
AML, Department of Engineering MechanicsCenter for Mechanics and MaterialsTsinghua University Beijing 100084 China
Division of Materials Science and EngineeringHanyang University Seoul 04763 Republic of Korea
Department of Electronics Convergence EngineeringKwangwoon University Seoul 01897 Republic of Korea
Multidisciplinary Sensor Research GroupElectronics and Telecommunications Research Institute (ETRI) Daejeon 34129 Republic of Korea
Department of Organic Materials and Fiber EngineeringDepartment of Information CommunicationMaterials, and Chemistry Convergence TechnologySoongsil University 369 Sangdo‐ro Dongjak‐gu Seoul 06978 Republic of Korea
Department of Robotics EngineeringDaegu Gyeongbuk Institute of Science and Technology (DGIST) Daegu 42988 Republic of Korea
Department of Energy Electronics ConvergenceKookmin University Seoul 02707 Republic of Korea
Department of Civil and Environmental EngineeringMechanical EngineeringMaterials Science and EngineeringNorthwestern University Evanston IL 60208 USA
Department of Materials Science and EngineeringDepartment of Biomedical EngineeringDepartment of ChemistryDepartment of Neurological SurgeryDepartment of Mechanical EngineeringDepartment of Electrical Engineering and Computer ScienceSimpson Querrey Institute and Feinberg Medical SchoolCenter for Bio‐Integrated ElectronicsNorthwestern University Evanston IL 60208 USA
在编号1803149中，黄永刚，张艺慧，John A. Rogers和同事们介绍了确定性的组装过程，该过程将基于柔性印刷电路板（FPCB）平台的传统平面设备转换为具有3D架构的平面设备。与现成的已包装或未包装的组件完全兼容。3D FPCB技术的策略为利用最先进组件的多功能系统设计带来了立即机遇。
"点击查看英文标题和摘要"
Electronic Stuctures: Mechanically Guided Post‐Assembly of 3D Electronic Systems (Adv. Funct. Mater. 48/2018)
In article number 1803149, Yonggang Huang, Yihui Zhang, John A. Rogers, and co‐workers present deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off‐the‐shelf packaged or unpackaged component parts. The strategy to 3D FPCB technologies creates immediate opportunities for designs in multifunctional systems that leverage state‐of‐the‐art components.
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