To achieve high-T g and low-dielectric epoxy thermosets, four dicyclopentadiene-derived polyarylates (26-P, 26-M, 236-P, and 236-M) were prepared from 2,6-dimethyl (or 2,3,6-trimethyl) phenol-dicyclopentadiene adduct with terephthaloyl (or isophthaloyl) chloride by high-temperature solution polymerization. The resulting polyarylates, exhibiting active ester linkages (Ph-O-(C=O)-) are found to be reactive toward a commercial dicyclopentadiene phenol epoxy (HP7200) in the presence of some lone-pair electron-containing compounds. Five compounds including 4-dimethylaminopyridine (DMAP), imidazole, 2-methylimidazole, triphenylphosphine, and triphenylimidazole have been evaluated as a catalyst for the curing reactions. We found that DMAP, with the smallest pK b among them, is the best catalyst according to differential scanning calorimetry, infrared, and thermal analyses. The thermal and dielectric properties of the polyarylate/HP7200 thermosets are evaluated. We found that they exhibit a high T g characteristic (e.g., T g is 238 °C for DMAP-catalyzed, 236-P/HP7200 thermoset). Furthermore, because of the hydrophobic methyl and cycloaliphatic moieties, and the secondary hydroxyl-free structure, polyarylate/HP7200 thermosets show a relative low-dielectric constant of around 2.75 U. The detailed structure-properties relationship is discussed in this work.

中文翻译：

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使用二环戊二烯衍生的多芳基酸酯作为环氧固化剂可实现高T g和低介电环氧树脂热固性。

为实现高T g和低介电环氧树脂热固性，从2,6-二甲基（或2,3,3通过对苯二甲酰氯（或间苯二甲酰氯）的高温溶液聚合，使6-三甲基）苯酚-二环戊二烯加成物。发现在某些孤对含电子化合物的存在下，显示出具有活性酯键（Ph-O-（C = O）-）的所得多芳基化物可与商业化的二环戊二烯酚环氧树脂（HP7200）发生反应。已经评估了包括4-二甲基氨基吡啶（DMAP），咪唑，2-甲基咪唑，三苯基膦和三苯基咪唑的五种化合物作为固化反应的催化剂。我们发现，根据差示扫描量热法，红外线，和热分析。评估了聚芳酯/ HP7200热固性材料的热和介电性能。我们发现它们表现出高的T g特性（例如，对于DMAP催化的236-P / HP7200热固性材料，T g为238°C）。此外，由于具有疏水性的甲基和脂环族部分，以及无羟基的仲结构，聚芳酯/ HP7200热固性树脂的相对介电常数较低，约为2.75U。在本文中讨论了详细的结构与性质的关系。