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Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures
Nano Letters ( IF 9.6 ) Pub Date : 2017-12-22 00:00:00 , DOI: 10.1021/acs.nanolett.7b03930 Soheil Daryadel , Ali Behroozfar , S. Reza Morsali , Salvador Moreno , Mahmoud Baniasadi , Julia Bykova 1 , Rodrigo A. Bernal , Majid Minary-Jolandan
Nano Letters ( IF 9.6 ) Pub Date : 2017-12-22 00:00:00 , DOI: 10.1021/acs.nanolett.7b03930 Soheil Daryadel , Ali Behroozfar , S. Reza Morsali , Salvador Moreno , Mahmoud Baniasadi , Julia Bykova 1 , Rodrigo A. Bernal , Majid Minary-Jolandan
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Nanotwinned-metals (nt-metals) offer superior mechanical (high ductility and strength) and electrical (low electromigration) properties compared to their nanocrystalline (nc) counterparts. These properties are advantageous in particular for applications in nanoscale devices. However, fabrication of nt-metals has been limited to films (two-dimensional) or template-based (one-dimensional) geometries, using various chemical and physical processes. In this Letter, we demonstrate the ambient environment localized pulsed electrodeposition process for direct printing of three-dimensional (3D) freestanding nanotwinned-Copper (nt-Cu) nanostructures. 3D nt-Cu structures were additively manufactured using pulsed electrodeposition at the tip of an electrolyte-containing nozzle. Focused ion beam (FIB) and transmission electron microscopy (TEM) analysis revealed that the printed metal was fully dense, and was mostly devoid of impurities and microstructural defects. FIB and TEM images also revealed nanocrystalline-nanotwinned-microstructure (nc-nt-microstructure), and confirmed the formation of coherent twin boundaries in the 3D-printed Cu. Mechanical properties of the 3D-printed nc-nt-Cu were characterized by direct printing (FIB-less) of micropillars for in situ SEM microcompression experiments. The 3D-printed nc-nt-Cu exhibited a flow stress of over 960 MPa, among the highest ever reported, which is remarkable for a 3D-printed material. The microstructure and mechanical properties of the nc-nt-Cu were compared to those of nc-Cu printed using the same process under direct current (DC) voltage.
中文翻译：
纳米孪晶金属纳米结构三维印刷的局部脉冲电沉积工艺
与纳米晶（nc）相比，纳米孪晶金属（nt金属）具有出色的机械（高延展性和强度）和电（低电迁移）性能。这些性质尤其对于纳米级装置中的应用是有利的。但是，使用各种化学和物理过程，将nt金属的制造限于膜（二维）或基于模板的几何（一维）。在这封信中，我们演示了直接打印三维（3D）独立式纳米孪晶铜（nt-Cu）纳米结构的周围环境局部脉冲电沉积工艺。3D nt-Cu结构是通过在包含电解质的喷嘴的尖端使用脉冲电沉积法附加制造的。聚焦离子束（FIB）和透射电子显微镜（TEM）分析表明，印刷的金属完全致密，并且几乎没有杂质和微结构缺陷。FIB和TEM图像还显示了纳米晶-无链微结构（nc-nt-微结构），并确认了3D打印的Cu中连贯的孪晶边界的形成。3D打印的nc-nt-Cu的机械性能通过直接打印（无FIB）微柱来表征原位SEM微压缩实验。3D打印的nc-nt-Cu表现出超过960 MPa的流应力，这是有史以来的最高记录，这对于3D打印的材料而言是显着的。将nc-nt-Cu的微观结构和力学性能与使用相同工艺在直流（DC）电压下印刷的nc-Cu的微观结构和力学性能进行了比较。
更新日期：2017-12-22
中文翻译：
纳米孪晶金属纳米结构三维印刷的局部脉冲电沉积工艺
与纳米晶（nc）相比，纳米孪晶金属（nt金属）具有出色的机械（高延展性和强度）和电（低电迁移）性能。这些性质尤其对于纳米级装置中的应用是有利的。但是，使用各种化学和物理过程，将nt金属的制造限于膜（二维）或基于模板的几何（一维）。在这封信中，我们演示了直接打印三维（3D）独立式纳米孪晶铜（nt-Cu）纳米结构的周围环境局部脉冲电沉积工艺。3D nt-Cu结构是通过在包含电解质的喷嘴的尖端使用脉冲电沉积法附加制造的。聚焦离子束（FIB）和透射电子显微镜（TEM）分析表明，印刷的金属完全致密，并且几乎没有杂质和微结构缺陷。FIB和TEM图像还显示了纳米晶-无链微结构（nc-nt-微结构），并确认了3D打印的Cu中连贯的孪晶边界的形成。3D打印的nc-nt-Cu的机械性能通过直接打印（无FIB）微柱来表征原位SEM微压缩实验。3D打印的nc-nt-Cu表现出超过960 MPa的流应力，这是有史以来的最高记录，这对于3D打印的材料而言是显着的。将nc-nt-Cu的微观结构和力学性能与使用相同工艺在直流（DC）电压下印刷的nc-Cu的微观结构和力学性能进行了比较。
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