Soldering of ceramics/metals using an inactive commercial solder with the advantage of low cost has wide application prospects. The dissolution behavior of base metal could not be quantified, which has been a basic issue for the joining design. This work investigated the dissolution of the solid Al in liquid Sn with and without the ultrasound. The physical model for the dissolving process was established based on the experiments. The relationship equation of the average concentration of Al (Ca) and soldering time was derived by using the Nernst-Brunner principle. The key parameters of limiting solubility (C0L) and dissolution rate constant (K) were obtained through dissolving experiments of liquid Sn to solid Al. The calculation results show that the effect of soldering temperature, and thickness Sn layer on the Al concentration (Ca) and dissolution rate (dCa/dt) under ultrasound is weaker than that without ultrasound. Compared to the condition without ultrasound, the value K, the maximum value of Ca and dCa/dt was increased by 5.8 times, 4.5 times, and 52 times at 250 °C under the ultrasound action, respectively, and the activation energy of dissolution was reduced by 41 %. The mechanism of ultrasonically accelerating dissolution of the solid Al by the liquid Sn has been revealed by using the bubble dynamics principle. It will provide a guideline for the design of soldering ceramics/metals using an inactive commercial solder.

中文翻译：

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焊接过程中固体 Al 在液态 Sn 中的超声溶解：建模和方程、趋势预测、加速效应


使用非活性商业焊料焊接陶瓷/金属具有低成本的优点，具有广泛的应用前景。贱金属的溶解行为无法量化，这一直是连接设计的基本问题。这项工作研究了固体 Al 在有和没有超声的情况下在液态 Sn 中的溶解。根据实验建立了溶解过程的物理模型。利用 Nernst-Brunner 原理推导了 Al （Ca） 平均浓度与焊接时间的关系方程。通过液体 Sn 对固体 Al 的溶解实验，得到极限溶解度 （C0L） 和溶出速率常数 （K） 等关键参数。计算结果表明，超声下焊接温度和Sn层厚度对Al浓度（Ca）和溶解速率（dCa/dt）的影响弱于无超声。与无超声条件相比，在超声作用下，250 °C 时 K、Ca 和 dCa/dt 的最大值分别增加了 5.8 倍、4.5 倍和 52 倍，溶出活化能降低了 41 %。利用气泡动力学原理揭示了液体 Sn 以超声波加速固体 Al 溶解的机制。它将为使用非活性商业焊料焊接陶瓷/金属的设计提供指南。