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Stabilization of cuσ+ via strong Cu‐O‐Si interface for efficient electrocatalytic acetylene semi‐hydrogenation
AIChE Journal ( IF 3.5 ) Pub Date : 2024-11-27 , DOI: 10.1002/aic.18663
Xiaoli Jiang, Wangxin Ge, Yu Fan, Xuedi Sheng, Hongliang Jiang, Chunzhong Li

The development of a high‐performance electrocatalytic acetylene semi‐hydrogenation catalyst is the key to the selective removal of acetylene from industrial ethylene gas and non‐oil route to ethylene production. However, it is still hampered by the deactivation of the catalyst and hydrogen evolution interference. Here, we proposed an interface engineering strategy involving the Cu and cupric oxide nanoparticles dispersed on amorphous SiO2 (Cu/CuOx/SiO2) by a simple stöber method. x‐ray photoelectron spectroscopy demonstrated the strong interfacial interaction between cupric oxide nanoparticles and SiO2. The formed Cu‐O‐Si interface stabilized the Cuσ+ at high reduction potentials, thus improving the activity and stability of the acetylene reduction reaction, as confirmed by in situ Raman spectroscopy. Consequently, the electrochemical test results showed that at 0.5 M KHCO3, the maximum Faraday efficiency (FE) of ethylene on the optimized Cu/CuOx/SiO2 reached 96%. And ethylene FE remains above 85% at −100 mA cm−2 for 40 h.

中文翻译:


通过强 Cu-O-Si 界面稳定 Cuσ+,实现高效电催化乙炔半氢化



高性能电催化乙炔半氢化催化剂的开发是将乙炔从工业乙烯气体和非石油途径选择性去除到乙烯生产的关键。然而,它仍然受到催化剂失活和析氢干扰的阻碍。在这里,我们提出了一种界面工程策略,涉及通过简单的 stöber 方法将 Cu 和氧化铜纳米颗粒分散在非晶态 SiO2 (Cu/CuOx/SiO2) 上。X 射线光电子能谱证明了氧化铜纳米颗粒和 SiO2 之间的强界面相互作用。形成的 Cu-O-Si 界面将 Cuσ+ 稳定在高还原电位下,从而提高了乙炔还原反应的活性和稳定性,原位拉曼光谱证实了这一点。因此,电化学测试结果表明,在 0.5 M KHCO3 时,乙烯在优化后的 Cu/CuOx/SiO2 上的最大法拉第效率 (FE) 达到 96%。乙烯 FE 在 -100 mA cm-2 下保持 85% 以上 40 h。
更新日期:2024-11-27
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