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Direct synthesis of high-quality graphene on Cu powders from adsorption of small aromatic hydrocarbons: A route to high strength and electrical conductivity for graphene/Cu composite
Journal of Alloys and Compounds ( IF 5.8 ) Pub Date : 2019-08-01 , DOI: 10.1016/j.jallcom.2019.05.273
Miao Wang , Li-Dong Wang , Jie Sheng , Zi-Yue Yang , Zhen-Dong Shi , Yun-Peng Zhu , Jie Li , Wei-Dong Fei

Abstract A low-cost and easily-accessible approach based on adsorption of small aromatic hydrocarbons (SAHs) was developed to synthesize graphene on Cu powders, which could supply raw material for powder metallurgy (PM) fabrication of graphene/Cu composites. Two common SAHs, naphthalene and α-naphthol, were chosen as the carbon precursors. Compared with naphthalene, it was found that the hydroxyl group in α-naphthol could be chemically adsorbed on Cu powders, which could not only be effective in preventing Cu powders from agglomerating together at high temperature but also promote the growth of high-quality graphene. Therefore, α-naphthol-derived graphene on Cu powders were chosen to fabricate graphene/Cu composites by spark plasma sintering and hot-rolling. The composites exhibited a microstructure with extremely homogeneous dispersion of graphene, exceptional high strength and simultaneously similar electrical conductivity compared with that of the matrix. Cu–O–C bond was found and could improve the interfacial bonding between graphene and matrix. Experimental and theoretical calculation results revealed that the load transfer, grain refinement and thermal mismatch mechanism provided by graphene were the main strengthening mechanism in the composite. This synthetic procedure is quite scalable for industrial use to fabricate graphene/Cu composites with high performance.

中文翻译:

通过吸附小芳烃在铜粉上直接合成优质石墨烯:石墨烯/铜复合材料的高强度和高导电性途径

摘要 开发了一种基于吸附小芳烃 (SAHs) 的低成本且易于获得的方法来在 Cu 粉末上合成石墨烯,该方法可为石墨烯/Cu 复合材料的粉末冶金 (PM) 制造提供原材料。两种常见的 SAH,萘和 α-萘酚,被选为碳前体。与萘相比,发现α-萘酚中的羟基可以化学吸附在Cu粉上,不仅可以有效防止Cu粉在高温下团聚在一起,还可以促进高质量石墨烯的生长。因此,选择在铜粉上的α-萘酚衍生的石墨烯通过放电等离子烧结和热轧制备石墨烯/铜复合材料。与基体相比,该复合材料具有石墨烯极其均匀分散的微观结构、优异的高强度和相似的导电性。发现了 Cu-O-C 键,可以改善石墨烯和基体之间的界面键合。实验和理论计算结果表明,石墨烯提供的载荷传递、晶粒细化和热失配机制是复合材料的主要强化机制。这种合成程序对于工业用途具有相当大的可扩展性,可以制造高性能的石墨烯/铜复合材料。实验和理论计算结果表明,石墨烯提供的载荷传递、晶粒细化和热失配机制是复合材料的主要强化机制。这种合成程序对于工业用途具有相当大的可扩展性,可以制造高性能的石墨烯/铜复合材料。实验和理论计算结果表明,石墨烯提供的载荷传递、晶粒细化和热失配机制是复合材料的主要强化机制。这种合成程序对于工业用途具有相当大的可扩展性,可以制造高性能的石墨烯/铜复合材料。
更新日期:2019-08-01
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