Tunable dielectric and other properties in high-performance sandwich-type polyimide films achieved by adjusting the porous structure†,Journal of Materials Chemistry C

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Tunable dielectric and other properties in high-performance sandwich-type polyimide films achieved by adjusting the porous structure†
Journal of Materials Chemistry C ( IF 5.7 ) Pub Date : 2019-05-15 00:00:00 , DOI: 10.1039/c9tc02017a
Yingyi Ma _{1,

2,

3,

4} , Le Xu _{1,

2,

3,

4} , Zian He _{1,

2,

3,

4} , Junwen Xie _{1,

2,

3,

4} , Lei Shi _{4,

5,

6,

7,

8} , Mingyan Zhang _{1,

2,

3,

4} , Wenlong Zhang _{1,

2,

3,

4} , Weiwei Cui _{1,

2,

3,

4}

Affiliation

The preparation and performance adjustment of low-dielectric polyimide (PI) play important roles in the development and application of next-generation dielectric materials used in high-speed integrated circuits. Herein, composite polyimide films with sandwich-type porous structures were fabricated via a microemulsion method, in which the self-assembly of water droplets was involved. Decreases in the dielectric constant and water absorption and increases in the tensile strength and tensile modulus were simultaneously realized due to the presence of symmetrical porous structures and a dense PI layer upon the introduction of the sandwich-type porous structure. The dielectric, mechanical and water resistance properties of the composite PI films could be further regulated by controlling the porous structure using different conditions for film formation. By varying the temperature, humidity, concentrations of polymer and surfactant in the microemulsion method, we obtained the low dielectric constants of 2.24–2.81 and the low water absorptions of 0.49–0.59%, with decreases from 15.73% to 32.81% and 76.02% to 80.08%, respectively, as compared to the case of the flat PI film; we also achieved the high tensile strengths of 97.7–103.2 MPa and high tensile moduli of 1.2–1.4 GPa, with the increases of 4.83–10.73% and 6.57–16.43%, respectively, as compared to the case of the flat PI film. Moreover, excellent durability of the low dielectric constant under high humidity condition was demonstrated by the very small increase in the dielectric constant (0.02–1%) in a moist environment. These results provide useful information for the structural design of high-performance dielectric materials.

中文翻译：

通过调节多孔结构可实现高性能夹心型聚酰亚胺薄膜的可调节介电性能和其他性能†

低介电性聚酰亚胺（PI）的制备和性能调整在高速集成电路中使用的下一代介电材料的开发和应用中起着重要作用。在此，与夹层型多孔结构的复合聚酰亚胺膜制作经由一种微乳液法，其中涉及水滴的自组装。由于引入了夹层型多孔结构时存在对称的多孔结构和致密的PI层，因此同时实现了介电常数和吸水率的降低以及抗张强度和拉伸模量的增加。通过使用不同的成膜条件控制多孔结构，可以进一步调节复合PI膜的介电，机械和耐水性。通过在微乳液法中改变温度，湿度，聚合物和表面活性剂的浓度，我们获得了2.24–2.81的低介电常数和0.49–0.59％的低吸水率，从15.73％降低到32.81％，从76.02％降低到分别为80.08％与平面PI膜的情况相比；我们还获得了97.7–103.2 MPa的高抗拉强度和1.2–1.4 GPa的高抗拉模量，与平质PI膜相比，分别增加了4.83–10.73％和6.57–16.43％。此外，高湿条件下低介电常数的出色耐久性表现出在潮湿环境中介电常数的极小增加（0.02-1％）。这些结果为高性能介电材料的结构设计提供了有用的信息。低湿介电常数在高湿度条件下具有出色的耐久性，这是由于在潮湿环境中介电常数仅有极小的增加（0.02-1％）而得到证明的。这些结果为高性能介电材料的结构设计提供了有用的信息。低湿介电常数在高湿度条件下具有出色的耐久性，这是由于在潮湿环境中介电常数仅增加了很小的一部分（0.02-1％）。这些结果为高性能介电材料的结构设计提供了有用的信息。

更新日期：2019-05-15

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