Designed Assembly and Integration of Colloidal Nanocrystals for Device Applications,Advanced Materials

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Designed Assembly and Integration of Colloidal Nanocrystals for Device Applications
Advanced Materials ( IF 27.4 ) Pub Date : 2015-12-28 , DOI: 10.1002/adma.201502851
Jiwoong Yang _{1,

2} , Moon Kee Choi _{1,

2} , Dae-Hyeong Kim _{1,

2} , Taeghwan Hyeon _{1,

2}

Affiliation

Colloidal nanocrystals have been intensively studied over the past three decades due to their unique properties that originate, in large part, from their nanometer‐scale sizes. For applications in electronic and optoelectronic devices, colloidal nanoparticles are generally employed as assembled nanocrystal solids, rather than as individual particles. Consequently, tailoring 2D patterns as well as 3D architectures of assembled nanocrystals is critical for their various applications to micro‐ and nanoscale devices. Here, recent advances in the designed assembly, film fabrication, and printing/integration methods for colloidal nanocrystals are presented. The advantages and drawbacks of these methods are compared, and various device applications of assembled/integrated colloidal nanocrystal solids are discussed.

中文翻译：

用于设备应用的胶体纳米晶体的设计组装和集成

在过去的三十年中，胶体纳米晶体已经得到了广泛的研究，这是由于它们的独特特性在很大程度上是由其纳米级尺寸引起的。为了在电子和光电子设备中的应用，胶体纳米颗粒通常被用作组装的纳米晶体固体，而不是作为单个颗粒。因此，对组装后的纳米晶体的2D图案和3D体系结构进行定制，对于将其应用于微米级和纳米级设备至关重要。在这里，介绍了胶体纳米晶体的设计组装，薄膜制造和印刷/集成方法的最新进展。比较了这些方法的优缺点，并讨论了组装/整合的胶体纳米晶体固体的各种设备应用。

更新日期：2015-12-28

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