Corrosion Protection of Copper Using Al2O3, TiO2, ZnO, HfO2, and ZrO2 Atomic Layer Deposition,ACS Applied Materials & Interfaces

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Corrosion Protection of Copper Using Al2O3, TiO2, ZnO, HfO2, and ZrO2 Atomic Layer Deposition
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2017-01-18 00:00:00 , DOI: 10.1021/acsami.6b13571
James S. Daubert ₁ , Grant T. Hill ₁ , Hannah N. Gotsch ₁ , Antoine P. Gremaud ₁ , Jennifer S. Ovental ₁ , Philip S. Williams ₁ , Christopher J. Oldham ₁ , Gregory N. Parsons ₁

Affiliation

Atomic layer deposition (ALD) is a viable means to add corrosion protection to copper metal. Ultrathin films of Al₂O₃, TiO₂, ZnO, HfO₂, and ZrO₂ were deposited on copper metal using ALD, and their corrosion protection properties were measured using electrochemical impedance spectroscopy (EIS) and linear sweep voltammetry (LSV). Analysis of ∼50 nm thick films of each metal oxide demonstrated low electrochemical porosity and provided enhanced corrosion protection from aqueous NaCl solution. The surface pretreatment and roughness was found to affect the extent of the corrosion protection. Films of Al₂O₃ or HfO₂ provided the highest level of initial corrosion protection, but films of HfO₂ exhibited the best coating quality after extended exposure. This is the first reported instance of using ultrathin films of HfO₂ or ZrO₂ produced with ALD for corrosion protection, and both are promising materials for corrosion protection.

中文翻译：

Al ₂ O ₃，TiO ₂，ZnO，HfO ₂和ZrO ₂原子层沉积对铜的腐蚀防护

原子层沉积（ALD）是增加对铜金属的腐蚀防护的可行方法。使用ALD在铜金属上沉积Al ₂ O ₃，TiO ₂，ZnO，HfO ₂和ZrO ₂的超薄膜，并使用电化学阻抗谱（EIS）和线性扫描伏安法（LSV）测量其腐蚀防护性能。每种金属氧化物的〜50 nm厚膜的分析显示出较低的电化学孔隙率，并提供了对NaCl水溶液的增强的腐蚀防护。发现表面预处理和粗糙度影响腐蚀防护的程度。Al ₂ O ₃或HfO _2的膜提供了最高水平的初始腐蚀防护，但HfO ₂膜在长时间暴露后表现出最佳的涂层质量。这是首次报道使用由ALD生产的HfO ₂或ZrO _2的超薄膜进行腐蚀防护的实例，两者都是有希望的腐蚀防护材料。

更新日期：2017-01-18

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