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Multistep Fabrication of OECTs via Direct Ink Writing, With Performance Analysis Based on a Novel Measurement Protocol
Advanced Electronic Materials ( IF 5.3 ) Pub Date : 2024-12-04 , DOI: 10.1002/aelm.202400742 Amir Mohammad Ghafari, Oskar Backman, Emil Rosqvist, Chunlin Xu, Luisa Torsi, Eleonora Macchia, Ronald Österbacka
Advanced Electronic Materials ( IF 5.3 ) Pub Date : 2024-12-04 , DOI: 10.1002/aelm.202400742 Amir Mohammad Ghafari, Oskar Backman, Emil Rosqvist, Chunlin Xu, Luisa Torsi, Eleonora Macchia, Ronald Österbacka
Organic electrochemical transistors (OECTs) have been proven beneficial for bioelectronic applications. However, the demand for reliable and fast fabrication methods has not yet been fully met. In this work, OECTs are fabricated using direct ink writing (DIW). This method is cleanroom‐free and can be done without using lithography techniques. These devices are characterized and benchmarked against devices fabricated using spin‐coating and drop‐casting deposition approaches. Response time as well as the product of carrier charge mobility and volumetric capacitance are found to be higher using the DIW fabrication approach compared to standard deposition techniques. In addition, a testing process is designed to systematically evaluate the operational degradation of the semiconductor channel. This test enables identical conditions for all tested devices while providing comparable output. Thicker channels show better stability, while thinner channels are proved to be better transistors. Finally, the degradation issues and instability of these devices are discussed.
中文翻译:
通过直接墨水书写进行 OECT 的多步骤制造,并基于新颖的测量协议进行性能分析
有机电化学晶体管 (OECT) 已被证明对生物电子应用有益。然而,对可靠和快速制造方法的需求尚未得到完全满足。在这项工作中,OECT 是使用直接墨水书写 (DIW) 制造的。这种方法无需洁净室,无需使用光刻技术即可完成。这些器件与使用旋涂和滴铸沉积方法制造的器件进行了表征和基准测试。与标准沉积技术相比,使用 DIW 制造方法发现响应时间以及载流子电荷迁移率和体积电容的乘积更高。此外,还设计了一个测试过程来系统地评估半导体通道的操作退化。该测试为所有测试设备提供相同的条件,同时提供可比的输出。较厚的通道显示出更好的稳定性,而较薄的通道被证明是更好的晶体管。最后,讨论了这些器件的退化问题和不稳定性。
更新日期:2024-12-04
中文翻译:
通过直接墨水书写进行 OECT 的多步骤制造,并基于新颖的测量协议进行性能分析
有机电化学晶体管 (OECT) 已被证明对生物电子应用有益。然而,对可靠和快速制造方法的需求尚未得到完全满足。在这项工作中,OECT 是使用直接墨水书写 (DIW) 制造的。这种方法无需洁净室,无需使用光刻技术即可完成。这些器件与使用旋涂和滴铸沉积方法制造的器件进行了表征和基准测试。与标准沉积技术相比,使用 DIW 制造方法发现响应时间以及载流子电荷迁移率和体积电容的乘积更高。此外,还设计了一个测试过程来系统地评估半导体通道的操作退化。该测试为所有测试设备提供相同的条件,同时提供可比的输出。较厚的通道显示出更好的稳定性,而较薄的通道被证明是更好的晶体管。最后,讨论了这些器件的退化问题和不稳定性。