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Characterization of Multiple Commercial Sintered-silver Pastes as Die Attachment for Power Electronics Packaging: Materials, Processing, and Properties
IEEE Journal of Emerging and Selected Topics in Power Electronics ( IF 4.6 ) Pub Date : 2024-11-11 , DOI: 10.1109/jestpe.2024.3495815 Meiyu Wang, Haobo Zhang, Xiaona Du, Haidong Yan, Weibo Hu, Yunhui Mei
中文翻译：
作为电力电子封装芯片附件的多种商业烧结银浆的表征：材料、加工和性能
更新日期：2024-11-11
IEEE Journal of Emerging and Selected Topics in Power Electronics ( IF 4.6 ) Pub Date : 2024-11-11 , DOI: 10.1109/jestpe.2024.3495815 Meiyu Wang, Haobo Zhang, Xiaona Du, Haidong Yan, Weibo Hu, Yunhui Mei
中文翻译：
作为电力电子封装芯片附件的多种商业烧结银浆的表征：材料、加工和性能
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