Chemical metallization (e.g., chemical/electrical plating) of the polymer surface is an extremely important, convenient, cost-effective, and broadly applied strategy to realize combined advantages of functional metals and polymers for today’s industry. However, traditional chemical and electrical metallization of polymer surfaces requires the participation of physical methods, which greatly constrains the utilization of versatile metals in modern electronics. This work successfully utilized a traditional chemical strategy to address the challenging preliminary conductivity and subsequent liquid metal (LM) metallization of insulated polymer surfaces. Through the facile strategy, an ultrathin (6 μm) LM film could be conveniently coated on both the external and internal surface of polymers to fabricate large-area flexible circuits with fine line width (15 μm) at low-cost (9.5 $·dm^–2). A detailed reaction mechanism of the LMs was reported, and various chemical parameters of the metallization were thoroughly investigated. Interestingly, the metallized polymer surface showed a distinguished CuGa₂/Ga biphasic structure of the LMs, which enabled the polymer as an extraordinarily soft conductor with ultrahigh uniaxial strain (>1200%), extremely low resistance variation (R/R₀ < 7), strong metal–polymer adhesion (1.5 N·mm^–1), and excellent electrical durability. Furthermore, with the benefit of the photolithography technique, precisely designed circuits could be achieved, and wireless transmission/control soft electronic devices were easily fabricated.

中文翻译：

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具有双相液态金属的聚合物表面向软电路的可控和简便金属化


聚合物表面的化学金属化（例如，化学/电气电镀）是一种极其重要、方便、经济高效且应用广泛的策略，可以实现当今工业中功能性金属和聚合物的综合优势。然而，聚合物表面的传统化学和电气金属化需要物理方法的参与，这极大地限制了现代电子产品中多功能金属的使用。这项工作成功地利用传统的化学策略来解决绝缘聚合物表面具有挑战性的初步导电性和随后的液态金属 （LM） 金属化问题。通过简单的策略，可以方便地将超薄 （6 μm） LM 薄膜涂布在聚合物的外表面和内表面，以低成本 （9.5 $·dm^–2） 制造具有细线宽 （15 μm） 的大面积柔性电路。报道了 LMs 的详细反应机理，并彻底研究了金属化的各种化学参数。有趣的是，金属化聚合物表面显示出 LMs 的显著 CuGa₂/Ga 双相结构，这使得聚合物成为一种非常柔软的导体，具有超高的单轴应变 （>1200%）、极低的电阻变化 （R/R₀ < 7）、强金属-聚合物粘附力 （1.5 N·mm^–1）和出色的电气耐久性。此外，借助光刻技术的优势，可以实现精确设计的电路，并且很容易制造无线传输/控制软电子设备。