This work presents a new and robust formulation for studying the effect of point heat sources on three-dimensional thermomechanical contact problems. The aim of this work is to accurately analyze heat dissipation in microchips with known heat sources. To achieve this, the Boundary Element Method (BEM) has been used to calculate the thermomechanical influence coefficients. The traditional BEM has been extended in the proposed formulation to account for the complex interactions between the microchip and heatsink, which result from the inclusion of point heat sources. This includes the effects of microcontacts, microgaps, and thermal contact resistance. To solve the problem’s inherent non-linearity, a dual iterative solution scheme has been proposed. The formulation is validated by a numerical example and is shown to be capable of accurately capturing traction variations in the contact zone and the influence of heat sources on the contact zone temperature. The formulation is then applied to study the thermomechanical behavior of microelectronic packages, particularly those with low heat dissipation, under the influence of simulated point heat sources.

中文翻译：

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用于模拟点热源微电子封装散热的 BEM 公式


这项工作提出了一种新的、稳健的公式，用于研究点热源对三维热机械接触问题的影响。这项工作的目的是准确分析具有已知热源的微芯片中的散热情况。为此，边界元法 （BEM） 用于计算热机械影响系数。传统的边界元法在所提出的公式中得到了扩展，以解释微芯片和散热器之间的复杂相互作用，这是由于包含点热源而产生的。这包括微触点、微间隙和热接触电阻的影响。为了解决该问题固有的非线性，提出了一种对偶迭代求解方案。该公式通过数值示例进行了验证，并证明能够准确捕捉接触区的牵引变化以及热源对接触区温度的影响。然后，该公式用于研究微电子封装的热机械行为，特别是那些在模拟点热源影响下具有低散热的封装。