Cyanate ester resin (CE), a high-performance and low dielectric materials, was modified with amino hollow silica (HSMs-NH₂) and polyimide resin (PI) to form an IPN structure. Reducing the crosslinking density of the composite system and accompanying with its steric hindrance effect, PI increased the free volume of the composite material. The hollow structure introduced by HSMs-NH₂ further enhanced a low dielectric property. IPN structure and HSMs-NH₂ also significantly improved the impact toughness of HSMs-NH₂/PI/CE composites. The bonding between the Si–O–Si and HSMs-NH₂ offered an excellent heat resistance and as well surface bonding capability to matrix, which reduced the decomposition and effectively improved their thermal stability. Simultaneously, profited by the hydrophobicity of Si–O–Si, HSMs-NH₂/PI/CE composite materials enabled to keep low dielectric properties in humid environments.

中文翻译：

---

空心二氧化硅和聚酰亚胺改性氰酸酯纳米多孔和IPN结构复合材料


氰酸酯树脂 （CE） 是一种高性能、低介电材料，与氨基空心二氧化硅 （HSMs-NH₂） 和聚酰亚胺树脂 （PI） 改性，形成 IPN 结构。PI 降低了复合体系的交联密度并伴随着其空间位阻效应，增加了复合材料的自由体积。HSMs-NH₂ 引入的空心结构进一步增强了低介电性能。IPN 结构和 HSMs-NH₂ 也显著提高了 HSMs-NH₂/PI/CE 复合材料的冲击韧性。Si-O-Si 和 HSMs-NH₂ 之间的键合提供了优异的耐热性和与基体的表面键合能力，从而减少了分解并有效提高了它们的热稳定性。同时，受益于 Si-O-Si 的疏水性，HSMs-NH₂/PI/CE 复合材料能够在潮湿环境中保持低介电性能。