Mechanical properties and thermal stability of porous polyimide/hollow mesoporous silica nanoparticles composite films prepared by using polystyrene microspheres as the pore‐forming template,Journal of Applied Polymer Science

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Mechanical properties and thermal stability of porous polyimide/hollow mesoporous silica nanoparticles composite films prepared by using polystyrene microspheres as the pore‐forming template
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2019-12-17 , DOI: 10.1002/app.48792
Weihong Jia _{1,

2} , Jinqing Wang _{1,

2} , Limin Ma _{1,

2} , Sili Ren ₃ , Shengrong Yang _{1,

2}

Affiliation

The porous polyimide/hollow mesoporous silica nanoparticles (PI/HMSNs) composite films were fabricated via blending polymerization by using polystyrene (PS) microspheres as the pore‐forming template. The morphologies, microstructures, thermal stability, thermal expansion coefficient (TEC), and mechanical performances of the porous PI/HMSNs films were characterized in detail. Results showed that the uniform dispersion of HMSNs benefits from the strong hydrogen‐bonding interaction between the hydroxyl groups of HMSNs and poly(amic acid) chains. Both weight loss and TEC of the porous PI/HMSNs films are lower than those of the pure porous PI film. When 0.8 wt % HMSNs and 7.0 wt % PS were added into the PI matrix, the Young's modulus and tensile strength of composite film increased by about 32.4% and 68.1% compared with those of the pure porous PI film. Conclusively, the introduction of HMSNs in the porous PI matrix is an important strategy to enrich the diversity of porous structure, improve the thermal and mechanical properties of the porous PI material simultaneously. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020, 137, 48792.

中文翻译：

以聚苯乙烯微球为成孔模板制备的多孔聚酰亚胺/中空二氧化硅纳米粒子复合膜的力学性能和热稳定性

以聚苯乙烯（PS）微球为成孔模板，通过共混聚合制备了多孔聚酰亚胺/空心介孔二氧化硅纳米粒子（PI / HMSNs）复合膜。详细描述了多孔PI / HMSNs薄膜的形貌，微观结构，热稳定性，热膨胀系数（TEC）和机械性能。结果表明，HMSNs的均匀分散得益于HMSNs的羟基与聚（酰胺酸）链之间的强氢键相互作用。多孔PI / HMSNs膜的重量损失和TEC均低于纯多孔PI膜的重量损失和TEC。当将0.8 wt％的HMSN和7.0 wt％的PS添加到PI基质中时，复合膜的杨氏模量和拉伸强度分别增加了约32.4％和68。与纯多孔PI膜相比，仅为1％。最终，将HMSNs引入多孔PI基体是一种重要的策略，可以丰富多孔结构的多样性，同时提高多孔PI材料的热性能和机械性能。分级为4 +©2019 Wiley Periodicals，Inc.J.Appl。Polym。科学2020，137，48792。

更新日期：2020-03-09

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