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Chemically embedding CuS microspheres into MXene aerogel for strain-adaptive triple shielding of electromagnetic wave, heat and sound
Journal of Materials Science & Technology ( IF 11.2 ) Pub Date : 2024-11-28 , DOI: 10.1016/j.jmst.2024.10.039 Chunyan Chen, Xufeng Li, Peng Yi, Zhi Geng, Haihan Zou, Gao Deng, Ming Fang, Ronghai Yu, Jianglan Shui, Xiaofang Liu
Journal of Materials Science & Technology ( IF 11.2 ) Pub Date : 2024-11-28 , DOI: 10.1016/j.jmst.2024.10.039 Chunyan Chen, Xufeng Li, Peng Yi, Zhi Geng, Haihan Zou, Gao Deng, Ming Fang, Ronghai Yu, Jianglan Shui, Xiaofang Liu
Electromagnetic interference (EMI) shielding materials with adaptive strain capability have broad applications in wearable electronic devices. However, as an important candidate, compressible conductive foam generally suffers from a reduction in EMI shielding performance during compression, which limits its application. Here, a compressible conductive aerogel with a unique conductive compensation effect is designed to solve this problem. CuS microspheres with metal-like conductivity serve as conductive compensation sites, and are chemically embedded in the skeletons of lamellar-structured carboxymethylcellulose (CMC)/MXene aerogel through Cu–S−Ti−C chemical bonds. The incorporation of CuS induces circularly-distributed interfacial polarization to enhance the attenuation of EM waves. More importantly, these CuS microspheres act as interlayer bridges to connect the upper and lower MXene/CMC layers during compression, thereby establishing numerous conductive compensation paths to offset the negative effect of thickness reduction on shielding performance. The optimized CMC/MXene/CuS aerogel shows stable EMI shielding performance during compression, and maintains a high shielding effectiveness of 32.31 dB with increasing compressive strain. In addition, this composite aerogel exhibits good thermal insulation and sound absorption performances, achieving triple shielding functions against EM waves, heat and sound.
中文翻译:
将 CuS 微球化学包埋到 MXene 气凝胶中,实现电磁波、热和声音的应变适应性三重屏蔽
具有自适应应变能力的电磁干扰 (EMI) 屏蔽材料在可穿戴电子设备中具有广泛的应用。然而,作为重要的候选者,可压缩导电泡沫在压缩过程中通常会降低 EMI 屏蔽性能,从而限制其应用。在这里,设计了一种具有独特导电补偿效果的可压缩导电气凝胶来解决这个问题。具有类似金属导电性的 CuS 微球用作导电补偿位点,并通过 Cu-S-Ti-C 化学键化学嵌入层状结构的羧甲基纤维素 (CMC)/MXene 气凝胶的骨架中。CuS 的掺入诱导圆分布界面极化,以增强电磁波的衰减。更重要的是,这些 CuS 微球充当层间桥梁,在压缩过程中连接上下 MXene/CMC 层,从而建立许多导电补偿路径,以抵消减薄对屏蔽性能的负面影响。优化的 CMC/MXene/CuS 气凝胶在压缩过程中表现出稳定的 EMI 屏蔽性能,并在压缩应变增加时保持 32.31 dB 的高屏蔽效果。此外,这种复合气凝胶具有良好的隔热和吸音性能,实现了对电磁波、热量和声音的三重屏蔽功能。
更新日期:2024-11-28
中文翻译:
将 CuS 微球化学包埋到 MXene 气凝胶中,实现电磁波、热和声音的应变适应性三重屏蔽
具有自适应应变能力的电磁干扰 (EMI) 屏蔽材料在可穿戴电子设备中具有广泛的应用。然而,作为重要的候选者,可压缩导电泡沫在压缩过程中通常会降低 EMI 屏蔽性能,从而限制其应用。在这里,设计了一种具有独特导电补偿效果的可压缩导电气凝胶来解决这个问题。具有类似金属导电性的 CuS 微球用作导电补偿位点,并通过 Cu-S-Ti-C 化学键化学嵌入层状结构的羧甲基纤维素 (CMC)/MXene 气凝胶的骨架中。CuS 的掺入诱导圆分布界面极化,以增强电磁波的衰减。更重要的是,这些 CuS 微球充当层间桥梁,在压缩过程中连接上下 MXene/CMC 层,从而建立许多导电补偿路径,以抵消减薄对屏蔽性能的负面影响。优化的 CMC/MXene/CuS 气凝胶在压缩过程中表现出稳定的 EMI 屏蔽性能,并在压缩应变增加时保持 32.31 dB 的高屏蔽效果。此外,这种复合气凝胶具有良好的隔热和吸音性能,实现了对电磁波、热量和声音的三重屏蔽功能。