一步法制备3D纳米镍纳米阵列与银纳米粒子烧结及其界面分析,ACS Applied Materials & Interfaces

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一步法制备3D纳米镍纳米阵列与银纳米粒子烧结及其界面分析
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2017-01-30 00:00:00 , DOI: 10.1021/acsami.6b13031
Wei Zhou ₁ , Zhen Zheng ₁ , Chunqing Wang _{1,

2} , Zhongtao Wang ₁ , Rong An _{1,

2}

Affiliation

通过电镀方法仅一步就可以在铜基板上制造三维（3D）纳米级Ni纳米面（Ni NM）阵列，在不改变其形态的情况下，用Au膜（Ni / Au NM）覆盖了独特的结构，以下步骤，将其与银纳米颗粒（Ag NP）糊料一起烧结。通过X射线衍射，扫描电子显微镜（SEM）和原子力显微镜对Ni NM阵列的结构及其表面形貌进行了表征。通过SEM，透射电子显微镜和能量色散X射线光谱对烧结界面进行了研究，以分析烧结机理。结果表明，在没有任何气体或真空防护罩和额外压力的情况下，在250°C下成功实现了冶金结合。具有Ni / Au NM阵列的Cu基板能够与Ag NP浆料接合，而没有明显的空隙。由于Ag NP和Ni / Au NM阵列之间具有兼容的化学势，Au元素能够以约800 nm的距离扩散到Ag层中。基于出色的3D纳米层级结构，Ni / Au NM阵列的剪切强度比平坦的Ni / Au涂层基体强6倍。结果表明，基材表面在提高剪切强度和烧结效率方面起着至关重要的作用。3D Ni NM阵列实现了出色的键合界面，并在微电子封装领域具有巨大的潜在应用。基于出色的3D纳米层级结构，Ni / Au NM阵列的剪切强度比平坦的Ni / Au涂层基体强6倍。结果表明，基材表面在提高剪切强度和烧结效率方面起着至关重要的作用。3D Ni NM阵列实现了出色的键合界面，并在微电子封装领域具有巨大的潜在应用。基于出色的3D纳米层级结构，Ni / Au NM阵列的剪切强度比平坦的Ni / Au涂层基体强6倍。结果表明，基材表面在提高剪切强度和烧结效率方面起着至关重要的作用。3D Ni NM阵列实现了出色的键合界面，并在微电子封装领域具有巨大的潜在应用。

"点击查看英文标题和摘要"

One-Step Fabrication of 3D Nanohierarchical Nickel Nanomace Array To Sinter with Silver NPs and the Interfacial Analysis

Three-dimensional (3D) nanohierarchical Ni nanomace (Ni NM) array was fabricated on copper substrate by only one step with electroplating method, the unique structure was covered with Au film (Ni/Au NM) without changing its morphology, and in the following step, it was sintered with silver nanoparticle (Ag NP) paste. The structure of the Ni NM array and its surface morphology were characterized by X-ray diffraction, scanning electron microscope (SEM), and atomic force microscope. The sintered interface was investigated by SEM, transmission electron microscopy, and energy-dispersive X-ray spectroscopy to analyze the sintering mechanism. The results showed that a metallurgical bond was successfully achieved at 250 °C without any gas or vacuum shield and extra pressure. The Cu substrate with Ni/Au NM array was able to join with the Ag NP paste without obvious voids. Due to the compatible chemical potential between Ag NPs and Ni/Au NM array, the Au element was able to diffuse into the Ag layer with about 800 nm distance. Based on the excellent 3D nanohierarchical structure, the shear strength of Ni/Au NM array was 6 times stronger than the flat Ni/Au coated substrate. It turned out that the substrate surface played a crucial role in improving the shear strength and sintering efficiency. The 3D Ni NM array had achieved an excellent bonding interface and had great potential application in the microelectronics packaging field.

更新日期：2017-01-30

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