Developing electronic packaging materials with both outstanding electromagnetic wave (EMW) absorption and efficient heat dissipation is crucial for addressing vital issues of electromagnetic interference and heat accumulation in modern integrated circuits. Herein, we present a graphene-epoxy composite with dual-function of excellent microwave absorption and efficient heat dissipation as a promising candidate. The composite was fabricated by immersing epoxy resin into graphene aerogel (GA) with precisely controlled directional pores. Before immersion, the GA was annealed at temperatures from 600 to 3000 °C to investigate the influence of oxygen content and defects in the graphene on wave absorbing and heat dissipating properties of the graphene-epoxy composite. The composite with the GA annealed at 1200 °C exhibits a minimum reflection loss of −35.67 dB at a frequency of 8.80 GHz with a sample thickness of 2.0 mm, and the thermal conductivity is 0.69 W m−1 K−1, 283 % improvement over the epoxy matrix. Furthermore, the composite with the GA annealed at 2500 °C demonstrates an impressive absorption bandwidth (7.76 GHz) spanning from 10.24 to 18.00 GHz (covering a part of X-band and all the Ku-band) with a sample thickness of 3.0 mm, and the thermal conductivity is 6.81 W m−1 K−1, 3683 % improvement over the matrix. The graphene-epoxy composite exhibits excellent EMW absorption performance and high thermal conductivity, highlighting promising applications as electronic packaging material in high-power integrated circuits.

中文翻译：

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石墨烯-环氧树脂复合材料，具有优异的微波吸收和高效散热的双重功能


开发具有出色电磁波 （EMW） 吸收和高效散热的电子封装材料，对于解决现代集成电路中电磁干扰和热量积累等重要问题至关重要。在此，我们提出了一种具有优异微波吸收和高效散热双重功能的石墨烯-环氧树脂复合材料，作为一种有前途的候选者。通过将环氧树脂浸入具有精确控制定向孔的石墨烯气凝胶 （GA） 中来制备复合材料。浸泡前，GA 在 600 至 3000 °C 的温度下退火，以研究石墨烯中的氧含量和缺陷对石墨烯-环氧树脂复合材料的吸波和散热性能的影响。在 1200 °C 下退火的 GA 复合材料在 8.80 GHz 频率下表现出 -35.67 dB 的最小反射损失，样品厚度为 2.0 mm，热导率为 0.69 W m-1 K-1，比环氧树脂基体提高了 283%。此外，在 2500 °C 下退火的 GA 复合材料表现出令人印象深刻的吸收带宽 （7.76 GHz），范围从 10.24 到 18.00 GHz（覆盖部分 X 波段和所有 Ku 波段），样品厚度为 3.0 mm，热导率为 6.81 W m-1 K-1，比基体提高了 3683%。石墨烯-环氧树脂复合材料表现出优异的 EMW 吸收性能和高导热性，在高功率集成电路中作为电子封装材料的应用前景广阔。