For the design of the semiconductor packaging material, one of the most important challenges is to overcome the higher thermal expansion property of ‘organic’ epoxy composite than that of the ‘inorganic’ IC chip. Therefore, in order to prepare the epoxy composite with the ultra-low coefficient of thermal expansion (CTE), the new material class of epoxy, i.e., alkoxysilyl-functionalized novolac epoxy (Si(OEt)₃-EOCN) was synthesized using the ortho-cresol novolac epoxy (EOCN) as a starting material. The new epoxy composite with the 85wt% of silica showed the CTE1 (at T < Tg) of 8 ppm/°C and CTE2 (at T > Tg) of 11 ppm/°C. Note that before alkoxysilyl-modification, the CTE1 and CTE 2 of the EOCN composite were 13 ppm/°C and 44 ppm/°C, respectively. In addition, the alkoxysilyl-functionalized epoxy was observed to show the unique curing chemistry due to the participation of alkoxysilyl group in epoxy curing reaction. In order to understand the chemistry of alkoxysilyl-functionalized epoxy, the reaction mechanism was studied using the model compounds.

对于半导体封装材料的设计，最重要的挑战之一是克服“有机”环氧复合材料比“无机” IC芯片更高的热膨胀性能。因此，为了制备具有超低热膨胀系数（CTE）的环氧复合材料，新的环氧材料类别，即烷氧基甲硅烷基官能化的线型酚醛清漆环氧树脂（Si（OEt）₃ -EOCN）合成了邻甲酚酚醛清漆环氧树脂（EOCN）作为起始原料。具有85wt％二氧化硅的新型环氧复合材料的CTE1（在T <Tg时）为8 ppm /°C，CTE2（在T> Tg时）为11 ppm /°C。请注意，在烷氧基甲硅烷基改性之前，EOCN的CTE1和CTE 2复合材料分别为13ppm /℃和44ppm /℃。另外，由于烷氧基甲硅烷基基团参与环氧固化反应，因此观察到烷氧基甲硅烷基官能化的环氧树脂显示出独特的固化化学。为了了解烷氧基甲硅烷基官能化环氧的化学性质，使用模型化合物研究了反应机理。