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Simultaneous optimization of topology and bi-material distribution of three-dimensional structures for addressing local heat accumulation in layer-upon-layer additive manufacturing process
Computers & Structures ( IF 4.4 ) Pub Date : 2024-12-20 , DOI: 10.1016/j.compstruc.2024.107632
Nima Yaghoobi, Mohammad Hossein Abolbashari

This paper introduces a novel approach based on a topology optimization (TO) model to efficiently distribute material phases for minimizing structural compliance and enhance local heat evacuation in additive manufacturing (AM). The approach simultaneously optimizes the structure for its intended function and behavior during layer-by-layer production. While AM allows intricate, topologically optimal multi-material designs, it often induces high temperatures and heat fluxes, risking part failure and compromising mechanical properties. To address this, a 3D gradient-based bi-material and functionally graded TO method is presented, considering total volume percentage and a thermal constraint based on temperatures of local sub-domains. The methodology involves density-based multi-material TO, interpolating elastic moduli, thermal conductivity, and heat flux based on proposed extensions of solid isotropic material with penalization method. Subsequently, a steady state analysis is performed in each sub-domain whose top element layer is exposed to a heat flux, simulating AM process. Both 2D and 3D numerical results demonstrate the contribution of the presented approach in preventing localized heating-induced geometrical patterns in AM. Additionally, the proposed method proves effective in producing superior designs without the need for sacrificial support structures in bi-material and functionally graded material designs, offering self-supported structures.

中文翻译:


同时优化三维结构的拓扑和双材料分布,以解决层层增材制造过程中的局部热量积累问题



本文介绍了一种基于拓扑优化 (TO) 模型的新方法,可有效分配材料相,以最大限度地减少结构柔度并增强增材制造 (AM) 中的局部散热。该方法在逐层生产期间同时优化结构的预期功能和行为。虽然增材制造允许复杂的拓扑优化多材料设计,但它通常会引起高温和热通量,从而有部件失效和损害机械性能的风险。为了解决这个问题,提出了一种基于 3D 梯度的双材料和功能梯度 TO 方法,考虑了总体积百分比和基于局部子域温度的热约束。该方法涉及基于密度的多材料 TO,基于所提出的固体各向同性材料的扩展和惩罚法的插值弹性模量、热导率和热通量。随后,在顶部单元层暴露于热通量的每个子域中执行稳态分析,模拟增材制造过程。2D 和 3D 数值结果都证明了所提出的方法在防止 AM 中局部加热诱导的几何图案方面的贡献。此外,所提出的方法被证明可以有效地产生卓越的设计,而无需在双材料和功能分级材料设计中牺牲支撑结构,从而提供自支撑结构。
更新日期:2024-12-20
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