Hyperbranched‐polysiloxane‐based hyperbranched polyimide films with low dielectric permittivity and high mechanical and thermal properties,Journal of Applied Polymer Science

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Hyperbranched‐polysiloxane‐based hyperbranched polyimide films with low dielectric permittivity and high mechanical and thermal properties
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2019-04-13 , DOI: 10.1002/app.47771
Ruhe Lian ₁ , Xingfeng Lei ₁ , Yanhui Chen ₁ , Qiuyu Zhang ₁

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A series of hyperbranched polysiloxane (HBPSi)‐based hyperbranched polyimide (HBPI) films with low dielectric permittivity and multiple branched structures are fabricated by copolymerizing 2,4,6‐triaminopyrimidine (TAP) with 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride, 4,4′‐diaminodiphenyl ether, and HBPSi via the two‐step polymerization method. The dielectric permittivity of HBPSi hyperbranched polyimide films decreases with increasing TAP fraction, namely, from 3.28 for sample PI‐1 to 2.80 for PI‐4, mainly owing to the enlarged free volume created by the incorporation of multiple branched structures. Moreover, HBPSi HBPI possesses desirable solubility and good mechanical properties and thermal stability. PI‐4 not only has low dielectric permittivity (2.80, 1 MHz), excellent solubility (soluble in several common organic solvents), and remarkable thermal properties (glass‐transition temperature of 273 °C, 5% weight loss temperature of 498 °C in N₂ and 486 °C in O₂), but it also demonstrates admirable mechanical properties with a tensile strength of 103 MPa, elongation at break of 7.3%, and a tensile modulus of 2.16 GPa. HBPSi HBPI might have potential applications in interlayer dielectrics and other microelectronics fields. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47771.

中文翻译：

基于超支化聚硅氧烷的超支化聚酰亚胺薄膜，介电常数低，机械和热性能高

通过将2,4,6-三氨基嘧啶（TAP）与4,4'-（六氟异亚丙基）二邻苯二甲酸酐共聚，制得一系列具有低介电常数和多分支结构的基于超支化聚硅氧烷（HBPSi）的超支化聚酰亚胺（HBPI）膜，通过两步聚合方法获得4,4'-二氨基二苯醚和HBPSi。HBPSi超支化聚酰亚胺薄膜的介电常数随TAP分数的增加而降低，即从PI-1样品的3.28降低至PI-4的2.80，这主要是由于合并了多个分支结构而产生的自由体积增大。此外，HBPSi HBPI具有理想的溶解度，良好的机械性能和热稳定性。PI‐4不仅具有低介电常数（2.80，1 MHz），出色的溶解性（可溶于几种常见的有机溶剂中），在O ₂）中为₂和486°C ，但它也显示出令人钦佩的机械性能，拉伸强度为103 MPa，断裂伸长率为7.3％，拉伸模量为2.16 GPa。HBPSi HBPI可能在层间电介质和其他微电子领域中具有潜在的应用。分级为4 +©2019 Wiley Periodicals，Inc.J.Appl。Polym。科学 2019，136，47771。

更新日期：2019-04-13

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