Abstract Ultrasonic-assisted soldering was used for Ta/Sn/Al interconnection. The effects of ultrasonic waves on the dissolution and nucleation behavior of Al in Ta/Sn/Al joints during ultrasonic-assisted soldering were investigated. The cavitation induced by ultrasound waves lead to the continuous dissolution of the Al from substrate into molten Sn and the content of Al in solder increased rapidly. When the Al content reached saturation in the ultrasonic field, Al precipitated in the solder as second phase and nucleated on the substrates at the same time that Al dissolve into molten Sn from substrate. The behavior of nucleation on the Al substrate suppressed the growth of Al content in solder. The Al content in the bond was in dynamic equilibrium due to the dissolution and nucleation of Al. The maximum shear strength and bonding ratio of the joints were approximately 16 MPa and 86%, respectively.

中文翻译：

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超声辅助焊接过程中Al在Ta/Sn/Al接头中的溶解和形核行为

摘要 超声波辅助焊接用于Ta/Sn/Al互连。研究了超声波对超声波辅助焊接过程中 Al 在 Ta/Sn/Al 接头中的溶解和形核行为的影响。超声波引起的空化导致基体中的铝不断溶解到熔融锡中，焊料中铝的含量迅速增加。当Al含量在超声场中达到饱和时，Al作为第二相在焊料中析出并在基体上成核，同时Al从基体溶解到熔融的Sn中。铝基体上的成核行为抑制了焊料中铝含量的增长。由于铝的溶解和成核，键中的铝含量处于动态平衡状态。