Highly thermal conductive polymer composites with minimized content of fillers are desirable for handling the issue in thermal management in modern electronics. However, the difficulty of filler dispersion restricts the heat dissipation performance of thermoplastic composites and the intermolecular interaction is another crucial factor in this problem. In the present study, the hydrogen bond was used to regulate the formation of the three-dimensional boron nitride (3D BN) interconnected network to act as a high thermal conductive network in thermoplastic polyamide-imide (PAI) materials. The prepared electrical insulated PAI/3D–BN composites have a thermal conductivity (TC) of 1.17 W·m^–1·K^–1 at a low BN loading of 4 wt %/2 vol % and exhibit a thermal conductivity enhancement of 409%. We attribute the increased TC to the construction of 3D BN interconnected network and the hydrogen bond regulated between hydroxylated BN and polyvinyl alcohol, in which an effective thermal conductive network is constructed. This study provides a guided hydrogen bond strategy for thermally conductive polymer composites with good mechanical and electrical insulation properties in thermal management and other applications.

中文翻译：

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氢键调节的氮化硼网络结构可改善聚酰胺酰亚胺复合材料的导热性能

对于处理现代电子中的热管理中的问题，需要具有最小填充量的高导热聚合物复合材料。然而，填料分散的困难限制了热塑性复合材料的散热性能，并且分子间相互作用是该问题的另一个关键因素。在本研究中，氢键用于调节三维氮化硼（3D BN）互连网络的形成，以充当热塑性聚酰胺-酰亚胺（PAI）材料中的高导热网络。制备的电绝缘PAI / 3D–BN复合材料的导热系数（TC）为1.17 W·m ^–1 ·K ^–1在低的BN负载量为4 wt％/ 2 vol％时，导热率提高了409％。我们将增加的TC归因于3D BN互连网络的构建以及羟基化BN与聚乙烯醇之间调节的氢键，其中构建了有效的导热网络。这项研究为导热聚合物复合材料在热管理和其他应用中具有良好的机械和电绝缘性能提供了指导性的氢键策略。