Dry‐etching‐assisted femtosecond laser machining,Laser & Photonics Reviews

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Dry‐etching‐assisted femtosecond laser machining
Laser & Photonics Reviews ( IF 9.8 ) Pub Date : 2017-03-29 , DOI: 10.1002/lpor.201600115
Xue-Qing Liu ₁ , Qi-Dai Chen ₁ , Kai-Min Guan ₁ , Zhuo-Chen Ma ₁ , Yan-Hao Yu ₁ , Qian-Kun Li ₁ , Zhen-Nan Tian ₁ , Hong-Bo Sun _{1,

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Affiliation

Femtosecond laser machining has been widely used for fabricating arbitrary 2.5 dimensional (2.5D) structures. However, it suffers from the problems of low fabrication efficiency and high surface roughness when processing hard materials. To solve these problems, we propose a dry‐etching‐assisted femtosecond laser machining (DE‐FsLM) approach in this paper. The fabrication efficiency could be significantly improved for the formation of complicated 2.5D structures, as the power required for the laser modification of materials is lower than that required for laser ablation. Furthermore, the surface roughness defined by the root‐mean‐square improved by an order of magnitude because of the flat interfaces of laser‐modified regions and untreated areas as well as accurate control during the dry‐etching process. As the dry‐etching system is compatible with the IC fabrication process, the DE‐FsLM technology shows great potential for application in the device integration processing industry.

中文翻译：

干蚀刻飞秒激光加工

飞秒激光加工已被广泛用于制造任意2.5维（2.5D）结构。但是，在加工硬质材料时，存在制造效率低，表面粗糙度高的问题。为了解决这些问题，我们在本文中提出了一种干蚀刻辅助飞秒激光加工（DE-FsLM）方法。对于复杂的2.5D结构的形成，可以显着提高制造效率，因为材料进行激光改性所需的功率低于激光烧蚀所需的功率。此外，由于激光修改区域和未处理区域的平面界面以及干蚀刻过程中的精确控制，由均方根定义的表面粗糙度提高了一个数量级。

更新日期：2017-03-29

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