Microbial induced concrete corrosion (MICC) is the main deterioration mode of concrete corrosion in concrete wastewater transportation system. Protective coating is one of the commonly used microbial corrosion protection technologies for concrete. In this study, the effects of CuSO4 concentration and pH value of electroless plating solution on the preparation of copper-plated hardened cement paste (HCP) were investigated, and the antibacterial properties of HCP surface were optimized by electroless copper plating. The main components of the coating were copper and its oxide particles. When HCP was plated at the CuSO4 concentration of 10 g/L, the copper coating with high mass gain (0.3 %) and Vickers hardness (212.0 HV) was obtained. In addition, cubic copper structure constituted a compact copper coating HCP. The plating solution with pH of 9 was helpful to obtain the best quality gain and Vickers hardness of the coating. The microscopic morphology analysis showed that the coating had a relatively dense structure. Besides, antibacterial test indicated that copper-plated HCP had a significant improvement in antibacterial performance.

中文翻译：

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CuSO4 含量和 pH 值对镀铜水泥基材料力学性能和抗菌能力的影响


微生物诱导混凝土腐蚀 （MICC） 是混凝土废水输送系统中混凝土腐蚀的主要劣化模式。保护涂层是混凝土常用的微生物腐蚀保护技术之一。本研究研究了化学镀液中CuSO4浓度和pH值对镀铜硬化水泥浆（HCP）制备的影响，并通过化学镀铜优化了HCP表面的抑菌性能。涂层的主要成分是铜及其氧化物颗粒。当 CuSO4 浓度为 10 g/L 的 HCP 电镀时，获得了具有高质量增益 （0.3 %） 和维氏硬度 （212.0 HV） 的铜涂层。此外，立方铜结构构成了致密的铜涂层 HCP。pH 值为 9 的电镀溶液有助于获得涂层的最佳质量增益和维氏硬度。微观形貌分析表明，涂层具有相对致密的结构。此外，抗菌测试表明，镀铜 HCP 的抗菌性能有显着改善。