Reduced Graphene Oxide Heterostructured Silver Nanoparticles Significantly Enhanced Thermal Conductivities in Hot-Pressed Electrospun Polyimide Nanocomposites,ACS Applied Materials & Interfaces

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Reduced Graphene Oxide Heterostructured Silver Nanoparticles Significantly Enhanced Thermal Conductivities in Hot-Pressed Electrospun Polyimide Nanocomposites
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2019-06-24 00:00:00 , DOI: 10.1021/acsami.9b10161
Yongqiang Guo ₁ , Xutong Yang ₁ , Kunpeng Ruan ₁ , Jie Kong ₁ , Mengyao Dong _{2,

3} , Jiaoxia Zhang _{2,

4} , Junwei Gu _{1,

5} , Zhanhu Guo ₂

Affiliation

Graphene presents an extremely ultra-high thermal conductivity, well above other known thermally conductive fillers. However, graphene tends to aggregate easily due to its strong intermolecular π–π interaction, resulting in poor dispersion in the polymer matrix. In this study, silver nanoparticles anchored reduced graphene oxide (Ag/rGO) were first prepared using one-pot synchronous reduction of Ag⁺ and GO solution via glucose. The thermally conductive (Ag/rGO)/polyimide ((Ag/rGO)/PI) nanocomposites were then obtained via electrospinning the in situ polymerized (Ag/rGO)/polyamide electrospun suspension followed by a hot-press technique. The thermal conductivity (λ), glass transition temperature (T_g), and heat resistance index (T_HRI) of the (Ag/rGO)/PI nanocomposites all increased with increasing the loading of Ag/rGO fillers. When the mass fraction of Ag/rGO (the weight ratio of rGO to Ag was 4:1) fillers was 15%, the corresponding (Ag/rGO)/PI nanocomposites showed a maximum λ of 2.12 W/(m K). The corresponding T_g and T_HRI values were also enhanced to 216.1 and 298.6 °C, respectively. Furthermore, thermal conductivities calculated by our established improved thermal conduction model were relatively closer to the experimental results than the results obtained from other classical models.

中文翻译：

热压电纺聚酰亚胺纳米复合材料中还原的氧化石墨烯异质结构的纳米银颗粒显着提高了导热系数

石墨烯具有极高的导热率，远高于其他已知的导热填料。但是，石墨烯由于其强大的分子间π-π相互作用而易于聚集，导致在聚合物基体中的分散性较差。在这项研究中，首先通过葡萄糖一锅同步还原Ag ⁺和GO溶液，制备了锚定了还原性氧化石墨烯（Ag / rGO）的银纳米颗粒。然后，通过电纺原位聚合（Ag / rGO）/聚酰胺电纺丝悬浮液，然后进行热压技术，获得导热（Ag / rGO）/聚酰亚胺（（Ag / rGO）/ PI）纳米复合材料。导热系数（λ），玻璃化转变温度（T _g）和耐热指数（T _HRI）（Ag / rGO）/ PI纳米复合材料的）均随着Ag / rGO填料含量的增加而增加。当Ag / rGO的质量分数（rGO与Ag的重量比为4：1）为15％时，相应的（Ag / rGO）/ PI纳米复合材料的最大λ为2.12 W /（m K）。相应的T _g和T _HRI值也分别提高到216.1和298.6°C。此外，通过我们建立的改进的热传导模型计算出的热导率比从其他经典模型获得的结果相对更接近实验结果。

更新日期：2019-06-24

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