当前位置: X-MOL 学术Int. J. Refract. Met. Hard Mater. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Effects of raw powder characteristics on microstructure and mechanical properties of W[sbnd]20Cu composites manufactured by SLM
International Journal of Refractory Metals & Hard Materials ( IF 4.2 ) Pub Date : 2024-12-03 , DOI: 10.1016/j.ijrmhm.2024.107001
Jie Mao, Wentan Zhu, Nan Ye, Zichun Wu, Jiancheng Tang, Haiou Zhuo, G.A. Bagliuk

Selective laser melting (SLM) technique is a promising method to achieve near-net-shaping of WCu complex components. In this work, two types of raw powers were prepared, including spherical WCu composite powder and mixed WCu powder. Effect of the raw powder characteristics on the microstructure and mechanical properties of W20Cu alloy were investigated. The results show that the composite powder enables the WCu composites to possess a high relative density (95.1 %), homogeneous microstructure and super mechanical properties (204.40 ± 1.73 HBW for hardness and 500 MPa for tensile strength). Remarkably, compared to mixed powder, the tensile strength and hardness are increased by 37 % and 74.2 %, respectively. This good effect stems from the composite powder with good sphericity degree and uniform structure. As a result, a dense specimen with refined W particles (3.05 μm) evenly embedded in the Cu matrix phase, accompanied by dislocation structure and sub-grains within the Cu matrix are obtained, contributing to the superior mechanical properties of the composites. The present work offers a strategy for developing high-performance WCu composites using SLM technology.

中文翻译:


原料粉体特性对SLM制备的W[sbnd]20Cu复合材料微观组织和力学性能的影响



选择性激光熔化 (SLM) 技术是实现 WCu 复杂组件近净成形的一种很有前途的方法。在这项工作中,制备了两种类型的原料,包括球形 WCu 复合粉末和混合 WCu 粉末。研究了原料粉末特性对 W20Cu 合金微观组织和力学性能的影响。结果表明,复合粉末使WCu复合材料具有较高的相对密度(95.1 %)、均匀的微观结构和超强的机械性能(硬度为204.40 ± 1.73 HBW,拉伸强度为500 MPa)。值得注意的是,与混合粉末相比,拉伸强度和硬度分别提高了 37% 和 74.2%。这种良好的效果源于复合粉末具有良好的球度和均匀的结构。结果,获得了具有均匀嵌入 Cu 基体相中的细化 W 颗粒 (3.05 μm) 的致密试样,并在 Cu 基体中伴有位错结构和亚晶粒,有助于复合材料的卓越机械性能。本研究为使用 SLM 技术开发高性能 WCu 复合材料提供了一种策略。
更新日期:2024-12-03
down
wechat
bug