PWM驱动的热可调硅微环谐振器：设计，制造和表征,Laser & Photonics Reviews

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PWM驱动的热可调硅微环谐振器：设计，制造和表征
Laser & Photonics Reviews ( IF 9.8 ) Pub Date : 2019-07-15 , DOI: 10.1002/lpor.201800275
Paolo Pintus _{1,

2,

3} , Michael Hofbauer ₄ , Costanza L. Manganelli _{1,

2,

5} , Maryse Fournier ₆ , Sarat Gundavarapu ₃ , Olivier Lemonnier ₆ , Fabrizio Gambini _{1,

2,

3} , Laetitia Adelmini ₆ , Carl Meinhart ₃ , Christophe Kopp ₆ , Francesco Testa ₇ , Horst Zimmermann ₄ , Claudio J. Oton _{1,

2}

Affiliation

环形谐振器是高级集成光学电路的基本组成部分之一。它们可作为非线性光学元件，滤波器，传感器和开关等应用。在此，介绍了硅光子学中可热调谐微环谐振器的综合优化框架和实验结果，重点是标准的硅光子铸造工艺。为了最大程度地降低总功耗，可以通过对加热器施加脉宽调制的电信号来对环形谐振器进行调谐。使用测量结果验证的有效模型，对集成的硅和金属加热器的热性能进行了研究和比较。通过优化加热器的横截面，电阻和金属触点配置，可将加热器的功耗降至最低。使用由CEA‐LETI开发的多项目晶圆运行，证明了与集成硅加热器相比，金属加热器的功耗降低了30％，每个自由光谱范围的功耗达到27.53 mW。测量值与理论上预测的热性能非常吻合，偏差低至5％。实验结果支持的拟议框架将作为设计指南集，可以很容易地适应未来硅光子应用中的其他热光开关。测量值与理论上预测的热性能非常吻合，偏差低至5％。实验结果支持的拟议框架将作为设计指南集，可以很容易地适应未来硅光子应用中的其他热光开关。测量值与理论上预测的热性能非常吻合，偏差低至5％。实验结果支持的拟议框架将作为设计指南集，可以很容易地适应未来硅光子应用中的其他热光开关。

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PWM‐Driven Thermally Tunable Silicon Microring Resonators: Design, Fabrication, and Characterization

Ring resonators are one of the fundamental building blocks of advanced integrated optical circuits. They find applications as nonlinear optical elements, filters, sensors, and switches among others. Here, a comprehensive optimization framework and experimental results of thermally tunable microring resonators in silicon photonics is presented, with a focus on standard silicon photonic foundry processes. In order to minimize the total power consumption, the ring resonators are tuned by applying a pulse‐width‐modulated electrical signal to the heaters. The thermal performance of integrated silicon and metal heaters are investigated and compared using an effective model validated by the measurement results. The heater power consumption is minimized by optimizing heater cross section, resistance, and metal contact configurations. Using the multiproject wafer run developed at CEA‐LETI, it is demonstrated that a metal heater provides 30% lower power consumption compared to an integrated silicon one, reaching a power consumption of 27.53 mW per free spectral range. The measurements are in excellent agreement with the theoretically predicted thermal performance, with a deviation as low as 5%. The proposed framework, supported by the experimental results, will serve as a design guideline set that can be easily adapted for other thermo‐optic switches in future silicon photonic applications.

更新日期：2019-07-15

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