Novel Silica Filled Deep Eutectic Solvent Based Nanofluids for Energy Transportation,ACS Sustainable Chemistry & Engineering

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Novel Silica Filled Deep Eutectic Solvent Based Nanofluids for Energy Transportation
ACS Sustainable Chemistry & Engineering ( IF 7.1 ) Pub Date : 2019-12-04 , DOI: 10.1021/acssuschemeng.9b06179
Changhui Liu _{1,

2} , Hui Fang _{1,

2} , Xinjian Liu _{1,

2} , Ben Xu ₃ , Zhonghao Rao _{1,

2}

Affiliation

The liquid range of nanofluids is a crucial parameter as it intensively determines their application temperature scope. Meanwhile, improved thermal conductivity and stability are of great significances and comprise the main fundamental research topics of nanofluids. In this work, 2-butoxy-3,4-dihydropyran (DP), produced from a convenient one-pot three-component reaction in water, was employed as a dual lipophilic brusher and metal nanoparticle anchor. It was found that DP was able to enhance the dispersing ability and thermal conductivity of SiO₂ nanoparticle filled deep eutectic solvent (DES) based nanofluids simultaneously. The key to the success of this protocol mainly relies on the electrophilic property and acetylacetonate moiety of DP, which ensures the formation of DP surficial modified and copper nanoparticle coated silica. Molecular dynamics simulation revealed that the hydrogen bonding effect between the base solvent and alkane chain of the nanoparticle was responsible for the enhanced affinity, which thus resulted in an improved stability. Viscosities of the nanofluids dropped within a certain range owing to the ruin of hydrogen bonding association among solvent molecules as a result of the hydrogen bonding effect between nanoparticle and solvent. Thermal conductivity of the copper modified silica filled DES nanofluids exhibits a maximum 13.6% enhancement, which demonstrated the advantages of this chemical covalent protocol. Additionally, studies on the viscosity and convective heat transfer coefficient of the nanofluids with various types of silica nanoparticle and DES base solvents indicated that a 24.9% heat transfer coefficient enhancement was gained that further revealed the superiority of this protocol.

中文翻译：

新型二氧化硅填充的深共熔溶剂基纳米流体，用于能量传输

纳米流体的液体范围是一个至关重要的参数，因为它强烈地决定了它们的应用温度范围。同时，提高导热性和稳定性具有重要意义，并构成纳米流体的主要基础研究课题。在这项工作中，由便利的一锅三组分反应在水中产生的2-丁氧基-3,4-二氢吡喃（DP）被用作亲脂性双刷和金属纳米粒子固定剂。发现DP能够增强SiO ₂的分散能力和导热性纳米粒子同时填充了基于深共熔溶剂（DES）的纳米流体。该协议成功的关键主要取决于DP的亲电特性和乙酰丙酮部分，这确保了DP表面改性和铜纳米颗粒涂覆的二氧化硅的形成。分子动力学模拟显示，基础溶剂和纳米颗粒的烷烃链之间的氢键作用是增强亲和力的原因，因此提高了稳定性。由于纳米粒子与溶剂之间的氢键作用，溶剂分子之间的氢键缔合破坏，纳米流体的粘度在一定范围内下降。铜改性二氧化硅填充的DES纳米流体的热导率最大提高了13.6％，证明了这种化学共价方案的优势。此外，对各种类型的二氧化硅纳米颗粒和DES基础溶剂的纳米流体的粘度和对流传热系数的研究表明，传热系数提高了24.9％，这进一步证明了该方案的优越性。

更新日期：2019-12-05

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