High thermal conductivity property of polyamide-imide/boron nitride composite films by doping boron nitride quantum dots†,Journal of Materials Chemistry C

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High thermal conductivity property of polyamide-imide/boron nitride composite films by doping boron nitride quantum dots†
Journal of Materials Chemistry C ( IF 5.7 ) Pub Date : 2019-10-07 , DOI: 10.1039/c9tc04381k
Shuaishuai Zhou _{1,

2,

3,

4,

5} , Tongle Xu _{1,

2,

3,

4,

5} , Fang Jiang _{1,

2,

3,

4,

5} , Na Song _{2,

3,

4,

5,

6} , Liyi Shi _{2,

3,

4,

5,

6} , Peng Ding _{1,

2,

3,

4,

5}

Affiliation

In this study, we report a flexible polyamide-imide (PAI)/boron nitride nanosheet (BNNS) composite film with improved thermal conductivity by doping boron nitride quantum dots (BNQDs) using an evaporation-induced self-assembly method. Continuous thermal conductive paths are constructed using BNQDs and BNNS in a PAI matrix, and the heat flow is effectively transmitted along the paths to improve the in-plane thermal conductivity (TC) of the PAI composite film. The synergistic effect between the BNNS and BNQDs plays a pivotal role in the formation of a continuous thermal conductive path. The PAI/BNNS/BNQD composite film shows an in-plane thermal conductivity of 7.69 W m⁻¹ K⁻¹ at a BNNS loading of 9 wt% and a BNQD loading of 1 wt%. This work provides valuable guidance for the design of thermal management materials to meet the efficient heat dissipation requirements of electronic devices.

中文翻译：

掺杂氮化硼量子点可实现聚酰胺-酰亚胺/氮化硼复合膜的高导热性†

在这项研究中，我们报告了通过使用蒸发诱导自组装方法掺杂氮化硼量子点（BNQD）来提高导热性的柔性聚酰胺-酰亚胺（PAI）/氮化硼纳米片（BNNS）复合膜。使用BNQD和BNNS在PAI矩阵中构造连续的导热路径，并且沿该路径有效地传递热流，以提高PAI复合膜的面内导热率（TC）。BNNS和BNQD之间的协同效应在形成连续的导热路径中起着举足轻重的作用。PAI / BNNS / BNQD复合膜的平面内热导率为7.69 W m ^-1 K ^-1BNNS负载为9 wt％，BNQD负载为1 wt％。这项工作为热管理材料的设计提供了有价值的指导，以满足电子设备的有效散热要求。

更新日期：2019-11-14

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