Polyimide incorporated cyanate ester/epoxy copolymers for high‐temperature molding compounds,Journal of Polymer Science Part A: Polymer Chemistry

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Polyimide incorporated cyanate ester/epoxy copolymers for high‐temperature molding compounds
Journal of Polymer Science Part A: Polymer Chemistry Pub Date : 2018-10-05 , DOI: 10.1002/pola.29214
Fan Wu ₁ , Bo Song ₁ , Jinho Hah ₁ , Chia-Chi Tuan ₁ , Kyoung-Sik Moon ₁ , Ching-Ping Wong _{1,

2}

Affiliation

The rapid development of high‐power devices has driven the requirement for high‐temperature stable epoxy molding compounds. In this work, a designed polymer blend system consisting of cyanate ester/epoxy copolymers modified by polyimide (CE/EP‐PI) has been studied. Polyimide used in this study has shown excellent dispersity in the cyanate ester and epoxy copolymer network (CE/EP), exhibiting homogeneous phase with a denser polymer network structure. With this polymer blend structure, CE/EP‐PI system was proved to have a glass transition temperature as high as ~270 °C, increased modulus, and largely enhanced fracture toughness up to 2.06 MPa m^1/2. CE/EP‐PI resins showed outstanding long‐term stability at high temperature with low mass loss and increased fracture toughness after aging at 200 °C. This work provides a novel insight into the development of molding compounds based on polymer blends system with excellent high‐temperature properties. © 2018 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018, 56, 2412–2421

中文翻译：

含聚酰亚胺的氰酸酯/环氧共聚物，用于高温模塑化合物

大功率器件的快速发展推动了对高温稳定环氧模塑化合物的需求。在这项工作中，研究了一种由聚酰亚胺改性的氰酸酯/环氧共聚物（CE / EP-PI）组成的设计的聚合物共混体系。在这项研究中使用的聚酰亚胺在氰酸酯和环氧共聚物网络（CE / EP）中显示出优异的分散性，表现出均相且具有更致密的聚合物网络结构。通过这种聚合物共混物结构，证明CE / EP-PI体系的玻璃化转变温度高达〜270°C，具有更高的模量，并在高达2.06 MPa m ^{1/2的范围内}大大提高了断裂韧性。。CE / EP-PI树脂在高温下具有出色的长期稳定性，且质量损失低，并且在200°C时效后具有更高的断裂韧性。这项工作为基于具有优异高温性能的聚合物共混体系的模塑料的开发提供了新颖的见解。©2018 Wiley Periodicals，Inc.J.Polym。科学，A部分：Polym。化学 2018，56，2412-2421

更新日期：2018-10-05

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