中尺度共晶体系结构的高温直写
Advanced Materials
(
IF27.4
)
Pub Date : 2016-12-15, DOI: 10.1002/adma.201604778
J. William Boley
1
,
Kundan Chaudhary
1
,
Thomas J. Ober
1
,
Mohammadreza Khorasaninejad
1
,
Wei Ting Chen
1
,
Erik Hanson
2
,
Ashish Kulkarni
3
,
Jaewon Oh
4
,
Jinwoo Kim
3
,
Larry K. Aagesen
2
,
Alexander Y. Zhu
1
,
Federico Capasso
1
,
Katsuyo Thornton
2
,
Paul V. Braun
3
,
Jennifer A. Lewis
1
Affiliation
John A. Paulson School of Engineering and Applied Sciences; Wyss Institute for Biologically Inspired Engineering; Harvard University; Cambridge MA 02138 USA
Department of Materials Science and Engineering; University of Michigan; Ann Arbor MI 48109 USA
Department of Materials Science and Engineering; Frederick Seitz Materials Research Laboratory; University of Illinois at Urbana-Champaign; Urbana IL 61801 USA
University of Waterloo; Waterloo ON N2L 3G1 Canada
High‐Operating‐Temperature Direct Ink Writing of Mesoscale Eutectic Architectures
High‐operating‐temperature direct ink writing (HOT‐DIW) of mesoscale architectures that are composed of eutectic silver chloride–potassium chloride. The molten ink undergoes directional solidification upon printing on a cold substrate. The lamellar spacing of the printed features can be varied between approximately 100 nm and 2 µm, enabling the manipulation of light in the visible and infrared range.